• Journal of the Korean Institute of Telematics and Electronics A
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• v.29A no.7
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• pp.31-38
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• 1992

In this paper, numerical analysis package using Time-Domain Finite Difference (TDFD) method is developed to solve the initial value problem of Maxwell's equation and applied to several microstrip structures. TDFD allows us to show graphically the evolution of the crosswalk between microstrip lines. Moreover, we can obtain transmission line parameters and scattering parameters through Fourier transform of TDFD results in easy and efficient ways. TDFD is successfully applied to :1) wide band electromagnetic wave propagation along the single microstrip line, 2) crosswalk analysis between two microstrip lines, and 3) three metal line side-coupled filter. Our results show much better agreement with other theoretical experimental results reported in the literature. Thus we expect that TDFD is very useful to designing MMIC(Monolithic Microwave Integrated Circuit).

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.39 no.2
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• pp.101-107
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• 2002

High performance packages must protect circuits from the internal leakaged-electromagnetic fields as well as the surrounding. In this paper, we characterized an electromagnetically-shielded millimeter-wave ceramic package from 20 to 40 ㎓ using FEM(Finite Element Method). From these calculation results, the parasitic resonance is observed at 33.4 ㎓. We use metal-filled via-holes at the ceramic package walls and resonance has been suppressed in a frequency range from 20 to 40 ㎓. These calculation results will be helpful for MMIC packaging using electromagnetically-shielded millimeter-wave ceramic packages.

• Proceedings of the IEEK Conference
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• 2006.06a
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• pp.491-492
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• 2006

The MMIC (Microwave Monolithic Integrated Circuit) self oscillating double conversion mixer was designed and fabricated for the V-band transmitter applications. The MMIC self oscillating double conversion mixer which dose not need external local oscillator was designed using GaAs PHEMT technology. The first self oscillating mixer use PHEMT technology. The first self oscillating mixer use PHEMT for $f_{LO}$ signal generation and $f_{IF}$ signal is applied at gate port and $f_{RF1}$ signal is generated at a drain port of first stage. The second gate mixer use PHEMT for $f_{LO}$ signal and $f_{RF1}$ signal is applied at gate port and $f_{RF2}$ signal is output at a drain port of second stage.

• Journal of Electrical Engineering and information Science
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• v.2 no.6
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• pp.202-207
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• 1997

Design and fabrication issues for an L-band GaAs Monolithic Microwave Integrated Circuit(MMIC) Voltage Controlled Oscillator(VCO) as a component of Personal Communications Systems(PCS) Radio Frequency(RF) transceiver are discussed. An ion-implanted GaAs MESFET tailored toward low current and low noise with 0.5mm gate length and 300mm gate width has been used as an active device, while an FET with the drain shorted to the source has been used as the voltage variable capacitor. The principal design was based on a self-biased FET with capacitive feedback. A tuning range of 140MHz and 58MHz has been obtained by 3V change for a 600mm and a 300mm devices, respectively. The oscillator output power was 6.5dBm wth 14mA DC current supply at 3.6V. The phase noise without any buffer or PLL was 93dB/1Hz at 100KHz offset. Harmonic balance analysis was used for the non-linear simulation after a linear simulation. All layout induced parasitics were incorporated into the simulation with EEFET2 non-linear FET model. The fabricated circuits were measured using a coplanar-type probe for bare chips and test jigs with ceramic packages.

• ETRI Journal
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• v.46 no.2
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• pp.323-332
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• 2024

Receiver and transmitter monolithic microwave integrated circuit (MMIC) multifunction chips (MFCs) for active phased-array antennas for Ka-band satellite communication (SATCOM) terminals have been designed and fabricated using a 0.15-㎛ GaAs pseudomorphic high-electron mobility transistor (pHEMT) process. The MFCs consist of four-channel radio frequency (RF) paths and a 4:1 combiner. Each channel provides several functions such as signal amplification, 6-bit phase shifting, and 5-bit attenuation with a 44-bit serial-to-parallel converter (SPC). RF pads are implemented on the bottom side of the chip to remove the parasitic inductance induced by wire bonding. The area of the fabricated chips is 5.2 mm × 4.2 mm. The receiver chip exhibits a gain of 18 dB and a noise figure of 2.0 dB over a frequency range from 17 GHz to 21 GHz with a low direct current (DC) power of 0.36 W. The transmitter chip provides a gain of 20 dB and a 1-dB gain compression point (P1dB) of 18.4 dBm over a frequency range from 28 GHz to 31 GHz with a low DC power of 0.85 W. The P1dB can be increased to 20.6 dBm at a higher bias of +4.5 V.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.37 no.3
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• pp.34-38
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• 2000

