• 마이크로전자및패키징학회지
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• 제10권1호
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• pp.25-29
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• 2003

이 논문은 고분자 박막이 주변으로부터 수분을 흡수하게 될 때, 탄성 기판과 점탄성 박막의 계면 모서리에서 발생하는 응력 특이성을 다루고 있다. 계면에서 발생하는 응력을 조사하기 위해서 경계 요소법이 사용되고 있다. 주어진 점탄성 모델에 대해서 특이 차수가 수치적으로 계산된다. 이 논문에서 고려하고 있는 점탄성 모델에 대해서, 응력특이계수는 시간이 경과함에 따라 이완되고 있으나 특이 차수는 증가되고 있음을 보여준다.

• 한국식품영양학회지
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• 제6권3호
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• pp.178-188
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• 1993

This research was attempted to investigate changes in physicochemical properties of rice extrudate with added ginger powder extruded by single screw extruder. Graphic three dimensional analysis on response surface regression was used to evaluate effects of extrusion variables on quality factors of the extrudate according to two independent variables, ginger consent 0∼12%, moisture content 14∼26%. The summarized results are as follows : 1) Regarding proximate composition of rice extrudate with added ginger powder, as ginger powder content of raw material Increased, crude tat, crude protein, crude ash and crude fiber increased, while soluble nitrogen free extract decreased. 2) Graphic three dimensional analysis on response surface regression was conducted for each dependent variable which revealed statistically significant relationship with independent variables, 0∼120A ginger and 14∼26% moisture content. Expansion ratio had a critical point as moisture content changed. As ginger and moisture content Increased, bulk density, break strength and water absorption Index Increased, while water solubility Index decreased. The predicted maximum degree of gelatinization in 6.15% ginger and 15.56% moisture content is 88.27%, and lightness decreased as ginger content Increased. According to the microstructure for the cross section of extrudate obsorbed with image analyzer, air cell number and perimeter revealed saddle point, meanwhile total area and fractarea of air cell had critical points as moisture content changed. In view of the results, quality of rice extrudate with added ginger powder was optimum when rice flour was fed to the extruder with 2∼7% singer powder and 15∼20% moisture content.

• Composites Research
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• 제30권6호
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• pp.422-428
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• 2017

본 연구에서는 온도와 수분에 노출된 다중벽 탄소나노튜브가 함유된 나노복합재의 수분흡수거동, 인장특성, 열분석특성을 평가하였다. 이때 탄소나노튜브 함유량은 0 wt%, 1 wt%, 2 wt%를 고려하였으며 시편은 각각 $25^{\circ}C$와 $75^{\circ}C$의 침수조건에 600시간까지 노출시켰다. 연구결과에 따르면 수분흡수량은 노출시간이 길어지면 증가하지만 최대 수분흡수량과 600시간에서의 수분흡수량 차이는 일정하게 나타났다. 인장탄성계수는 노출시간이 길어지면 낮아지고 탄소나노튜브 함유량이 많고 노출온도가 높아지면 감소 정도는 크게 나타났다. 인장강도는 탄소나노튜브가 함유되지 않은 경우 노출시간이 길어지면 감소하지만 MWCNT 함유되면 MWCNT의 보강 효과로 인해 증가하는 양상이 나타났다. 저장탄성계수, 유리전이온도, $tan{\delta}$ 피크 크기는 노출시간이 길어지면 낮게 나타나며 높은 노출온도에 300시간 이상 노출되면 두 개의 피크를 갖는 $tan{\delta}$ 선도가 나타났다.

• Journal of Biosystems Engineering
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• 제19권4호
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• pp.358-368
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• 1994

Major factors in reducing the stacking strength of corrugated fiberboard boxes in cold storage or transport conditions are high relative humidity, causing elevated moisture absorption by the boxes. The bottom boxes in a stack will deform to the critical deflection causing agricultural products damage there, and eventually additional deflection will cause box collapse and finally toppling of the stack. The study was conducted to determine the water absorption characteristics and the compressive strength of the corrugated fiberboard boxes being widely used in packaging agricultural products in Korea. The sample boxes for the study were selected from the regular slotted containers (RSC) types, and one was the box used in apple packaging (Box A), another one was the box used in pear packaging (Box B). The corrugated shipping containers were made from a large portion of recycled fibers in Korea, and comparing with Box B, Box A was fabricated from fiberboard which contained more percentage of old corrugated containers (OCC) imported from foreign countries than domestic waste paper. The results obtained from the study were summarized as follows ; 1. Equilibrium moisture content (EMC) of the sample boxes was established after about 20 hours, and the EMC by absorption was lower than that by desorption. The EMC increased with the increasing of relative humidity and with the decreasing of temperature, and the rate of increasing was much higher above the relative humidity of 50%. 2. The maximum compressive strength of Box A was about 100 kgf greater than that of Box B on the same enviromental conditions. The strength of the sample boxes decreased rapidly with the increasing of relative humidity. The effect of relative humidity on the strength was a little higher than that of temperature. 3. As the applied load was progressively increased and a level was reached, the vertical side panels ($L{\times}D$) deflected laterally inwards or outwards. The panels deflected laterally inwards at higher relative humidity. 4. The maximum compressive deflection ratio and the critical deflection ratio of the sample boxes were increased linearly with the increasing of relative hunidity, but trends for its ratios showed inconsistant response to temperature.

