• 제목/요약/키워드: Molding Temperature

검색결과 768건 처리시간 0.031초

금속 인서트 사출 성형품의 수축 현상에 관한 연구 (A Study of Shrinkage Phenomena on Injection modeled Pa Metal Insert)

  • 김영수
    • 한국자동차공학회논문집
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    • 제7권9호
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    • pp.112-118
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    • 1999
  • Shrinkage behavior was investigated to obtain more accurate dimensions of injected molding parts for free and restricted shrinkage conditions. various parameters for metal inserted injection process, such as thickness of resin, holding pressure and time, mo이 temperature and restriction condition of mold, were considered for the analysis of shrinkage phenomena. For numerical analysis, MOLDFLOW software was used to find the deterministic parameters of filling time, temperature, pressure and holding time. Also , experimental shrinkage effects were measured through actual injection molding process and the resin thickness was under controlled as 3 mm , 5 mm, and 7mm for the shapes of plastic gear made of Polymide(PA) and Polyxymethlene(POM). The main parameters of these injection processes were found to be holding pressure, holding time and mold temperature in the case of metal inserted molding.

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고무 면진 베어링 몰딩과정의 열전달 해석 및 실험 (An Experimental Study of Heat Transfer Analysis in Molding the Rubber Bearing for Seismic Isolator)

  • 강경주;문병영;강범수;김계수;정경수
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2001년도 춘계학술대회논문집C
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    • pp.275-280
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    • 2001
  • Seismic isolator system is one of the most widely used base isolation system in order to control the vibration of structure against earthquake excitation. The evaluation of vulcanization time in molding the rubber bearing is very important for both proper ability of isolator and efficiency of manufacture. This paper deals with experimental measurement of temperature of isolator with senor inside in it, and compared with the result of FEA in order to evaluate the vulcanization time. Properties of rubber bearing which is used in the FEA are obtained by controlling the specific heat of rubber. With the obtained properties of rubber, the isolator is analysed by FEA. As a result, an appropriate analytical vulcanization time is obtained. This time is regarded as an appropriate temperature, which is used to effective manufacture.

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100nm 급 Pattern 전사성 향상을 위한 나노 사출 성형 공정 최적화 연구 (Study on Optimization of Nano Injection Molding Process for Improving Transcription of 100nm-level Pattern)

  • 이재숙;이해곤;손성기;이종훈
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2006년도 춘계학술대회 논문집
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    • pp.81-85
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    • 2006
  • In this study, we have been examined nano Injection Molding process which can improve transcription of 100nm-level pattern. We changed the various parameter (temperature of injection mold, clamp force, temperature of nozzle) which can be influence for improving transcription. And we measured and analyzed shapes of 100nm-level pattern by Automic Force Microscope for proving transcription. We made the Blu-ray Disc sample for proving transcription. And we measured HF-Signal and jitter. As a result, when the temperature of mold is more than $120^{\circ}C$ and the clamp force is more than 10 ton, We reached over 95 percent of transcription compared with stamper pattern. And we reached in-spec. value for HF-Signal and Jitter. Then we reached over 95 percent of transcription compared with stamper pattern.

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사출성형 해석을 통한 Weldline 및 Flow mark 개선사례 (The Improvement of Weldline and Flow mark Defection by using Injection Molding Analysis)

  • 이영창
    • 한국정밀공학회지
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    • 제30권12호
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    • pp.1295-1301
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    • 2013
  • The cause of flow mark defect is known as non-uniform temperature of mold surface when the flow front meets the cold cavity. The exact definition and classification of Flow mark is not clear because the mechanism of flow mark is not figured out till now. Any injection molding analysis software can not predict the flow mark phenomena. To solve weldline and flow mark defects, the gate thickness is reduced to increase the melt front velocity and the melt front velocity of the flow mark area is increased from 82.3mm/s to 104.7mm/s. In addition, the bulk temperature of the flow mark area is increased from $178.3^{\circ}C$to $215.2^{\circ}C$ by adding a cold slug well. The flow mark phenomena can be greatly reduced by increasing the flow front velocity and elevating the bulk temperature.

사출성형조건이 HIPS 수축율에 미치는 영향 (The effect of the injection molding conditions on the shrinkage of HIPS)

  • 차백순;이병옥;최권일;구본흥;박형필
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2005년도 추계학술대회 논문집
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    • pp.259-264
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    • 2005
  • The shrinkage of the product in injection molded part occurs due to the volume change with variation of temperature and pressure and is influenced by the processing conditions of injection molding. Mold designers greatly concerns the shrinkage of parts for a high dimensional accuracy. In this study, bar type HIPS specimen with 15x19 grid on the surface was tested. The amount of shrinkage of flow and transverse directions was examined with respect to the injection molding conditions such as melt temperature, injection speed, holding pressure, mold temperature and cooling time. As the packing pressure increased, the difference of shrinkage of both directions is decreased and the absolute shrinkage value also decreased.

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모바일폰 커버의 휨특성 평가를 위한 금형 제작에 관한 연구 (A Study on Manufacturing of Plastic Injection Mold for Warpage Characteristics of Mobile Phone Cover)

  • 김무연;이성희;권창오;김옥래
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2005년도 금형가공,미세가공,플라스틱가공 공동 심포지엄
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    • pp.126-131
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    • 2005
  • In the present study, warpage characteristics of mobile phone cover through injection molding process were investigated by using design of experiments. Warpage in plastic injection molding process has a significant effect on quality of product. Effects of injection time, packing pressure, packing time, mold temperature ana melt temperature on warpage of mobile phone cover were considered by CAE analysis and experiment with Taguchi method. The degree of warpage for the injection molded product was measured by using three dimensional CMM. It was shown that temperature parameter has more significant effect on the warpage of mobile phone cover than pressure parameter.

