• Title/Summary/Keyword: Mo-Cu alloy

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Thermal Property of Mo-5~20 wt%. Cu Alloys Synthesized by Planetary Ball Milling and Spark Plasma Sintering Method (유성볼밀링 및 스파크 플라즈마 소결법으로 제조한 Mo-5~20 wt%. Cu 합금의 열적 특성)

  • Lee, Han-Chan;Moon, Kyoung-Il;Shin, Paik-Kyun
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.29 no.8
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    • pp.516-521
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    • 2016
  • Mo-Cu alloys have been widely used for heat sink materials, vacuum technology, automobile, and many other applications due to their excellent physical and electric properties. Especially, Mo-Cu composites with 5 ~ 20 wt.% copper are widely used for the heavy duty service contacts due to their excellent properties like low coefficient of thermal expansion, wear resistance, high temperature strength, and prominent electrical and thermal conductivity. In most of the applications, highly-dense Mo-Cu materials with homogeneous microstructure are required for better performance. In this study, Mo-Cu alloys were prepared by PBM (planetary ball milling) and SPS (spark plasma sintering). The effect of Cu with contents of 5~20 wt.% on the microstructure and thermal properties of Mo-Cu alloys was investigated.

Microstructure and Fracture Strength of Si3N4 Joint System (질화 규소 접합체의 미세구조와 파괴 강도에 관한 연구)

  • 차재철;강신후;박상환
    • Journal of the Korean Ceramic Society
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    • v.36 no.8
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    • pp.835-842
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    • 1999
  • Si3N4 -Si3N4 joints were made using Ag-Cu-Ti and Ag-Cu-In-Ti via brazing method and the change in joint strength was investigated after heat treatment at $400^{\circ}C$ or $650^{\circ}C$ for up to 2000h. The initial strength of as-brazed joints with Ag-Cu-In-Ti was lower but the reduction of the strength was less dramatic than that with Ag-Cu-Ti. The joints made of a new brazing alloy Au-Ni-Cr-Mo-Fe which is developed for high temperature applications were heat-treated at $650^{\circ}C$ for 1000h. As the heat treatment time increased the bond strength increased. The results of the joining system with Mo or Cu interlayer showed that the strength of the joint with Mo interlayer was higher but the system incurred problems in joint production Also it was found from oxidation experiment that Ti and In affected the oxidation resistance of brazing alloy.

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The Effects of Thermal Degradation and Creep Damage on the Microstructure and Composition of the Carbides in the CrMo Steels for Power Plant (발전 설비용 CrMo강의 탄화물 구조와 조성 변화에 미치는 열화 및 크리프 손상의 영향)

  • Ju, Yeon-Jun;Hong, Gyeong-Tae;Lee, Hyeon-Ung;Sin, Dong-Hyeok;Kim, Je-Won
    • Korean Journal of Materials Research
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    • v.9 no.10
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    • pp.1018-1024
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    • 1999
  • The effects of operating temperature and stress on degradation of components in high temperature steam generator were investigated. Several 2.25CrlMo tubes which had operated over 20 years and an unused 9CrlMoVNb tube were tested. For the former samples, the amount of $\textrm{M}_{6}\textrm{C}$ carbide and its size are increased with the aging or operating time. The precipitation behavior of carbides ($\textrm{M}_{2}\textrm{O}$, $\textrm{M}_{6}\textrm{C}$) is changed with the operating temperature of the tubes. However, unused 9CrlMoVNb samples show a different carbide precipitation process due to high chromium, vanadium, and niobium contents. The amount of Cr-rich $\textrm{M}_{23}\textrm{C}_{6}$ carbide is significantly increased with aging time, but that of $\textrm{M}_{6}\textrm{C}$ type carbide is rarely changed with aging time at elevated temperatures.

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Bending Fatigue Reliability Improvements of Cu Interconnects on Flexible Substrates through Mo-Ti Alloy Adhesion Layer (Mo-Ti 합금 접착층을 통한 유연 기판 위 구리 배선의 기계적 신뢰성 향상 연구)

  • Lee, Young-Joo;Shin, Hae-A-Seul;Nam, Dae-Hyun;Yeon, Han-Wool;Nam, Boae;Woo, Kyoohee;Joo, Young-Chang
    • Journal of the Microelectronics and Packaging Society
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    • v.22 no.1
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    • pp.21-25
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    • 2015
  • Bending fatigue characteristics of Cu films and $8{\mu}m$ width Cu interconnects on flexible substrates were investigated, and fatigue reliability improvement was achieved through Mo-Ti alloy adhesion layer. Tensile bending fatigue reliability of Cu interconnects is 3 times lower than that of Cu films, and even compressive bending fatigue reliability of Cu interconnects is 6 times lower than that of Cu films. From these results, mechanical crack formation could be fatal in Cu interconnects. With Mo-Ti adhesion layer, fatigue reliability of Cu films and interconnects were enhanced due to the increase of adhesion strength and the suppression of slip induced crack initiation.

