• Progress in Superconductivity and Cryogenics
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• v.6 no.4
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• pp.1-4
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• 2004

Three group samples with difference thickness of $CeO_2$ capping layer deposited by PLD were studied. Among them, one group $CeO_2$ films were deposited on stainless steel tape coated with IBAD- YSZ and $CeO_2$ buffer layer ($CeO_2$/IBAD-YSZ/SS); other two groups of $CeO_2 YSZ Y_2O_3$multi-layer were deposited on NiW substrates for fabrication of YBCO coated conductor through RABiTS approach. The pulsed laser deposition (PLD) and DC magnetron sputtering were employed to deposit these buffer layers. On the top of buffer layer, YBCO film was deposited by PLD. The effect of thickness of $CeO_2$ film on the texture of $CeO_2$ film and critical current density ($J_c$) of YBCO film were analyzed. For the case $CeO_2$ on $CeO_2$/IBAD-YSZ/SS, there was a self-epitaxy effect with the increase of $CeO_2$ film. For $YSZ/Y_2O_3$ NiW which was deposited by PLD or DC magnetron sputtering, there is not self-epitaxy effect. However, the capping layer of $CeO_2$ film deposited by PLD improved the quality of buffer layer for $YSZ/Y_2O_3$ which was deposited by DC magnetron sputtering, therefore increased the $J_c$ of YBCO film.

• Journal of the Korean Institute of Gas
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• v.15 no.1
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• pp.30-34
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• 2011

This paper presents a strength safety evaluation of composite pressure container for hydrogen fuel tanks with a storage capacity of 104 liter and 70MPa pressure. The carbon fiber composite container is manufactured by an aluminum liner of Al6061-T6 and composite multi-layers of hoop winding layer in circumferential direction, $12^{\circ}C$ inclined winding layer and $70^{\circ}C$winding layer in helical direction respectively. The FEM results on the strength safety of composite fuel tanks were evaluated with a criterion of design safety of US DOT-CFFC and KS B ISO 11119-2 codes. The FEM computed results indicate that the proposed design model of 104 liter composite container is safe based on two strength safety codes. But, the computed results of carbon fiber fuel tanks based on US DOT-CFFC code is safer compared with that of KS B ISO 11119-2. Thus the hydrogen gas pressure container of 70MPa may be evaluated and designed by US DOT-CFFC code for more strength safety.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.37 no.7
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• pp.683-693
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• 2013

In this study, the mixing characteristics in lid-driven cavity flows were studied numerically by using a hybrid lattice Boltzmann method (HLBM). First, we compared the numerical results from single-relaxation-time (LB-SRT) and multi-relaxation-time (LB-MRT) models to examine their reliability. In most of the cavity flow, the results from both the LB-SRT and the LB-MRT models were in good agreement with those using a Navier-Stokes solver for Re=100-5000. However, the LB-MRT model was superior to the LB-SRT model for the simulation of higher Reynolds number flows having a geometrical singularity with much lesser spatial oscillations. For this reason, the LB-MRT model was selected to study the mass transport in lid-driven cavity flows, and it was demonstrated that mass transport in the fluid was activated by a recirculation zone in the cavity, which is connected from the top to the bottom surfaces through two boundary layers. Various mixing characteristics such as the concentration profiles, mean Sherwood (Sh) numbers, and velocity were computed. Finally, the detailed transport mechanism and solutions for the concentration profile in the cavity were presented.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.320-320
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• 2014

Amorphous silicon alloy (a-Si) solar cells and modules have been receiving a great deal of attention as a low-cost alternate energy source for large-scale terrestrial applications. Key to the achievement of high-efficiency solar cells using the multi-junction approach is the development of high quality, low band-gap materials which can capture the low-energy photons of the solar spectrum. Several cell designs have been reported in the past where grading or buffer layers have been incorporated at the junction interface to reduce carrier recombination near the junction. We have investigated profiling the composition of the a-SiGe alloy throughout the bulk of the intrinsic material so as to have a built-in electrical field in a substantial portion of the intrinsic material. As a result, the band gap mismatch between a-Si:H and $a-Si_{1-x}Ge_x:H$ creates a barrier for carrier transport. Previous reports have proposed a graded band gap structure in the absorber layer not only effectively increases the short wavelength absorption near the p/i interface, but also enhances the hole transport near the i-n interface. Here, we modulated the GeH4 flow rate to control the band gap to be graded from 1.75 eV (a-Si:H) to 1.55 eV ($a-Si_{1-x}Ge_x:H$). The band structure in the absorber layer thus became like a U-shape in which the lowest band gap was located in the middle of the i-layer. Incorporation of this structure in the middle and top cell of the triple-cell configuration is expected to increase the conversion efficiency further.

