• 제목/요약/키워드: Molding System

검색결과 675건 처리시간 0.027초

현장진단용 단백질 칩 사출금형기술 (Injection Mold Technology of Protein Chip for Point-of-Care)

  • 이성희;고영배;이종원;정해철;박재현;이옥성
    • Design & Manufacturing
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    • 제6권2호
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    • pp.74-78
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    • 2012
  • A multi-cavity injection mold system of protein chip for point-of-care with cavity temperature and pressure sensors was proposed in this work. In advance of manufacturing for the multi-cavity injection mold system, a single cavity injection mold system to mold protein chip was considered. Injection molding analysis for the presented system was performed to optimize the process of the molding and suggest guides to design. On the basis of the results for the single cavity system, a multi-cavity injection mold system for protein chip was analyzed, designed and manufactured with cavity temperature and pressure sensors. Results of balanced filling for protein chip models were obtained from the presented mold system.

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Expert Design Evaluation System for injection Molding

  • Kim, Sang-Gook;Huh, Yong-Jeong
    • International Journal of Precision Engineering and Manufacturing
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    • 제2권1호
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    • pp.62-75
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    • 2001
  • The design and manufacture of injection molded polymeric parts with desired properties is a costly process dominated by empiricism including repeated modification of actual tooling. This paper presents and expert design evaluation system which can predict the mechanical performance of a molded product and diagnose the design before the actual mold is machined. The knowledge-based system synergistically combines a rule-based expert system with CAE programs. An iterative boundary pressure reflection method(IBPR) is developed to automate the cavity filling simulation program and to predict thermo-mechanical properties of a molded part precisely. Mathematical models of weldline and frozen-in molecular orientation are established to determine the spatial variation of microstructural anisotropies of a molded part from the result of cavity filling simulation. The strength ellipse is devised as and index which represents th spatial distribution of the microstructural anisotropies of a molded part, Heuristic knowledge of injection molding, flow simulation, and mechanical performance prediction is formalized as rules of an expert consultation system. The expert system interprets the analytical results of the process simulation, predicts the performance, evaluates the design and generates recommendations for optimal design alternative.

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가변 러너 시스템을 이용한 패밀리 금형의 충전밸런스에 관한 이론적 연구 (A Theoretical Study for the Filling Balance of the Family Mold Using Variable-Runner System)

  • 최권일;박형필;차백순;이병옥;구본흥
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2007년도 추계학술대회 논문집
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    • pp.275-278
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    • 2007
  • In family mold, defects are frequently occurred by an excessive packing the smaller volume cavity during molding. Although runner size could be optimized by CAE analysis or experimental data, the filling imbalance is hardly avoided in the actual injection molding process by various means. Before this study, we developed a variable-runner system for balancing the cavity-filling for three resins (ABS, LDPE, and PA66) in the family-mold, and examined the effect of cross-sectional area reduction of a runner in the system. In this study, we examined the conditions of the pressure and temperature in the system with a CAE analysis. We also analyzed the influence of the rheological characteristic of resins to the balancing-capability of the system in order to help mold designers easily adopt the variable-runner system to their design.

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플라스틱 사출 금형 설계를 위한 CAD시스템의 개발 (An integrated CAD system for mold design in injection molding processes)

  • 이상헌;이건우;고천진
    • 대한기계학회논문집
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    • 제12권6호
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    • pp.1227-1237
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    • 1988
  • 본 연구에서는 Fig.1은 본 시스템이 제품의 형상을 모델링하고 그것으로부터 어떻게 금형을 설계하는 지를 설명해주고 있다. 본 연구의 범위는 Fig.1의 점선에 의해 둘러 싸인 부분이다. 즉 본 시스템의 모델링 기능을 사용하여 생성시킨 최종제 품 형상으로부터 적당한 몰드 베이스와 그에 장착되는 금형판을 설계 생성시키는 작업 이다.수지의 유동 해석과 NC공구 경로의 계산은 개발 중에 있으며 이들과 함께 통 합되면 완전한 CAD/CAM 시스템을 Fig.1에서와 같이 구축할 수 있다.

Double Side SMT and Molding Process Development for mPossum Package

  • Kim, ByongJin;Cho, EunNaRa;Kim, ChoongHoe;Lee, YoungWoo;Lee, JaeUng;Ryu, DongSu;Jung, GyuIck;Kang, DaeByoung;Khim, JinYoung;Yoon, JuHoon;Kim, Sun-Joong
    • 마이크로전자및패키징학회지
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    • 제23권4호
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    • pp.43-48
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    • 2016
  • 3-Dimensional System in Package (3-D SiP) structure (Amkor calls it mPossum-molded Possum) using double side Surface Mount Technology (SMT) and double side molding was evaluated in order to achieve small/thin form factor as well as good functionality by integration and double side layout. As the new platform on laminate substrate basis, molding process was challenge in mold flow balance at top and bottom side and package warpage control over the overall assembly process. There were two types of different molding process evaluated with 1) 1-step molding which was done at both side at the same time and 2) 2-step molding which was done at the conventional molding process twice. Mold simulation helped to narrow down the material selections and parameters available before actual sample build. There were many challenges for this first trial in design/ parameter and material types but optimized them to enable this structure.