• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.11a
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• pp.67-67
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• 2002

패키지 기술의 개발은 저비용, 고성능, 높은 패키징 효율의 추세로 가고 있다. 이러한 추세에 따라 기판재료의 개발 및 구조의 변형이 요구된다. 패키지의 한 형태인 MCM(Multi-Chip Module)에 연성기판을 사용할 경우 fine pattern이 가능하고 부피가 작기 때문에 패키지의 효율이 좋고 또한 reel to reel process에 적용이 가능하기 때문에 대량생산의 이점을 가지고 있다. 연성기판은 좋은 전기적 특성을 가진 polyimide와 구리 층으로 구성된다. 그러나 polyimide와 구리 계층 사이에 약한 접착력과 구리로의 polyamic acid의 diffusion, 다층 기판의 제조의 어려움 등의 문제점을 남겨두고 있다. 본 연구는 일반적인 polyimide/copper가 구조가 가지고 있는 문제점을 해결하고 구리 패턴을 제작하기 위해 에칭을 쓰는 것을 배제함으로 fine pattern을 이루어 내었으며 전기도금으로 완전하게 채워진 pluged via을 사용함으로 각층간의 연결에 신뢰성을 부여하였다. 또한, 연성기판의 구조적인 문제점인 해결하여 다층 연성기판을 제조하려고 한다.

• Journal of Construction Engineering and Project Management
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• v.4 no.4
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• pp.33-40
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• 2014

Maximizing the profitability and minimizing the duration of construction projects in extreme weather regions is a challenging objective that is essential for project success. An optimization model is presented herein for the time-profit trade-off analysis of construction projects under extreme weather conditions. The model generates optimal/near optimal schedules that maximize profit and minimize the duration of construction projects in extreme weather regions. The computations in the model are organized into: (1) a scheduling module that develops practical schedules for construction projects, (2) a profit module that computes project costs (direct, indirect, and total) and project profit, and (3) a multi-objective module that determines optimal/near optimal trade-offs between project duration and profit. One example is used to show the impact of extreme weather on construction time and profit. Another example is used to show the model's ability to generate optimal trade-offs between the time and profit of construction projects under extreme weather conditions.

• Journal of the Korean Society for Precision Engineering
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• v.7 no.2
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• pp.95-104
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• 1990

This paper descirbes some research of Computer-aided Design of multi-stage cold forging die of rotationally symmetric parts produced by the press or former. An approach to the system is based on knowledge based system. Knowledges for tool design are extracted from the plasticity theory, handbooks, relevent references and empirical know-how of experts in cold forging companies. The deveoped system is composed of three main modules such as die design module, punch design module, tool elements design module which are sued independently or in all. Using this system, design parameters (types of dies, geometric shapes and dimensions of dies, types of punches, geometric shapes and dimensions of punches, geometric shapes and dimensions of tool elements) in each operation are determined and the output is generated in graphic form. The develpoed system, aids designer, provides powerful capability for designing dies, punches and tool elements.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.34 no.1
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• pp.44-49
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• 2021

Recently, infrared (IR) and near-infrared (NIR) light-emitting diodes (LEDs) were widely used for home medical applications owing to its low output power and wide exposed area for curing. For deep penetration of the light under the skin, multiple LEDs with wavelengths of 700~10,000 nm were located on a flexible printed circuit board. When multiple wavelengths of LEDs were soldered on a circuit board, the lifetime of LED module highly depends on LEDs with a short lifetime. The mean time to failure (MTTF) was able to calculate with the experimental results under high temperature and the Arrhenius model. The results of this study could help companies to approve the warranty of LED modules and its product.