• Journal of the Korea Institute of Building Construction
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• v.18 no.5
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• pp.463-469
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• 2018

A currently used roof green system with multi layers has a low constructability. Therefore a new integrated waterproof & root barrier sheet and roof green box unit system was developed using steel plate fixture and cone type fixture by electromagnetic induction heating method. This study was proceeded to evaluate adhesion performance of two types of fixtures on Engineering PE, TPO, PVC sheet in a normal condition, repeated heating and cooling condition. As a result, adhesion load on Engineering PE sheet showed the highest value. The adhesion loads of steel plate fixture showed higher value as heating temperature was getting higher. However adhesion loads of cone type fixture showed opposite tendency. Regarding to the test conditions, test results of normal condition, repeated heating and cooling condition showed same value. The cone type fixture using butyl tape showed 7 times lower adhesion load than that of cone type fixture using electromagnetic heating and 28% lower adhesion load in a repeated heating and cooling condition than a usual condition.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.29 no.2A
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• pp.214-217
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• 2004

In this paper, a Ka-band LTCC (low temperature co-fired ceramic) narrow bandpass filter (BPF) is firstly presented. This BPF shows very narrow 3dB fractional bandwidth of 4.5 ％ centered at 28.7㎓. The advantages of multi-layered LTCC technology such as high integration and vertical stacking capabilities were employed to design three-dimensional interdigital end-coupled embedded microstrip narrow BPF. The difficulties in controlling the precise distance between two adjacent resonators in LTCC end-coupled BPF were overcome by locating the resonators on different layers. The measured insertion loss is 3dB at 28.7㎓, pass band is from 27.9 ㎓ to 29.2 ㎓, and the return loss in the pass band is less than 10 dB.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07a
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• pp.88-91
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• 2003

Tungsten is widely used as a plug for the multi-level interconnection structures. However, due to the poor adhesive properties of tungsten (W) on $SiO_2$ layer, the Ti/TiN barrier layer is usually deposited onto $SiO_2$ for increasing adhesion ability with W film. Generally, for the W-CMP (chemical mechanical polishing) process, the passivation layer on the tungsten surface during CMP plays an important role. In this paper, the effect of oxidants controlling the polishing selectivity of W/Ti/TiN layer were investigated. The alumina ($Al_2O_3$) abrasive containing slurry with $H_2O_2$ as the oxidizer, was studied. As our preliminary experimental results, very low removal rates were observed for the case of no-oxidant slurry. This low removal rate is only due to the mechanical abrasive force. However, for Ti and TiN with $H_2O_2$ oxidizer, different removal rate was observed. The removal mechanism of Ti during CMP is mainly due to mechanical abrasive, whereas for TiN, it is due to the formation of metastable soluble peroxide complex.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.05c
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• pp.108-111
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• 2002

CIGS film has been fabricated on soda-lime glass, which is coated with Mo film. by multi-source evaporation process. The films has been prepared with thickness of 1.0 ${\mu}m$, 1.75${\mu}m$, 2.0${\mu}m$, 2.3${\mu}m$, and 3.0${\mu}m$. X-ray diffraction analysis with film thickness shows that CIGS films exhibit a strong (112) preferred orientation. Furthermore. CIGS films exhibited distinctly decreasing the full width of half-maximum and (112) preferred peak with film thickness. Also, The film's microstructure, such as the preferred orientation, the full width at half-maximum(FWHM), and the interplanar spacing were examined by X-ray diffraction. The preparation condition and the characteristics of the unit layers were as followings ; Mo back contact DC sputter, CIGS absorber layer : three-stage coevaporation, CdS buffer layer : chemical bath deposition, ZnO window layer : RF sputtering, $MgF_2$ antireflectance : E-gun evaporation

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 1999.10a
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• pp.56-56
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• 1999

For advanced TFT-LCD manufacturing processes, dry etching of thin-film layers(a-Si, $SiN_x$, SID & gate electrodes, ITO etc.) is increasingly preferred instead of conventional wet etching processes. To dry etch Al gate electrode which is advantageous for reducing propagation delay time of scan signals, high etch rate, slope angle control, and etch uniformity are required. For the Al gate electrode, some metals such as Ti and Nd are added in Al to prevent hillocks during post-annealing processes in addition to gaining low-resistivity($<10u{\Omega}{\cdot}cm$), high performance to heat tolerance and corrosion tolerance of Al thin films. In the case of AI-Nd alloy films, however, low etch rate and poor selectivity over photoresist are remained as a problem. In this study, to enhance the etch rates together with etch uniformity of AI-Nd alloys, magnetized inductively coupled plasma(MICP) have been used instead of conventional ICP and the effects of various magnets and processes conditions have been studied. MICP was consisted of fourteen pairs of permanent magnets arranged along the inside of chamber wall and also a Helmholtz type axial electromagnets was located outside the chamber. Gas combinations of $Cl_2,{\;}BCl_3$, and HBr were used with pressures between 5mTorr and 30mTorr, rf-bias voltages from -50Vto -200V, and inductive powers from 400W to 800W. In the case of $Cl_2/BCl_3$ plasma chemistry, the etch rate of AI-Nd films and etch selectivity over photoresist increased with $BCl_3$ rich etch chemistries for both with and without the magnets. The highest etch rate of $1,000{\AA}/min$, however, could be obtained with the magnets(both the multi-dipole magnets and the electromagnets). Under an optimized electromagnetic strength, etch uniformity of less than 5% also could be obtained under the above conditions.

• Composites Research
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• v.12 no.5
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• pp.98-109
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• 1999

An investigation has been performed to develop a nonlinear finire element method for the analysis of the long-term behavior of an artificial hip joint. The three dimensional multi-layered brick element is used to analyze the design performances of hip prodtheses with various materials and the thick laminated composite hip prostheses with various layup sequences. The used element can accommodate the varying material properties of the element and allow the ply-drop-off along the eleement edge. The nonlinear finite element analysis program has been verified by the comparison with the exact solution of the bean problem subjected to uniaxial loading. By using the program, the density changes and strength ratios of artificial hip joint are calculated according to the hip prosthesis materials and the layers of composite hip prosthesis. The numerical results are easily applied to evaluate design performances of a hip prosthesis, and decrease the difficulty and time of hip prosthesis design.