• Title/Summary/Keyword: Multi module

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RF Front-End Module Design of UWB Radars for Vehicle (차량용 UWB 레이더의 RF front-end 모듈 설계)

  • Park, Chi-Ho;Kim, Tae-Gyu
    • Journal of the Institute of Electronics Engineers of Korea TC
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    • v.45 no.11
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    • pp.61-68
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    • 2008
  • In this paper, we propose a RF front-end developments for vehicle UWB radar systems. UWB systems have a very narrow pulse width that is below 1ns. Therefore, UWB is designed to have broadband quality of low power several GHz and must coexist with the radio communication system. UWB's advantages include high channel capacity and data rate, because precise resolution for multi-path can easily position estimate and Rake receiver. Also, UWB has low interference because it displays broadband quality of low power. Positioning is made possible by short range accuracy, which can reduce the expense of system design. An RF front-end module is designed using the DCR(Direct ConveRsion) method and is composed in RF for vehicles at a low-cost.

LTCC기술을 활용한 VCO모듈

  • 이영신;유찬세;이우성;강남기
    • The Proceeding of the Korean Institute of Electromagnetic Engineering and Science
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    • v.12 no.3
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    • pp.12-24
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    • 2001
  • The key advantage of LTCC(low temperature co-fired ceramics) technology is the ability to integrate passive components such as resistors, capacitors, and inductors. More compact circuits with an increased scale of integration are needed with the development for advanced telecommunication system such as IMT-2000. LTCC technology can be obtained by removing these elements from the substrate surface to inside of ceramic body. And it can miniaturize the wireless phone through integration of planar patch antenna, duplexer, band pass filter, bias line, circuit of impedance matching and RF choke etc. Futhermore, with the multilayer chip process and its outstanding electrical material characteristics, LTCC is predestined for highly-integrated, cost effective wide band applications. This paper focuses on the general description of LTCC MCM technologies and the fabrication of the multilayer VCO module.

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A Fully-Integrated Penta-Band Tx Reconfigurable Power Amplifier with SOI CMOS Switches for Mobile Handset Applications

  • Kim, Unha;Kang, Sungyoon;Kim, Junghyun;Kwon, Youngwoo
    • ETRI Journal
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    • v.36 no.2
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    • pp.214-223
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    • 2014
  • A fully-integrated penta-band reconfigurable power amplifier (PA) is developed for handset Tx applications. The output structure of the proposed PA is composed of the fixed output matching network, power and frequency reconfigurable networks, and post-PA distribution switches. In this work, a new reconfiguration technique is proposed for a specific band requiring power and frequency reconfiguration simultaneously. The design parameters for the proposed reconfiguration are newly derived and applied to the PA. To reduce the module size, the switches of reconfigurable output networks and post-PA switches are integrated into a single IC using a $0.18{\mu}m$ silicon-on-insulator CMOS process, and a compact size of $5mm{\times}5mm$ is thus achieved. The fabricated W-CDMA PA module shows adjacent channel leakage ratios better than -39 dBc up to the rated linear power and power-added efficiencies of higher than around 38% at the maximum linear output power over all the bands. Efficiency degradation is limited to 2.5% to 3% compared to the single-band reference PA.

Real Time Linux System Design (리얼 타임 리눅스 시스템 설계)

  • Lee, Ah Ri;Hong, Seon Hack
    • Journal of Korea Society of Digital Industry and Information Management
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    • v.10 no.2
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    • pp.13-20
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    • 2014
  • In this paper, we implemented the object scanning with nxtOSEK which is an open source platform. nxtOSEK consists of device driver of leJOS NXJ C/Assembly source code, TOPPERS/ATK(Automotive real time Kernel) and TOPPERS/JSP Real-Time Operating System source code that includes ARM7 specific porting part, and glue code make them work together. nxtOSEK can provide ANSI C by using GCC tool chain and C API and apply for real-time multi tasking features. We experimented the 3D scanning with ultra sonic and laser sensor which are made directly by laser module diode and experimented the measurement of scanning the object by knowing x, y, and z coordinates for every points that it scans. In this paper, the laser module is the dimension of $6{\times}10[mm]$ requiring 5volts/5[mW], and used the laser light of wavelength in the 650[nm] range. For detecting the object, we used the beacon detection algorithm and as the laser light swept the objects, the photodiode monitored the ambient light at interval of 10[ms] which is called a real time. We communicated the 3D scanning platform via bluetooth protocol with host platform and the results are displayed via DPlot graphic tool. And therefore we enhanced the functionality of the 3D scanner for identifying the image scanning with laser sensor modules compared to ultra sonic sensor.

