• 제목/요약/키워드: MuSI

검색결과 2,798건 처리시간 0.036초

Nanoindenter를 이용한 MEMS 제품의 기계적 특성 측정 (Nanoindentation Experiments on MEMS Device)

  • 한준희;박준협;김광석;이상율
    • 한국세라믹학회지
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    • 제40권7호
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    • pp.657-661
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    • 2003
  • 잉크젯 프린터 헤드용 기능성 막으로 많이 활용하고 있는 다층박막(SiO$_2$/poly-Si/SiN/SiO$_2$, 두께, 2.77 $\mu\textrm{m}$)과 다이아몬드 박막(두께, 1.6 $\mu\textrm{m}$)을 미소 외팔보($\mu$-CLB) 형태로 가공한 후 nanoindenter를 이용한 굽힘 시험 방법으로 탄성계수와 굽힘 강도를 측정하였으며 다층막을 이루는 박막 중 SiO$_2$ 박막(두께, 1 $\mu\textrm{m}$)과 SiN 박막(두께, 0.43 $\mu\textrm{m}$)의 탄성계수를 미소 외 팔보 굽힘 시험 방법과 nanoindentation 방법으로 측정한 후 그 결과를 비교하였다. 미소 외팔보 굽힘 시험방법으로 측정한 다층막의 탄성계수와 파괴강도는 외팔보의 폭이 18.5 $\mu\textrm{m}$에서 58.5 $\mu\textrm{m}$로 증가함에 따라 각각 68.08 ㎬과 2.495 ㎬에서 56.53 ㎬과 1.834 ㎬로 감소하였다. SiO$_2$ 박막의 탄성계수 측정값은 외팔보의 폭이 29.6$\mu\textrm{m}$ 와 59.5 $\mu\textrm{m}$ 범위에서 변하여도 영향을 받지 않고 68.16$\pm$0.942 ㎬이었으며, SiN 박막의 탄성계수는 215.45 ㎬이었다. Nanoindentation 방법으로 측정한 SiO$_2$ 박막과 SiN 박막의 탄성계수는 각각 98.78 ㎬, 219.38 ㎬이었다. 이 결과로부터 미소 외팔보 굽힘 시험방법으로 측정한 박막의 탄성계수가 nanoindentation 방법으로 측정한 탄성계수와 2% 미만의 차이를 보이며 일치함을 알 수 있었다.

Optimization of μc-SiGe:H Layer for a Bottom Cell Application

  • 조재현;이준신
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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    • pp.322.1-322.1
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    • 2014
  • Many research groups have studied tandem or multi-junction cells to overcome this low efficiency and degradation. In multi-junction cells, band-gap engineering of each absorb layer is needed to absorb the light at various wavelengths efficiently. Various absorption layers can be formed using multi-junctions, such as hydrogenated amorphous silicon carbide (a-SiC:H), amorphous silicon germanium (a-SiGe:H) and microcrystalline silicon (${\mu}c$-Si:H), etc. Among them, ${\mu}c$-Si:H is the bottom absorber material because it has a low band-gap and does not exhibit light-induced degradation like amorphous silicon. Nevertheless, ${\mu}c$-Si:H requires a much thicker material (>2 mm) to absorb sufficient light due to its smaller light absorption coefficient, highlighting the need for a high growth rate for productivity. ${\mu}c$-SiGe:H has a much higher absorption coefficient than ${\mu}c$-Si:H at the low energy wavelength, meaning that the thickness of the absorption layer can be decreased to less than half that of ${\mu}c$-Si:H. ${\mu}c$-SiGe:H films were prepared using 40 MHz very high frequency PECVD method at 1 Torr. SiH4 and GeH4 were used as a reactive gas and H2 was used as a dilution gas. In this study, the ${\mu}c$-SiGe:H layer for triple solar cells applications was performed to optimize the film properties.

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비정질/마이크로 탠덤 구조형 실리콘 박막 태양전지 ([ $a-Si:H/{\mu}c-Si:H$ ] thin-film tandem solar cells)

  • 이정철;송진수;윤경훈
    • 한국신재생에너지학회:학술대회논문집
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    • 한국신재생에너지학회 2006년도 춘계학술대회
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    • pp.228-231
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    • 2006
  • This paper briefly introduces silicon based thin film solar cells: amorphous (a-Si:H), microcrystalline ${\mu}c-Si:H$ single junction and $a-Si:H/{\mu}c-Si:H$ tandem solar cells. The major difference of a-Si:H and ${\mu}c-Si:H$ cells comes from electro-optical properties of intrinsic Si-films (active layer) that absorb incident photon and generate electron-hole pairs. The a-Si:H film has energy band-gap (Eg) of 1.7-1.8eV and solar cells incorporating this wide Eg a-Si:H material as active layer commonly give high voltage and low current, when illuminated, compared to ${\mu}c-Si:H$ solar cells that employ low Eg (1.1eV) material. This Eg difference of two materials make possible tandem configuration in order to effectively use incident photon energy. The $a-Si:H/{\mu}c-Si:H$ tandem solar cells, therefore, have a great potential for low cost photovoltaic device by its various advantages such as low material cost by thin-film structure on low cost substrate instead of expensive c-Si wafer and high conversion efficiency by tandem structure. In this paper, the structure, process and operation properties of Si-based thin-film solar cells are discussed.

