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http://dx.doi.org/10.5228/KSTP.2012.21.1.30

An Experimental Study on the Warpage of a Film Insert Molded Plate  

Yoo, Y.G. (충주대학교 대학원)
Lee, H.S. (충주대학교 항공기계설계학과)
Publication Information
Transactions of Materials Processing / v.21, no.1, 2012 , pp. 30-35 More about this Journal
Abstract
FIM(Film Insert Molding) is an innovative method of producing decorated parts for a wide range of products. Because it requires fewer steps when compared to conventional production methods, the time and cost of manufacturing high quality components can be reduced considerably. In this paper, the effects of processing conditions on the warpage of film-insert molded plate were investigated by using a design of experiments. The dominant factors affecting warpage were mold temperature and holding pressure. Warpage increased with the temperature difference between stationary mold and fixed one. Even when the mold temperature difference was zero, the plate with a film was bent after ejection such that the film side protruded. As holding pressure increased, warpage decreased significantly. In addition warpage increased with time increment for the film-insert molded plates.
Keywords
Film Insert Molding; Warpage; Mold; Design of Experiments; Injection Molding;
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  • Reference
1 S. C. Chen, H. M. Li, S. T. Huang, Y. C. Wang, 2010, Effect of Decoration Film on Mold Surface Temperature During In-molded Decoration Injection Molding Process, Inter. Comm. Heat Mass Trans., Vol. 37, No. 5, pp. 501-505.   DOI   ScienceOn
2 S. Y. Kim, S. H. Lee, S. J. Baek, J. R. Youn, 2008, Thermoviscoelastic Behavior of Film-insert-molded Parts Prepared under Various Processing Conditions, Macromol. Mater. Eng., Vol. 293, No. 12, pp. 969-978.   DOI   ScienceOn
3 H. J. Oh, Y. S. Song, S. H. Lee, J. R. Youn, 2009, Development of Warpage and Residual Stresses in Film Insert Molded Parts, Poly. Eng. Sci., Vol. 49, No. 7, pp. 1389-1399.   DOI   ScienceOn
4 S. Y. Kim, S. H. Kim, H. J. Oh, S. H. Lee, S. J. Baek, J. R. Youn, S. H. Lee, S.-W. Kim, 2009, Molded Geometry and Viscoelastic Behavior of Film Insert Molded Parts, J. Appl. Poly. Sci., Vol. 111, No. 2, pp. 642-650.
5 M. S. Phadke, 1999, Quality Engineering Using Robust Design, AT&T Bell Lab., Prentice Hall.