Development of Performance Evaluation System for the High Speed EFEM (고속 EFEM의 성능평가시스템 개발)

  • Cho, Jeong-Hwan;Roh, Hee-Jung
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.24 no.2
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    • pp.27-32
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    • 2010
  • This paper suggests the new performance evaluation system which is suitable for high speed EFEM(Equipment Front End Module) device using a semiconductor process. An EFEM consisting of multi-joint robots is the mainstay of semiconductor automation, shuffling silicon wafers or quartz photo-masks between ultra-clean storage carriers and a variety of processing, measurement and testing systems. The theoretical and experimental studies for the development of performance evaluation system have been carried out. The presented results from the above investigation show considerably developed performance evaluation system for the high speed EFEM Especially, it is efficient for prepareing the WTO/TBT(Technical Barriers to Trade) Agreement and the PL(Product Liability) law.

유비쿼터스 DSS 포털을 위한 지능형 온톨로지 관리 시스템;u-Fulfillment 도메인 중심

  • Lee, Hyeon-Jeong;Lee, Geon-Chang;Son, Mi-Ae
    • Proceedings of the Korea Inteligent Information System Society Conference
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    • 2007.05a
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    • pp.286-296
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    • 2007
  • 본 연구에서는 유비쿼터스 환경에서 시시각각으로 변하는 고객의 요구사항을 만족시키기 위해 상호 협력을 시도하는 다중 에이전트들이 의사결정을 수행할 경우 발생할 수 있는 충돌의 해결을 지원하는 지능적인 온톨로지 관리 모듈(intelligent-Ontology Management Module, i-OMM)과 다중에이전트 관리 모듈(Multi-agent Coordination Module, MACM)을 포함하는 u-DSS 포털을 제안한다. 개별 에이전트들은 온톨로지와 문제해결을 위한 프로시저 등을 이용해 자신의 문제를 해결하는 것을 기본으로 한다. 그러나 다른 에이전트들과 협력을 통해 문제를 해결해야 할 경우에는 먼저 개별 에이전트들이 보유한 각 온톨로지의 통합 및 데이터간의 충돌 해결이 요구된다. i-OMM은 개별 에이전트들이 보유하고 있는 이질적인 온톨로지를 통합하여, 문제해결을 위한 하나의 통합된 새로운 동적 온톨로지 뷰(integrated ontology view, IOV)의 생성을 지원한다. 온톨로지 통합과제에서 생성된 IOV는 사례로 저장되고 유사한 문제 해결에 재사용된다. MACM은 고객 에이전트들의 요구사항 변화에 따라 관련 개별 에이전트들 간의 데이터 충돌을 해결하여 에이전트들의 의사결정과정을 지원한다. 따라서 i-OMM과 MACM을 이용한 유비쿼터스 컴퓨팅 환경에서 분산된 에이전트들의 협력적 문제 해결을 지원하는 시스템을 유비쿼터스 의사결정지원 시스템 포탈(ubiquitous decision support system, u-DSS Portal)이라고 지칭한다. 본 연구에서 제안된 알고리즘의 활용 대상은 고객, 판매자, 제조업체, 및 배송업체의 배송차량들의 에이전트들로 구성된 u-fulfillment 시스템으로 한다.