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Expression of Catalase (CAT) and Ascorbate Peroxidase (APX) in MuSI Transgenic Tobacco under Cadmium Stress

  • Kim, Kye-Hoon;Kim, Young-Nam;Lim, Ga-Hee;Lee, Mi-Na;Jung, Yoon-Hwa
    • 한국토양비료학회지
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    • 제44권1호
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    • pp.53-57
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    • 2011
  • The MuSI is known as a multiple stress resistant gene with several lines. A previous study using RT-PCR showed that the expression of MuSI gene in tobacco plant induced its tolerance to Cd stress. This study was conducted to examine the enhanced Cd tolerance of the MuSI transgenic tobacco plant through germination test and to understand the role of the involved antioxidant enzymes for the exhibited tolerance. Germination rate of MuSI transgenic tobacco was more than 10% higher than that of wild-type tobacco, and seedlings of MuSI transgenic tobacco grew up to 1.6 times larger and greener than seedlings of wild-type tobacco at 200 and 300 ${\mu}M$ Cd. From the third to the fifth day, CAT activities at 100 and 200 ${\mu}M$ Cd and APX activities at 100, 200 and 300 ${\mu}M$ Cd of MuSI transgenic tobacco were up to two times higher than those of wild-type tobacco. MuSI gene is shown to enhance the activities of antioxidant enzymes resulting in higher tolerance to oxidative stress compared with the control plant.

선형접합기를 이용한 Si II 1.3$\mu\textrm{m}$-SiO$_2$/1.3$\mu\textrm{m}$-SiO$_2$ II SOI 기판의 직접접합 (Direct Bonding of Si II 1.3$\mu\textrm{m}$-SiO$_2$/1.3$\mu\textrm{m}$-SiO$_2$ II SOI substrates prepared by FLA method)

  • 송오성;이영민;이상현;이진우;강춘식
    • 한국표면공학회지
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    • 제34권1호
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    • pp.33-38
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    • 2001
  • 10cm-diameter Si(100)∥$1.3\mu\textrm{m}$-X$1.3_2$X$1.3\mu\textrm{m}$-$SiO_2$∥Si(100) afers were prepared using a fast linear annealing (FLA) equipment. 1.3$\mu\textrm{m}$-thick $SiO_2$ films were grown by dry oxidation process. After cleaning and premating the wafers in a class 100 clean room, they were heat treated using with the FLA and conventional electric furnace. Bonded area and bond strength of wafer pairs were measured using a infrared (IR) camera and razor blade crack opening method, respectively. It was confinmed that the bonded area by FLA was around 99% and the bond strength value reached 2172mJ/$\m^2$, which is equivalent to theoritical bond strength. Our result implies that thick $SiO_2$ SOI may be prepared more easily by using $SiO_2$$SiO_2$ bonding interfaces then those of Si/$SiO_2$'s.

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고출력 LED 패키지의 Thermal Via 형성을 위한 Si 기판의 이방성 습식식각 공정 (Anisotropic Wet-Etching Process of Si Substrate for Formation of Thermal Vias in High-Power LED Packages)

  • 유병규;김민영;오태성
    • 마이크로전자및패키징학회지
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    • 제19권4호
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    • pp.51-56
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    • 2012
  • 습식공정으로 thermal via용 SI 관통 via를 형성하기 위해 TMAH 용액의 농도와 온도에 따른 Si 기판의 이방성 습식식각 거동을 분석하였다. TMAH 용액의 온도를 $80^{\circ}C$로 유지한 경우, 5 wt%, 10 wt% 및 25 wt% 농도의 TMAH 용액은 각기 $0.76{\mu}m/min$, $0.75{\mu}m/min$$0.30{\mu}m/min$의 Si 식각속도를 나타내었다. 10 wt% TMAH 용액의 온도를 $20^{\circ}C$$50^{\circ}C$로 유지시에는 각기 $0.07{\mu}m/min$$0.23{\mu}m/min$으로 식각속도가 저하하였다. Si 기판의 양면에 동일한 형태의 식각 패턴을 형성하여 $80^{\circ}C$의 10 wt% TMAH 용액에 장입하고 5시간 식각하여 깊이 $500{\mu}m$의 관통 via hole을 형성하였다.

$Al_2O_3-SiC$ 복합재료의 상압소결시 치밀화에 미치는 SiC 원료분말의 크기영향 (Effect of SiC Particles Size on the Densification of $Al_2O_3-SiC$ Composite During Pressureless Sintering)

  • 채기웅
    • 한국세라믹학회지
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    • 제36권11호
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    • pp.1261-1265
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    • 1999
  • Effect of SiC particle size of the densification of Al2O3-SiC composite during pressureless sintering was investigated. Two types of SiC powders having average particle size of 0.15${\mu}{\textrm}{m}$ and 3${\mu}{\textrm}{m}$ were used. Densification rate of the specimen containing 0.15${\mu}{\textrm}{m}$ SiC particles was slower than that of the specimen containg 3${\mu}{\textrm}{m}$ SiC particles. Although the relative density of the specimen containing 0.15${\mu}{\textrm}{m}$ SiC particles was below 90% of theoretical density after sintering at 155$0^{\circ}C$ the complete closure of open pores occurred. Therefore full densification could be obtained by subsequent HIP. On the other hand in the specimen containing 3${\mu}{\textrm}{m}$ SiC particles the complete closed pore was observed at 95% of theoretical density. Such a fast pore closure in the specimen containing 0.15${\mu}{\textrm}{m}$ SiC particles is likely to occur as a result of dense reaction layer formation on the specimen surface which is attributed to the high reactivity of small size particles with sintering atmosphere.

