• Economic and Environmental Geology
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• v.49 no.3
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• pp.213-224
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• 2016

Non-conventional resource and alternative energy were researched for predicting oil peak. In this study, one of many non-conventional resources, specifically oil-sands, was investigated due to the increasing interest of oil-sands plant modularization in permaforst areas for reducing the construction periods through modular transportation while limiting local construction workers. Hence, tehcnological trends were analyzed for oil-sand plant modularization. Data used were between 1994 and 2015 for patent analysis while targets included Korea, US, Japan, Europe and Canada. Technology classification system consisted of mining, steam assisted gravity drainage(SAGD), separation/upgrading/tailors ponds, module design/packaging, module transportation and material/maintenance. Result of patent analysis, patent application accounts 89% in US and Canada. The main competitive companies were Shell, Suncor and Exxon-mobil. Unlike other oil developments, oil-sands have a long-term stable production characteristic, hence, it is important to ensure the competitiveness of oil-sands for obtaining a patent in the long run.

• Journal of the Korea Convergence Society
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• v.9 no.10
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• pp.257-263
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• 2018

The purpose of this study is to develop an automatic inspection system for a part of the differential drive gear into the transmission. This technology will make using the microvision automatic test equipment and automatic test equipment microlaser. This is that the operator intends to make the defect rate 0 in the inspection stage of the product which has been carelessly processed. The equipment developed in this research project will be applied to many areas. Packaging companies, nut bolt processing company, precisely supplier for printing on top of the semiconductor, SMT, etc. The company wants to sell the vision inspection equipment for various applications. If the defective rate of 0 is achieved through this research project, it is also possible to secure a stable supply from the parent company, and to lay the foundations for exporting based on product reliability. When the automatic inspection system is applied to domestic automobile parts processing companies, the reliability of automobiles in Korea will be greatly increased.

• Journal of the Korean Society of Radiology
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• v.8 no.7
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• pp.371-376
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• 2014

The process of flip-chip bump bonding, Au wire bonding and encapsulation were sucessfully developed and modularized. The CdTe sensor and ROIC were optimally jointed together at $150^{\circ}C$ and $270^{\circ}C$ respectively under24.5 N for 30s. To make SnAg bump on ROIC easy to be bonded, the higher bonding temperature was established than CdTe sensor's. In addition, the bonding pressure was lowered minimally because CdTe Sensor is easier to break than Si Sensor. CdTe multi-energy sensor module observed were no electrical failures in the joints using developed flip chip bump bonding and Au wire bonding process. As a result of measurement, shearing force was $2.45kgf/mm^2$ and, it is enough bonding force against threshold force, $2kgf/mm^2s$.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.7
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• pp.929-933
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• 2010

Four-point bending tests were performed to investigate the interfacial adhesion of Cu-Cu bonding fabricated by thermo-compression process for three dimensional packaging. A pair of Cu-coated Si wafers was bonded under a pressure of 15 kN at $350^{\circ}C$ for 1 h, followed by post annealing at $350^{\circ}C$ for 1 h. The bonded wafers were diced into $30\;mm\;{\times}\;3\;mm$ pieces for the test. Each specimen had a $400-{\mu}m$-deep notch along the center. An optical inspection module was installed in the testing apparatus to observe crack initiation at the notch and crack propagation over the weak interface. The tests were performed under a fixed loading speed, and the corresponding load was measured. The measured interfacial adhesion energy of the Cu-to-Cu bonding was $9.75\;J/m^2$, and the delaminated interfaces were analyzed after the test. The surface analysis shows that the delamination occurred in the interface between $SiO_2$ and Ti.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.38 no.10
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• pp.687-698
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• 2001

This paper presents a three dimensional stacked pad area away (PAA) package configuration as an implementation method of radio frequency (RF) circuits. 224MHz RF circuits of intelligence traffic system(ITS) were constructed with the stacked PAA RF pakage configuration. In the process of manufacturing the stacked PAA RF pakage, RF circuits were partitioned to subareas following their function and operating frequency. Each area of circuits separated to each subunits. The operating characteristics of RF PAA package module and the electrical properties of each subunits were examined. The measurement of electrical parameters for solder balls which were interconnects for stacked PAA RF packages showed that the parasitic capacitance and inductance were 30fF and 120pH, respectively, which might be negligible in PAA RF packaging system. HP 4396B network/spectrum analyzer revealed that the amplification gain of a receiver and transmitter at 224 MHz was 22dB and 27dB, respectively. The gain was 3dB lower than designed values. The difference was probably generated from fabrication process of the circuits by employing commercial standard

• Korean Journal of Optics and Photonics
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• v.8 no.6
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• pp.510-515
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• 1997

Packaging takes an extremely important element of optical module cost due primarily to the added complication of alignment between semiconductor devices and optical fiber, and many efforts have been devoted on reducing the cost by eliminating the complicated optical alignment procedures in passive manner. In this study, we fabricated silicon optical benches on which the optical alignments are accomplished passively. To improve the positioning accuracy of a flip-chip bonded LD, we adopted fiducial marks and solder dams which are self-aligned with V-groove etch patterns, and a stand-off to control the height and to improve the heat dissipation of LD. Optical sub-assemblies exhibited an average efficiency of -11.75$\pm$1.75 dB(1$\sigma$) from the LD-to-single mode fiber coupling and an average sensitivity of -35.0$\pm$1.5 dBm from the fiber and photodetector coupling.