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An Integrated CAD/CAM System for CNG Pressure Vessel Manufactured by Deep Drawing and Ironing Operation

  • Park, Joon-Hong;Kim, Chul;Park, Jae-Chan
    • Journal of Mechanical Science and Technology
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    • v.18 no.6
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    • pp.904-914
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    • 2004
  • The fiber reinforced composite material is widely used in the multi-industrial field because of their high specific modulus and specific strength. It has two main merits which are to cut down energy by reducing weight and to prevent explosive damage proceeding to the sudden bursting which is generated by the pressure leakage condition. Therefore, Pressure vessels using this composite material can be applied in the field such as defence industry and aerospace industry. In this paper, for nonlinear finite element analysis of E-glass/epoxy filament winding of composite vessel subjected to internal pressure, the standard interpretation model is developed by using the ANSYS with AutoLISP and ANSYS APDL languages, general commercial software, which is verified as useful characteristic of the solution. Among the modules of the system, both the process planning module for carrying out the process planning of filament wound composite pressure vessel and the autofrettage process module for obtaining higher residual stress will minimize trial and error and reduce the period for developing new products. The system can serve as a valuable system for experts and as a dependable training aid for beginners.

QualNet based Linked Simulation Method for WAVE Physical Layer (QualNet 기반의 WAVE 물리계층 연동 시뮬레이션 방안)

  • Kwak, Jae-Min;Park, Kyung-Won
    • Journal of Advanced Navigation Technology
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    • v.13 no.3
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    • pp.351-357
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    • 2009
  • In this paper, we studied an efficient inter-working method in which QualNet network simulator can import WAVE channel model and physical layer simulation module pre-designed by Matlab tool. At first, we investigated physical layer and communication medium simply designed in QualNet, then we suggested practical method for QualNet network simulator to adopt different type of physical layer simulation module in which detailed multi-path fading channel model and IEEE802.11p communication modem are designed. This work should be applied to linked simulation between upper layer and lower physical layer for total simulation from higher layer to lower physical layer related to next generation DSRC/WAVE specification.

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Experimental Investigations for Thermal Mutual Evaluation in Multi-Chip Modules

  • Ayadi, Moez;Bouguezzi, Sihem;Ghariani, Moez;Neji, Rafik
    • Journal of Power Electronics
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    • v.14 no.6
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    • pp.1345-1356
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    • 2014
  • The thermal behavior of power modules is an important criterion for the design of cooling systems and optimum thermal structure of these modules. An important consideration for high power and high frequency design is the spacing between semiconductor devices, substrate structure and influence of the boundary condition in the case. This study focuses on the thermal behavior of hybrid power modules to establish a simplified method that allows temperature estimation in different module components without decapsulation. This study resulted in a correction of the junction temperature values estimated from the transient thermal impedance of each component operating alone. The corrections depend on mutual thermal coupling between different chips of the hybrid structure. A new experimental technique for thermal mutual evaluation is presented. Notably, the classic analysis of thermal phenomena in these structures, which was independent of dissipated power magnitude and boundary conditions in the case, is incorrect.

Header Data Interpreting S/W Design for MSC(Multi-Spectral Camera) image data

  • Kong Jong-Pil;Heo Haeng-Pal;Kim YoungSun;Park Jong-Euk;Youn Heong-Sik
    • Proceedings of the KSRS Conference
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    • 2004.10a
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    • pp.436-439
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    • 2004
  • Output data streams of the MSC contain flags, Headers and image data according to the established protocols and data formats. Especially the Header added to each data lines contain information of a line sync, a line counter and, ancillary data which consist of ancillary identification bit and one ancillary data byte. This information is used by ground station to calculate the geographic coordinates of the image and get the on-board time and several EOS(Electro-Optical Subsystem) parameters used at the time of imaging. Therefore, the EGSE(Electrical Ground Supporting Equipment) that is used for testing MSC has to have functions of interpreting and displaying this Header information correctly following the protocols. This paper describes the design of the header data processing module which is in EOS­EGSE. This module provides users with various test functions such as header validation, ancillary block validation, line-counter and In-line counter validation checks which allow convenient and fast test on imagery data.

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