1 |
S. C. Chen, H. M. Li, S. T. Huang, Y. C. Wang, 2010, Effect of Decoration Film on Mold Surface Temperature During In-molded Decoration Injection Molding Process, Inter. Comm. Heat Mass Trans., Vol. 37, No. 5, pp. 501-505.
DOI
ScienceOn
|
2 |
S. Y. Kim, S. H. Lee, S. J. Baek, J. R. Youn, 2008, Thermoviscoelastic Behavior of Film-insert-molded Parts Prepared under Various Processing Conditions, Macromol. Mater. Eng., Vol. 293, No. 12, pp. 969-978.
DOI
ScienceOn
|
3 |
H. J. Oh, Y. S. Song, S. H. Lee, J. R. Youn, 2009, Development of Warpage and Residual Stresses in Film Insert Molded Parts, Poly. Eng. Sci., Vol. 49, No. 7, pp. 1389-1399.
DOI
ScienceOn
|
4 |
S. Y. Kim, S. H. Kim, H. J. Oh, S. H. Lee, S. J. Baek, J. R. Youn, S. H. Lee, S.-W. Kim, 2009, Molded Geometry and Viscoelastic Behavior of Film Insert Molded Parts, J. Appl. Poly. Sci., Vol. 111, No. 2, pp. 642-650.
|
5 |
M. S. Phadke, 1999, Quality Engineering Using Robust Design, AT&T Bell Lab., Prentice Hall.
|