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필름 인서트 사출성형 평판의 휨 변형에 관한 실험적 연구 (An Experimental Study on the Warpage of a Film Insert Molded Plate)

  • 유영길;이호상
    • 소성∙가공
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    • 제21권1호
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    • pp.30-35
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    • 2012
  • FIM(Film Insert Molding) is an innovative method of producing decorated parts for a wide range of products. Because it requires fewer steps when compared to conventional production methods, the time and cost of manufacturing high quality components can be reduced considerably. In this paper, the effects of processing conditions on the warpage of film-insert molded plate were investigated by using a design of experiments. The dominant factors affecting warpage were mold temperature and holding pressure. Warpage increased with the temperature difference between stationary mold and fixed one. Even when the mold temperature difference was zero, the plate with a film was bent after ejection such that the film side protruded. As holding pressure increased, warpage decreased significantly. In addition warpage increased with time increment for the film-insert molded plates.

Sintering of porous ceramic of diatomite according to molding pressure and PEG content

  • Lee, Ye-Na;Ahn, Seok-Hwan;Nam, Hoseok;Nam, Ki-Woo
    • Journal of Ceramic Processing Research
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    • 제19권6호
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    • pp.467-471
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    • 2018
  • Diatomite powder, a naturally occurring porous raw material, was used to make ceramic materials with porosity and high strength. The sintering behavior of the diatomite powder at various sintering temperatures suggests that diatomite monoliths with a high porosity and strength can be prepared at $1100^{\circ}C$. The compressive strength of the sintered diatomite monoliths increased as the sintering temperature increased, and the molding pressure of 2 MPa and the binder of 18.6 wt.% were excellent. When the sintering temperature rises, the diatomite powder is melted, and its pores gradually disappear. SEM images show that strengthening begins with the formation of inter-particle bonds at a low sintering temperature.

PET 병용 프리폼 사출성형에서 잔류응력과 수축 최소화를 위한 성형조건의 연구 (Investigation of the Molding Conditions to Minimize Residual Stress and Shrinkage in Injection Molded Preform of PET Bottle)

  • 조성환;홍진수;류민영
    • 폴리머
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    • 제35권5호
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    • pp.467-471
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    • 2011
  • PET병은 프리폼(preform)을 사출성형한 후 이를 블로우 성형기에 이송시켜 블로잉하여 성형된다. 내열을 요구하는 병 즉, 주스나 곡류음료용 PET병은 목 부분(neck 또는 thread 부분)에 내열성을 부여하기 위해 프리폼 성형 후 블로잉하기 전에 목 부분을 결정화시킨다. 그러나 사출성형품에 존재하는 잔류응력이 결정화를 방해하기 때문에 프리폼 목 부분의 충분한 결정화를 위해 사출 후 프리폼을 열처리(annealing)한다. 이 열처리는 잔류응력을 해소시키기 위해서 수행하는데 사출 시 성형조건의 최적화를 통하여 잔류응력을 최소화한다면 열처리 시간을 단축시킬 수 있다. 본 논문에서는 사출 시 프리폼에 형성되는 잔류응력을 최소화하고 치수정밀도를 유지하기 위한 연구로 CAE 해석을 통하여 최적 사출조건을 제시하였다. 성형조건별 잔류응력 및 수축률의 변화를 관찰하고 이를 최소화시키는 성형조건을 찾기 위해 실험계획법을 적용하였다. 사출온도, 보압크기, 그리고 사출시간을 인자로 하여 최적의 성형조건을 결정하였다. 잔류응력에 영향을 주는 인자는 사출온도와 사출시간 순으로 나타났고 수축률에 영향을 주는 인자는 사출온도로 나타났다. 본 연구에서 결정한 최적 조건에서 최대 잔류응력, 잔류응력의 분포, 그리고 수축률이 기존 조건에 비해 각각 22%, 40%, 그리고 25% 감소하였다.

일체형 주상용 몰드 변압기의 덕트에 따른 열해석 특성 연구 (The Thermal Analysis of Pole Mount Mold Transformer with One-body Molding by Duct Condition)

  • 조한구;이운용;박영두
    • 한국전기전자재료학회논문지
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    • 제17권3호
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    • pp.348-352
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    • 2004
  • The mold transformers have been widely used in underground substations in large building and have some advantages in comparison to oil-transformer, that is low fire risk, excellent environmental compatibility, compact size and high reliability. In addition, the application of mold transformer for outdoor is possible due to development of epoxy resin. The mold transformer generally has cooling duct between low voltage coil and high voltage coil. A mold transformer made by one body molding method has been developed for small size and ow loss, but it needs some cooling method because heat radiation between each winding is difficult. The life of transformer is significantly dependent on the thermal behavior in windings. Many transformer designers have calculated temperature distribution and hot spot point by finite element method(FEM) to analyze winding temperature rise. In this paper, The thermal analysis of pole mount mold transformer with one body molding by duct condition is investigated and the test result of temperature rise is compared with simulation data.