• Design & Manufacturing
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• v.6 no.2
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• pp.74-78
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• 2012

A multi-cavity injection mold system of protein chip for point-of-care with cavity temperature and pressure sensors was proposed in this work. In advance of manufacturing for the multi-cavity injection mold system, a single cavity injection mold system to mold protein chip was considered. Injection molding analysis for the presented system was performed to optimize the process of the molding and suggest guides to design. On the basis of the results for the single cavity system, a multi-cavity injection mold system for protein chip was analyzed, designed and manufactured with cavity temperature and pressure sensors. Results of balanced filling for protein chip models were obtained from the presented mold system.

• International Journal of Precision Engineering and Manufacturing
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• v.2 no.1
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• pp.62-75
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• 2001

The design and manufacture of injection molded polymeric parts with desired properties is a costly process dominated by empiricism including repeated modification of actual tooling. This paper presents and expert design evaluation system which can predict the mechanical performance of a molded product and diagnose the design before the actual mold is machined. The knowledge-based system synergistically combines a rule-based expert system with CAE programs. An iterative boundary pressure reflection method(IBPR) is developed to automate the cavity filling simulation program and to predict thermo-mechanical properties of a molded part precisely. Mathematical models of weldline and frozen-in molecular orientation are established to determine the spatial variation of microstructural anisotropies of a molded part from the result of cavity filling simulation. The strength ellipse is devised as and index which represents th spatial distribution of the microstructural anisotropies of a molded part, Heuristic knowledge of injection molding, flow simulation, and mechanical performance prediction is formalized as rules of an expert consultation system. The expert system interprets the analytical results of the process simulation, predicts the performance, evaluates the design and generates recommendations for optimal design alternative.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.10a
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• pp.275-278
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• 2007

In family mold, defects are frequently occurred by an excessive packing the smaller volume cavity during molding. Although runner size could be optimized by CAE analysis or experimental data, the filling imbalance is hardly avoided in the actual injection molding process by various means. Before this study, we developed a variable-runner system for balancing the cavity-filling for three resins (ABS, LDPE, and PA66) in the family-mold, and examined the effect of cross-sectional area reduction of a runner in the system. In this study, we examined the conditions of the pressure and temperature in the system with a CAE analysis. We also analyzed the influence of the rheological characteristic of resins to the balancing-capability of the system in order to help mold designers easily adopt the variable-runner system to their design.

• Transactions of the Korean Society of Mechanical Engineers
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• v.12 no.6
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• pp.1227-1237
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• 1988

A practically useful CAD system for mold design in the plastic injection molding processes has been developed. Even though many efforts have been tried to simulated the injection molding process, this is the first attempt toward an automatic mold design system instead of a manufacturing or a simulation system. In this system the computational routines, the data base for mold design, and the routines for three dimensional modeling are blended together so that the designed mold is obtained as a solid model. For this development, the following problems have been solved. First, the modeling capability of the plastic parts has been implemented by incorporating the modeling routines of a constructive solid geometric modeling system and developing a constant thickness modeling conditions, and that of standard mold bases have been established. Third, the experimental know-how and the empirical formulae have been collected and blended together with the modeling routines of a geometric modeling system to provide the high level commands for designing mold.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.43-48
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• 2016

3-Dimensional System in Package (3-D SiP) structure (Amkor calls it mPossum-molded Possum) using double side Surface Mount Technology (SMT) and double side molding was evaluated in order to achieve small/thin form factor as well as good functionality by integration and double side layout. As the new platform on laminate substrate basis, molding process was challenge in mold flow balance at top and bottom side and package warpage control over the overall assembly process. There were two types of different molding process evaluated with 1) 1-step molding which was done at both side at the same time and 2) 2-step molding which was done at the conventional molding process twice. Mold simulation helped to narrow down the material selections and parameters available before actual sample build. There were many challenges for this first trial in design/ parameter and material types but optimized them to enable this structure.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.05a
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• pp.341-342
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• 2012

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.05a
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• pp.599-600
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• 2012

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.05a
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• pp.611-612
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• 2012

• Proceedings of the KSME Conference
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• 2005.11a
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• pp.206.2-206.2
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• 2005

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2013.05a
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• pp.703-704
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• 2013