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용융 Si 침윤방법에 의한 반응소결 탄화규소 고온가스 필터의 제조 및 특성 (Fabrication and Properties of Reaction Bonded SiC Hot Gas Filter Using Si Melt Infiltration Method)

  • 황성식;김태우
    • 한국세라믹학회지
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    • 제40권9호
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    • pp.891-896
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    • 2003
  • IGCC 발전 시스템에 사용되는 고온 가스 필터에 대하여 용융 Si 침윤공정 방법을 사용한 고강도 반응소결 탄화규소 고온 가스 필터 제조 공정이 개발되었다. 용융 Si 침윤 반응으로 제조된 반응소결 탄화규소의 상온 및 고온 파괴강도는 약 50-123, 60-66 MPa이었으며, 반응소결 탄화규소 다공체의 평균기공크기 및 기공율의 범위는 각각 60- 70 $\mu\textrm{m}$ 및 약 34 vol%이었다. 용융 Si 침윤 방법으로 제조된 반응 소결 탄화 규소 다공체에서는 SiC 입자 사이에 SiC/Si으로 이루어진 기지 상이 형성되어 고온 파괴 강도가 점토 결합 탄화 규소 다공체보다 우수하였다. 소결된 지지층 위에 Si 분말이 첨가되지 않은 slurry를 사용하여 여과층을 제조하였다. 여과층에 사용된 Sic 입자의 크기가 10$\mu\textrm{m}$에서 34 $\mu\textrm{m}$로 증가됨에 따라 SiC 입자 사이에 형성된 기지상의 두께가 증가하였다. 분진이 포함된 유체의 face velocity 변화에 따른 압손의 관계는 US filter사 Schumacher type 20 filter의 기체 유동 특성과 비슷하게 나타났으며, 분진여과 측정시 4분 내에 누출 분진의 크기가 1 $\mu\textrm{m}$ 크기 이하로 감소되었다.

SiCp/6061Al합금복합재료의 시효거동 (Age-Hardening Behavior of SiCp Reinforced 6061 Aluminum Alloy Composites)

  • 안행근;유정희;김석원;우기도
    • 한국재료학회지
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    • 제10권12호
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    • pp.793-798
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    • 2000
  • 석출경화형 6061Al기지합금과 SiC입자크기를 0.7$\mu\textrm{m}$ 및 7.0$\mu\textrm{m}$로 변화시켜 강화한 SiCp/6061Al 합금복합재료의 시효 거동을 경도측정, DSC 시험 및 TEM관찰을 통하여 조사하였다. 17$0^{\circ}C$에서 등온시효시 6061Al기지합금에 비하여 복합화한 0.7$\mu\textrm{m}$SiCp/6061Al합금복합재료 및 7.0$\mu\textrm{m}$SiCP/6061Al합금복합재료에서 최고경도에 도달하는 시간이 짧았으며, 또한 강화재의 크기가 큰 7.0$\mu\textrm{m}$SiCp/6061Al합금복합재료에서 시효촉진이 보다 크게 나타났다. 이것은 복합화 및 SiC입자크기 증가에 따른 전위 밀도 상승에 기인한다. 6061Al기지합금 및 복합재료에서 최고시효처리시의 주강화상은 봉상의 중간상 $\beta$(Mg$_2$Si)이며,$\beta$상 생성의 활성화에너지는 복합화 및 SiG입자크기의 증가에 따라 감소되었다

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PECVD에 의한 $\mu$c-Si:H 박막트랜지스터의 제조 (Fabrication of $\mu$c-Si:H TFTs by PECVD)

  • 문교호;이재곤;최시영
    • 전자공학회논문지A
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    • 제33A권5호
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    • pp.117-124
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    • 1996
  • The .mu.c-Si:H films have been deposited by PeCVD at the various conditions such as hydrogen dilution ratio, substrate temperature and RF power density. Then, we studied their electrical and optical properties. Top gate hydrogenated micro-crystalline silicon thin film transistors($\mu$c-Si:H TFTs) using $\mu$-Si:H and a-SiN:H films have been fabricated by FECVD. The electrical characteristics of the devices have been investigated by semiconductor parameter analyzer and compared with amorphous silicon thin film transistors (a-Si:H TFTs). In this study, on/off current ratio, threshold voltage and the field effect mobility of the $\mu$c-Si:H TFT were $3{\times}10^{4}$, 5.06V and 0.94cm$^{2}$Vs, respectively.

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