• Journal of Power Electronics
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• v.13 no.2
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• pp.296-303
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• 2013

This paper proposes a high efficiency three-phase cascaded phase shifted H-bridge multi-level inverter without DC/DC converters for grid-tied multi string photovoltaic (PV) applications. The cascaded H-bridge topology is suitable for PV applications since each PV module can act as a separate DC source for each cascaded H-bridge module. The proposed phase shifted H-bridge multi-level topology offers advantages such as operation at a lower switching frequency and a lower current ripple when compared to conventional two level topologies. It is also shown that low ripple sinusoidal current waveforms are generated with a unity power factor. The control algorithm permits the independent control of each DC link voltage with a maximum power point for each string of PV modules. The use of the controller area network (CAN) communication protocol for H-bridge multi-level inverters, along with localized PWM generation and PV voltage regulation are implemented. It is also shown that the expansion and modularization capabilities of the H-bridge modules are improved since the individual inverter modules operate more independently. The proposed topology is implemented for a three phase 240kW multi-level PV power conditioning system (PCS) which has 40kW H-bridge modules. The experimental results show that the proposed topology has good performance.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.6
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• pp.774-782
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• 2004

This article presents a numerical and experimental investigation for the single-phase forced laminar convective heat transfer through arrays of micro-channels in micro heat exchangers to be used for cooling power-intensive semiconductor packages, especially the stacked multi-chip modules. In the numerical analysis, a parametric study was carried out for the parameters affecting the efficiency of heat transfer in the flow of coolants through parallel rectangular micro-channels. In the experimental study, the cooling performance of the micro heat exchanger was tested on prototypes of stacked multi-chip modules with difference channel dimensions. The simulation results and the experiment data were acceptably accordant within a wide range of design variations, suggesting the numerical procedure as a useful method for designing the cooling mechanism in stacked multi-chip packages and similar electronic applications.

• Journal of Advanced Marine Engineering and Technology
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• v.38 no.8
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• pp.1004-1009
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• 2014

The redundancy allocation problem has usually considered only the component redundancy at the lowest-level for the enhancement of system reliability. A system can be functionally decomposed into system, module, and component levels. Modular redundancy can be more effective than component redundancy at the lowest-level because in modular systems, duplicating a module composed of several components can be easier, and requires less time and skill. We consider a multi-level redundancy allocation problem in which all cases of redundancy for system, module, and component levels are considered. A tabu search of memory-based mechanisms that balances intensification with diversification via the short-term and long-term memory is proposed for its solution. To the best of our knowledge, this is the first attempt to use a tabu search for this problem. Our tabu search algorithm is compared with the previous genetic algorithm for the problem on the new composed test problems as well as the benchmark problems from the literature. Computational results show that the proposed method outstandingly outperforms the genetic algorithm for almost all test problems.

• Proceedings of the IEEK Conference
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• 2000.07a
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• pp.429-432
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• 2000

The new MPEG-4 video coding standard enables content-based functionalities. In order to support the philosophy of the MPEG-4 visual standard, each frame of video sequences should be represented in terms of video object planes (VOP’s). In other words, video objects to be encoded in still pictures or video sequences should be prepared before the encoding process starts. Therefore, it requires a prior decomposition of sequences into VOP’s so that each VOP represents a moving object. A parallel processing system is required an automatic segmentation to be processed in real-time, because an automatic segmentation is time consuming. This paper addresses the parallel processing: system for an automatic segmentation for separating moving object from the background in image sequences. The proposed parallel processing system comprises of processing elements (PE’s) and a multi-access memory system (MAMS). Multi-access memory system is a memory controller to perform parallel memory access with the variety of types: horizontal, vertical, and block access way. In order to realize these ways, a multi-access memory system consists of a memory module selection module, data routing modules, and an address calculation and routing module. The proposed system is simulated and evaluated by the CADENCE Verilog-XL hardware simulation package.

• The Transactions of the Korean Institute of Power Electronics
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• v.18 no.5
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• pp.458-465
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• 2013

This paper proposes a novel soft-switched auxiliary resonant circuit to provide a Zero-Voltage-Transition at turn-on for a conventional PWM boost converter in a PFC application. The proposed auxiliary circuit enables a main switch of the boost converter to turn on under a zero voltage switching condition and simultaneously achieves both soft-switched turn-on and turn-off. Moreover, for the purpose of an intelligent multi-chip power module fabrication, the proposed circuit is designed to satisfy several design constraints including space saving, low cost, and easy fabrication. As a result, the circuit is easily realized by a low rated MOSFET and a small inductor. Detail operation and the circuit waveform are theoretically explained and then simulation and experimental results are provided based on a 1.8 kW prototype PFC converter in order to verify the effectiveness of the proposed circuit.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.06a
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• pp.281-282
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• 2009