• Journal of Welding and Joining
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• 제31권5호
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• pp.59-63
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• 2013

A bendable electronic module has been developed for a mobile application by using a low-cost roll-to-roll manufacturing process. In flexible embedded electronic module, a thin silicon chip was embedded in a polymer-based encapsulating adhesive between flexible copper clad polyimide layers. To confirm reliability and durability of prototype bendable module, the following tests were conducted: Moisture sensitivity level, thermal shock test, high temperature & high humidity storage test, and pressure cooker tester. Those experiments to induce failure of the module due to temperature variations and moisture are the experiment to verify the reliability. Failure criterion was 20% increase in bump resistance from the initial value. The mechanism of the increase of the bump resistance was analyzed by using non-destructive X-ray analysis and scanning acoustic microscopy. During the pressure cooker test (PCT), delamination occurred at the various interfaces of the bendable embedded modules. To investigate the failure mechanism, moisture diffusion analysis was conducted to the pressure cooker's test. The hygroscopic characteristics of the encapsulating polymeric materials were experimentally determined. Analysis results have shown moisture saturation process of flexible module under high temperature/high humidity and high atmosphere conditions. Based on these results, stress factor and failure mechanism/mode of bendable embedded electronic module were obtained.

• 한국전산구조공학회:학술대회논문집
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• 한국전산구조공학회 1999년도 봄 학술발표회 논문집
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• pp.19-26
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• 1999

This paper deals with the stress singularity induced at the interface corner between the viscoelastic thin film and the rigid substrate as the film absorbs moisture from the ambient environment. The rime-domain boundary element method is employed to investigate the behavior of interface stresses. The order of the free-edge singularity is obtained numerically for a given viscoelastic model. It is shown that the free-edge stress intensity factor is relaxed with time,'while the order of the singularity increases with time for the viscoelastic model considered.

• 한국조명전기설비학회:학술대회논문집
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• 한국조명전기설비학회 2004년도 춘계학술대회 논문집
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• pp.86-89
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• 2004

Recently polymer arresters are being used widely but we don't have appropriate long term characteristics test methods. Therefore we need to develop special test facility to evaluate long term reliability of polymer arresters. It's polymeric housing can be degraded by environmental stress and the interface between housing and inner module can be affected by moisture absorption. This moisture absorption can cause leakage current and tracking in the interface. We developed multi stress accelerated ageing test facility to simulate field conditions including UV, temperature, humidity, voltage, salt fog and rain. In addition, we carried out field exposure test at the outdoor test yard and characteristics analysis of field operated specimens to evaluate accelerating factor of this accelerated aging test.

• 한국식품영양학회지
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• 제33권6호
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• pp.666-671
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• 2020

To analyze the quality characteristics of soybean (Glycine max), the approximate analysis, physical properties, mineral and free sugar content of domestic soybean cultivars were analyzed. The moisture content was about 9.15~11.84%. The fat content of Cheonga, Taekwang, and Jinpung cultivars were 17.93~18.37%, which was significantly higher than that of others. Protein content of Cheonga and Seonyu were 36.15~36.70%, significantly higher than that of others. As for the weight and shape of soybeans, the Daewon was the largest allele, and the seed cover ratio was the highest in the Seonyu. In terms of water absorption rate, the Seonyu showed the highest absorption rate at 246.19%, and the Daewon showed the lowest absorption rate. Soaked soybeans had a hardness of 2.80~4.73 kg/㎠, which did not show low hardness in the sample with high moisture absorption. The grinded soybeans showed higher lightness and yellowness values than the raw soybeans, and the redness was decreased. Soybean minerals contained high K, P, Mg, and Ca content. Overall, The Taekwang contained more minerals than others. Stachyose, sucrose, glucose and fructose were detected as free sugars in soybeans. The total free sugar content of Taekwang was the lowest at 3.47%, and the Cheonga (6.80%) was the highest.

• 한국콘크리트학회:학술대회논문집
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• 한국콘크리트학회 2009년도 춘계 학술대회 제21권1호
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• pp.299-300
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• 2009

본 연구는 시멘트 모르타르의 함수 상태에 따라 표면으로부터 내부로의 수분거동인 물흡수량, 물흡수속도 및 침투깊이 특성을 고찰하는데 그 목적이 있다.

• 한국신뢰성학회:학술대회논문집
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• 한국신뢰성학회 2001년도 정기학술대회
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• pp.239-244
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• 2001

Today, Ultrasonic is used as an important non-destructive test tool of semiconductor reliability evaluation and failure analysis. The semiconductor packaging trend goes to develop thin package, this trend makes difficult to inspect to defect in semiconductor package. One of the important problem in all semiconductor is moisture absorption in the atmosphere. This moisture causes crack or delamination to package when the semiconductor package is soldered on PCB. Reliability evaluation of semiconductor's object is investigating the effect of this moisture. For that reason, this study is investigating the effect of this moisture and reliability evaluation of semiconductor after preconditioning test and scanning acoustic microscope.