This paper describes design, fabrication, and performance of an ultra-high-speed and low-noise MMIC (Monolithic Microwave Integrated Circuit) preamplifier for a 10 Gb/s optical receiver. The transimpedance type 3-stage MMIC preamplifier for ultra-high-speed and low-noise was designed using an AlGaAs/InGaAs/GaAs P-HEMTs(Pseudomorphic High Electron Mobility Transistors) with 0.15${\mu}{\textrm}{m}$ length T-shaped gate. To obtain broadband characteristics, we used the inductor peaking technique, and the gate width was optimized for low noise performance. Measurements reveal that the fabricated preamplifier has the high transimpedance gain of 60 ㏈Ω and 9.15 ㎓ bandwidth with the noise figure of less than 3.9 ㏈.

• Journal of IKEEE
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• v.23 no.2
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• pp.425-430
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• 2019

This work describes the design and characterization of a X-band power amplifier (PA) monolithic microwave integrated circuit (MMIC) using a $0.25{\mu}m$ gate length gallium nitride (GaN) high electron mobility transistor (HEMT) technology. The developed X-band power amplifier MMIC has small signal gain of over 22.7 dB and saturated output power of 43.02 dBm (20.04 W) over the entire band of 9 to 10 GHz. Maximum saturated output power is a 43.84 dBm (24.21 W) at 9.5 GHz. Its power added efficiency (PAE) is 41.0~51.24% and the chip dimensions are $3.7mm{\times}2.3mm$, generating the output power density of $2.84W/mm^2$. The developed GaN power amplifier MMIC is expected to be applied in a variety of X-band radar applications.

• ETRI Journal
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• v.42 no.5
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• pp.781-789
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• 2020

In this study, an E-band low-noise amplifier (LNA) monolithic microwave integrated circuit (MMIC) has been designed using silicon-germanium 130-nm bipolar complementary metal-oxide-semiconductor technology to suppress unwanted signal gain outside operating frequencies and improve the signal gain and noise figures at operating frequencies. The proposed impedance-controllable filter has series (R_s) and parallel (R_p) resistors instead of a conventional inductor-capacitor (L-C) filter without any resistor in an interstage matching circuit. Using the impedance-controllable filter instead of the conventional L-C filter, the unwanted high signal gains of the designed E-band LNA at frequencies of 54 GHz to 57 GHz are suppressed by 8 dB to 12 dB from 24 dB to 26 dB to 12 dB to 18 dB. The small-signal gain S₂₁ at the operating frequencies of 70 GHz to 95 GHz are only decreased by 1.4 dB to 2.4 dB from 21.6 dB to 25.4 dB to 19.2 dB to 24.0 dB. The fabricated E-band LNA MMIC with the proposed filter has a measured S₂₁ of 16 dB to 21 dB, input matching (S₁₁) of -14 dB to -5 dB, and output matching (S₂₂) of -19 dB to -4 dB at E-band operating frequencies of 70 GHz to 95 GHz.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.22 no.5
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• pp.538-544
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• 2011

This paper presents a compact single balanced diode mixer fabricated using a 0.1 ${\mu}M$ GaAs p-HEMT commercial process for an E-band frequency up/down converter. This mixer includes a LO balun employing a Marchand balun with a good RF performance. In order to improve the port-to-port isolation, a high pass filter and a low pass filter are include in this mixer at the RF and IF ports, respectively. The fabricated mixer with a very compact size of 0.58 mm2(0.85 mm${\times}$0.68 mm) exhibits a conversion loss of 8～12 dB and an input P1dB of 1～5 dBm at the LO power of 10 dBm from 71～86 GHz.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.17 no.11 s.114
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• pp.1105-1111
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• 2006

In this paper, using low-temperature co-fired ceramic(LTCC) based system-in-package(SiP) technology, a very compact power amplifier LTCC module was designed, fabricated, and then characterized for 60 GHz wireless transmitter applications. In order to reduce the interconnection loss between a LTCC board and power amplifier monolithic microwave integrated circuits(MMIC), bond-wire transitions were optimized and high-isolated module structure was proposed to integrate the power amplifier MMIC into LTCC board. In the case of wire-bonding transition, a matching circuit was designed on the LTCC substrate and interconnection space between wires was optimized in terms of their angle. In addition, the wire-bonding structure of coplanar waveguide type was used to reduce radiation of EM-fields due to interconnection discontinuity. For high-isolated module structure, DC bias lines were fully embedded into the LTCC substrate and shielded with vias. Using 5-layer LTCC dielectrics, the power amplifier LTCC module was fabricated and its size is $4.6{\times}4.9{\times}0.5mm^3$. The fabricated module shows the gain of 10 dB and the output power of 11 dBm at P1dB compression point from 60 to 65 GHz.