• Journal of the Korean Society of Surveying, Geodesy, Photogrammetry and Cartography
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• v.39 no.6
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• pp.507-513
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• 2021

GPR (Ground Penetrating RADAR) is a sensor that inspects the pavement state of roads, sinkholes, and underground pipes. It is widely used in road management. MMS (Mobile Mapping System) creates a detailed and accurate road map of the road surface and its surroundings. If both types of data are built in the same area, it is efficient to construct both ground and underground spatial information at the same time. In addition, since it is possible to grasp the road and important facilities around the road, the location of underground pipelines, etc. without special technology, an intuitive understanding of the site is also possible, which is a useful tool in managing the road or facilities. However, overseas equipment to which this latest technology is applied is expensive and does not fit the domestic situation. LiDAR (Light Detection And Raging) and GNSS/INS (Global Navigation Satellite System / Inertial Navigation System) were synchronized in order to replace overseas developed equipment and to secure original technology to develop domestic equipment in the future, and GPR data was also synchronized to the same GNSS/INS. We developed software that performs georeferencing using the location and attitude information from GNSS/INS at the time of acquiring synchronized GPR data. The experiments were conducted on the road site by dividing the open sky and the non-open sky. The road and surrounding facilities on the ground could be easily checked through the 3D point cloud data acquired through LiDAR. Georeferenced GPR data could also be viewed with a 3D viewer along with point cloud data, and the location of underground facilities could be easily and quickly confirmed through GPR data.

• The Sea:JOURNAL OF THE KOREAN SOCIETY OF OCEANOGRAPHY
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• v.29 no.1
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• pp.14-27
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• 2024

Unlike the shelf sand ridges moribund in motion, nearshore sand ridges are highly mobile, sensitive to changes in ocean environments, thereby becoming of particular interest with respect to morphological changes. About 5 km off the Daesan port, the Jangan Sand Ridge has been undergoing severe subsea morphological change over the past two decades. Understanding the nature of sand ridges is critical to elucidate the causes of morphological changes. In this context, this study aims at understanding the characteristics and distribution patterns of surface sediments of the ridge and its vicinity. For this purpose, 227 sediment samples were acquired using a grab-sampler, the grain sizes being analysed by the sieve-pipette method. In addition, comparison of grain sizes in sediments between 1997 and 2021 was made in order to investigate the 25-years change in sediment composition. Surface sediments along the ridge axis are fine to medium sands with 2-3 phi in mean grain size, whereas, in the trough of ridge, the sediments are composed of gravels and muddy sandy gravels with mean sizes of -2 to -6 phi. Sediments in the crest of the ridge are well-sorted with normal distribution, on the other hand, the basal sediments are poorly-sorted and positively skewed. Along the ridge crest, the sediments are negatively skewed. From 1997 to 2021, the ridge sediments became largely coarser about 0.5 phi. Such coarsening trend in mean grain size can be explained either by elimination of fine sediments during high waves in winter or elimination of fines suspended during sand mining activities in the past. Spatial distribution pattern of surface sediments shows that ca. 30 m thick of the sand ridge itself overlies the thin relict gravels. The strong asymmetry of sand ridge, the exposure of ridge base, and reworked gravel lags suggest that Jangan sand ridge is probably sediment-deficit and hence erosive in nature at present.

• The Journal of Korean Academy of Prosthodontics
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• v.52 no.4
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• pp.346-351
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• 2014

Suction dentures enhance retention and support by forming negative pressure temporarily at the internal surface of denture base at times of swallowing and chewing because the areas surrounding the denture flanges are sealed by mobile mucosa. In this case, an 81-year-old male visited for new dentures. Considering the high expectations for retention and masticatory efficiency of dentures, fabricating complete dentures with suction dentures was planned. Preliminary impression was taken without applying pressure on retromolar pad area and diagnostic cast was fabricated. Afterwards, individual tray was made and final impression was taken, at the same time, gothic arch tracing was done to acquire centric relation and vertical dimension. Then, anatomic teeth were placed on maxilla and non-anatomic teeth were placed on mandible forming lingualized occlusion. Consequently, restoring a complete edentulous patient with complete dentures using mandibular suction denture resulted in recovering satisfying retention and function.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Economic and Environmental Geology
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• v.30 no.6
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• pp.587-601
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• 1997

This study had three purposes: (1) to investigate the enrichment levels and dispersion patterns of potentially toxic elements in the rock-soil-plant system; (2) to evaluate the uptake ratios of heavy metals from soils into plants and (3) to assess the chemical speciation of heavy metals in soils. Rock, surface soil and plant samples were collected in the Boeun area underlain by black shales of the Okchon Zone. These samples were analyzed for multi-elements using INAA, ICP-AES and AAS. The maximum abundance of U in black shales is 16 mg/kg and radioactivity counts up to 300 cpm. In particular, Mo, V, Ba, Cd, Pb and U are enriched in black shales. Most of soils derived from black shales show high concentrations of U, As, Mo, Ba, Cu, Cd, Pb, Zn and mean concentrations of As and Mo in soils (20 mg/kg of As and 6.6 mg/kg of Mo) are higher than the permissible level suggested by Kloke (1979). Enrichment index values of soils are calculated and higher than 1.0 in the black shale area with the highest value of 6.4. Mean concentration of Cd in plants is higher than those of Cu, Pb and Zn. The concentration of Cd in plant species decreases in the order of Chinese cabbage > red pepper > soybean=sesame > rice stalk > com > rice grain. The biological absorption coefficients (BAC) in plants are in the order of Cd > Zn=Cu > Pb, which suggests that Cd is more bioavailable to plants than Cu, Pb and Zn. From the results of sequential extraction analysis of soils, relatively high proportion of Cu, Pb and Zn are present as residual fractions whereas that of Cd as non-residual fractions. Cadmuim occurs predominantly as exchangeable/water-acid soluble phase in soils, and Cd is more mobile and bioavailable than Cu, Pb and Zn.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.28 no.5
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• pp.344-349
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• 2015

