• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.29 no.1
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• pp.1-8
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• 2015

To produce the white light, there are a single chip method using the blue light and phosphor coating, a multi chip method by mixing R, G, B light.. Multi chip method is proper for the smart lighting system by controling color and color temperature. And color rendering of single chip LED is good by even spectral distribution. To apply application technic like smart light system, this paper analyzed the properties of single chip LED and RGB multi chip LED, and implemented the 2 part subject evaluation for single chip LED and RGB multi chip LED. The first part is comparison of properties for single chip LED and RGB multi chip and second part is color appearance evaluation of 8 colors in each lighting environment.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.25 no.12
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• pp.34-41
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• 2011

In order to understand the thermal performance of each LED chips in multi-chip LED package, a quantitative parametric analysis of the temperature evolution was investigated by thermal transient analysis. TSP (Temperature Sensitive Parameter) value was measured and the junction temperature was predicted. Thermal resistance between the p-n junction and the ambient was obtained from the structure function with the junction temperature evolution during the cooling period of LED. The results showed that, the thermal resistance of the each LED chips in 4 chip-LED package was higher than that of single chip- LED package.

• The Transactions of the Korean Institute of Electrical Engineers P
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• v.58 no.2
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• pp.142-147
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• 2009

Conventional HP(high pressure) sodium or Metal-halide lamps have a life span of around one year requiring at least annual replacement and maintenance. High Power LED lights require no regular maintenance further increasing savings on replacement bulbs, access equipment and labour costs. New installations benefit from a substantial reduction in the cost of expensive heavy duty cable required for sodium lighting. Especially, LED light can achieve variable color temperature, high functional performance in the field of street light. There are two main method to achieve variable color temperature function of the street light. one method is using RGB multi-chip LED, the other is using Orange-White LED method. In this paper, it was compare RGB Multi-chip LED with white-orange LED for there characteristics performance.

• Current Optics and Photonics
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• v.4 no.3
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• pp.247-252
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• 2020

Important determinants for selecting outdoor lighting are the color-rendering index (CRI) and scotopic-to-photopic (S/P) ratio of the lighting units. The higher the S/P ratio, the better energy savings and visual performance. In this study, CCT-tunable LED lighting units were optimized and fabricated by spectral combination of red, green, blue, and yellow LEDs. The measured results for RGB LEDs provided S/P ratios of 1.55~2.58 and those of RGBY LEDs gave 1.46~2.46 to the correlated color temperatures (CCTs) ranging from 2700 K to 6500 K, with CRI values of over 80 at the same time.

• Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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• 2006.05a
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• pp.154-156
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• 2006

A few ten mW white LED can substitute for the indicator light source and it is required to study several watt multi-chip semiconductor light sources in order to replace the light sources for general illumination such as incandescent lights and fluorescent lanes. Since the optical technology used for several mW white LED light source uses only 30% to 52% of the light it is required to develop the design technology of optical system and lens to improve the efficiency more than 80% for insuring the high power of white LED. In this paper, we designed and fabricated new structure reflector to increase the efficiency and is easy to make high power multi-chip LED lamp.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.28 no.7
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• pp.1-12
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• 2014

This paper is proposed to design the new heat-sink apparatus for improving the heat transfer characteristics in the power LED chip, and results of the operation characteristics were discussed. The core design is that the soldering through-hole on the FR-4 PCB board is formed to the effective heat transfer. That is directly filled with Ag-nano materials, which shows the high thermal conductivity. The heat transfer medium consisting of Ag-nano materials is classified into two structures. Mediums are called as the heat slug and the multi-pin in this work. The heat of the high temperature generated from the LED chip was directly transferred to the heat slug of the one large size. And the accumulated heat from the heat slug was quickly dissipated by the medium of the multi-pin, which is the same body with the heat slug. This multi-pin was designed for the multi-dissipation of heat by increasing the surface areas with a little pins. Subsequently, the speed of the heat transfer with this new heat-sink apparatus is three times faster than the conventional heat-sink. Therefore, the efficiency of the illuminating light will be improved by adapting this new heat-sink apparatus in the large area's LED.

• Journal of Electrical Engineering and Technology
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• v.12 no.4
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• pp.1593-1599
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• 2017

This paper presents a multi-channel light-emitting diode (LED) driver IC with a current-mode current regulator. The proposed current regulator replaces resistors for current sensing with a sequentially controlled single current sensor and a single regulation loop for sensing and regulating all LED channel currents. This minimizes the current mismatch among the LED channels and increases voltage headroom or, equivalently, power efficiency. The proposed LED driver IC was fabricated in a $0.35-{\mu}m$ BCD 60-V high voltage process, and the chip area is $1.06mm^2$. The measured maximum power efficiency is 93.4 % from a 12-V input, and the inter-channel current error is smaller than as low as ${\pm}1.3%$ in overall operating region.

• Proceedings of the Korea Society for Energy Engineering kosee Conference
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• 2004.11a
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• pp.257-262
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• 2004

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.531-531
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• 2012

So many groups have been researching the green quantum dots such as InP, InP/ZnS for overcoming the semiconductor nanoparticles composed with heavy metals like as Cd and Pb so on. In spite of much effort to keep up CdSe quantum dots, it does not reach the good properties compared with CdSe/ZnS quantum dots. This quantum dot has improved its properties through the generation of core/shell CdSe/ZnS structure or core/multi-shell structures like as CdSe/CdS/ZnS and CdSe/CdS/ CdZnS/ZnS. In this research, we try to synthesize the InP multi-shell structure by the successiveion layer absorption reaction (SILAR) in the one pot. The synthesized multi-shell structure has improved quantum yield and photo-stability. To generate white light, highly luminescent InP multi-shell quantum dots were mixed with yellow phosphor and integrated on the blue LED chip. This InP multi-shell improved red region of the LEDs and generated high CRI.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.16 no.3
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• pp.50-55
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• 2007

The purpose of this research is to enhance the luminance of the LED and to improve the implementation of color by mounting an array lens on the LED without special technology in process. The workmanship of key components considering the economical efficiency and the injection molding technology for high quality of the product are essential to achieve it. In this paper, the mold was computer-aided was designed and manufactured by CAM software (NX4) and high speed machining center. the applied final machining conditions were 3,000-5,000mm/min feed speed, 15,000-25,000rpm and ${\Phi}0.3mm$ ball end-mill. And the Flow analysis was performed using the mold flow software(MPI) in order to get uniformity of resin. Injection conditions acquired by the flow analysis and the injection experiment are as follows. The cylinder temperature is $220-260^{\circ}C$, the mold temperature is $70-80^{\circ}C$, the injection time is about 1.2sec, the injection pressure and velocity is each 7.8-14.7Mpa, and the injection velocity is 0.8-1.2m/sec.