A new information society of late has arrived by the rapid development of various information & communications technologies. Accordingly, mobile devices which are light and thin, easy and convenient to carry on the market. Also, the requirements for the larger television sets such as fast response speed, low-cost electric power, wider visual angle display are sufficiently satisfied. The currently most widely studied display material, the Organic Light-emitting Diodes(OLEDs) overwhelms the Liquid Crystal Display(LCD), the main occupier of the market. This new material features a response speed of more than a thousand times faster, no need of backlight, a low driving voltage, and no limit of view angle. And the OLEDs has high luminance efficiency and excellent durability and environment resistance, quite different from the inorganic LED light source. The OLEDs with simple device structure and easy produce can be manufactured in various shapes such as a point light source, a linear light source, a surface light source. This will surely dominate the market for the next generation lighting and display device. The new display utilizes not the glass substrate but the plastic one, resulting in the thin and flexible substrate that can be curved and flattened out as needed. In this paper, OLEDs device was produced by changing thickness of Teflon-AF of hole injection material layer. And as for the electrical properties, the four layer device of ITO/TPD/$Alq_3$/BCP/LiF/Al and the five layer device of ITO/Teflon AF/TPD/$Alq_3$/BCP/Lif/Al were studied experimentally.

• Journal of Korean Society for Atmospheric Environment
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• v.29 no.5
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• pp.656-667
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• 2013

The non-exhaust coarse, fine, and ultrafine particles were characterized by on-road driving measurements using a mobile sampling system. The on-road driving measurements under constant speed driving revealed that mass concentrations of roadway particles (RWPs) were distributed mainly in a size range of 2~3 ${\mu}m$ and slightly increased with increasing vehicle speed. Under braking conditions, the mode diameters of the particles were generally similar with those obtained under constant speed conditions. However, the PM concentrations emitted during braking condition were significantly higher than those produced under normal driving conditions. Higher number concentrations of ultrafine particles smaller than 70 nm were observed during braking conditions, and the number concentration of particles sampled 90 mm above the pavement was 6 times higher than that obtained 40 mm above the pavement. Under cornering conditions, the number concentrations of RWPs sampled 40 mm above the pavement surface were higher than those sampled 90 mm above the pavement. This might be explained that a nucleation burst of a lot of vapor evaporated from the interaction between the tire and the road pavement under braking conditions continuously occurred by cooling during the transport to the sampling height 90 mm, while, for the case of cornering situations, the ultrafine particle formation was completed before the transport to the sampling height of 40 mm.

• Journal of the Korean Ceramic Society
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• v.56 no.6
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• pp.526-533
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• 2019

Indialite/cordierite glass-ceramics demonstrate excellent microwave dielectric properties such as a low dielectric constant of 4.7 and an extremely high quality factor Qf of more than 200 × 10³ GHz when crystallized at 1300℃/20 h, which are essential criteria for application to 5G/6G mobile communication systems. The glass-ceramics applied to dielectric resonators, low-temperature co-fired ceramic (LTCC) substrates, and direct casting glass substrates are reviewed in this paper. The glass-ceramics are fabricated by the crystallization of glass with cordierite composition melted at 1550℃. The dielectric resonators are composed of crystallized glass pellets made from glass rods cast in a graphite mold. The LTCC substrates are made from indialite glass-ceramic powder crystallized at a low temperature of 1000℃/1 h, and the direct casting glass-ceramic substrates are composed of crystallized glass plates cast on a graphite plate. All these materials exhibit excellent microwave dielectric properties.

• Journal of the Korean Society of Groundwater Environment
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• v.2 no.1
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• pp.22-29
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• 1995

Mobile bacterial particles can act as carriers and enhance the transport of hydrophobic contaminants in ground water by reducing retardation effects. Because of their colloidal size and favorable surface conditions, bacteria can act as efficient contaminant carriers. When such carriers exist in a porous medium, the system can be thought of as three phases: an aqueous phase, a carrier phase, and a stationary solid matrix phase. Contaminant can be present in either or all of these phases. In this study, a mathematical model based on mass balances is developed to describe the transport and fate of biodegradable contaminant in a porous medium. Bacterial mass transfer mechanism between aqueous and solid matrix phases, and contaminant mass transfer between aqueous and bacterial phases are represented by kinetic models. Governing equations are non-dimensionalized and solved to analyze the bacteria facilitated contaminant transport. The numerical results of the facilitation effect match favorably with experimental data reported in the literature. Results show that the contaminant transport can be described by local equilibrium assumption when Damkohler numbers are larger than 10. Significant sensitivities to model parameters, particularly bacterial growth rate and influent bacterial concentration, were discovered.