Magnetic Properties of ${\alpha}-Fe$ Based Nd-Fe-B Melt-Spun Alloys (${\alpha}-Fe$ 기 Nd-Fe-B 급속응고합금의 자기특성)

  • 조용수;김윤배;박우식;김희태;김창석;김택기
    • Journal of the Korean Magnetics Society
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    • v.4 no.2
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    • pp.122-125
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    • 1994
  • The magnetic properties of Nd-Fe-B alloys of containing 4 at.% Nd have been studied for the development of new type rare-earth magnets. The amorphous phase of a melt-spun $Nd_{4}Fe_{85.5}B_{10.5}$ alloy is transformed into the phases which have a small amount of $Nd_{2}Fe_{14}B_{1}$ in ${\alpha}-Fe$ matrix by annealing above their crystallization temperature. The addition of Mo, Nb, V or Cu to $Nd_{4}Fe_{85.5}B_{10.5}$ alloy results in the reduction of grain size and the sub¬sequent improvement of the coercivity. The coercivity of $Nd_{4}Fe_{82}B_{10}M_{3}Cu_{1}$(M = Mo, Nb, V) alloys increases in the order of M = V < Nb < Mo and shows the highest value of 2.7 kOe when M = Mo. On the other hand, the rem¬anence of these alloys shows the opposite trend and the rn>st improved value of 1.35 T is observed when M = V.

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Superfine-Nanocomposite Mo - Cu Powders Obtained by Using Planetary Ball Milling

  • Lee, Han-Chan;Moon, Kyoung-Il;Shin, Paik-Kyun;Lee, Boong-Joo
    • Journal of the Korean Physical Society
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    • v.73 no.9
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    • pp.1340-1345
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    • 2018
  • Mo-10 at.% Cu nanocomposite powders were fabricated by using planetary ball-milling (PBM), a mechanical alloying technique for preparing nanocomposite alloy powders of metals with mutual insolubility, and the variations in the physical and the chemical characteristics with the process conditions were investigated. We observed that Mo-10 at.% Cu was an appropriate composition to ensure a good alloying grade and minimal welding between particles. The influences of the temperature and the milling conditions on the mechanical alloying process and the phase change of Mo-10 at.% Cu composite powders were investigated, and the particle and the grain sizes of the powders after mechanical alloying were confirmed. The Mo-10 at.% Cu powders showed homogeneous elemental distributions and no phase changes up to $1200^{\circ}C$; their compositions were retained after the mechanical alloying process. The finest grain size obtained was about 5 nm for powders processed using optimum PBM processing conditions: ball-to-powder weight ratio of 5 : 1, ambient air atmosphere, a milling time of 20 h, a rotation speed of 200 rpm, and a stearic acid content of 4 wt.% produced superfine-grained Mo-10 at.% Cu nanocomposite powders with an average grain size of 5 nm (which is smaller than that of other similar materials reported in the literature). The analytical results confirmed that the PBM technique presented here is a promising method for preparing superfine-grained Mo-10 at.% Cu powders with improved properties.

Adhesion Improvement for Copper Process in TFT-LCD

  • Tu, Kuo-Yuan;Tsai, Wen-Chin;Lai, Che-Yung;Gan, Feng-Yuan;Liau, Wei-Lung
    • 한국정보디스플레이학회:학술대회논문집
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    • 2006.08a
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    • pp.1640-1644
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    • 2006
  • The first issue that should be overcome in copper process is its poor adhesive strength between pure copper film and glass substrate. In this study, defining the adhesive strength of pure copper film on various substrates and clarifying the key deposition parameters are presented for the investigation of copper process. First, using different kinds of surface plasma treatments were studied and the results showed that the adhesive strength was not improved even though the roughness of glass substrate surface was increased. Second, adding an adhesive layer between glass substrate and pure copper film was used to enhance the adhesion. Based on the data in the present paper, adopting copper alloy film as an adhesive layer can have capability preventing peeling problem in copper process. Besides, Cu/Cu alloy structure could be etched with the same etchant with better taper angle than the one with single layer of Cu. Unlike Cu/Mo structure, there is no residual problem for Cu/Cu alloy structure during etching process. Finally, this structure was examined in electrical test without significant difference in comparison with the conventional metal process.

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Formation of Non-equilibrium Cu-Ta-Mo Alloy Powders by Mechanical Alloying (기계적 합금화법에 의한 비평형 Cu-Ta-Mo계 합금분말의 제조)

  • 이충효;이상진
    • Journal of Powder Materials
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    • v.6 no.4
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    • pp.314-319
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    • 1999
  • The solid state reaction by mechanical alloying(MA) generally proceeds by lowering the free energy as the result of a chemical reaction at the interface between the two adjacent layers. However, Lee et $al.^{1-5)}$ reported that a mixture of Cu and Ta, the combination of which is characterized by a positive heat of mixing of +2kJ/mol, could be amorphized by mechanical alloying. This implies that there exists an up-hill process to raise the free energy of a mixture of pure Cu and la to that of an amorphous phase. It is our aim to investigate to what extent the MA is capable of producing a non-equilibrium phase with increasing the heat of mixing. The system chosen was the ternary $Cu_{30}Ta_{ 70-x}Mo_ x$ (x=35, 10). The mechanical alloying was carried out using a Fritsch P-5 planetary mill under Ar gas atmosphere. The MA powders were characterized by the X-ray diffraction with Cu-K $\alpha$ radiation, thermal analysis, electron diffraction and TEM micrographs. In the case of x=35, where pure Cu powders were mixed with equal amount of pure Ta and Mo powders, we revealed the formation of bcc solid solution after 150 h milling but its gradual decomposition by releasing fcc-Cu when milling time exceeded 200 h. However, an amorphous phase was clearly formed when the Mo content was lowered to x=10. It is believed that the amorphization of ternary $Cu_{30}Ta_{60}Mo_{10}$ powders is essentially identical to the solid state amorphization process in binary $Cu_{30}Ta_{70}$ powders.

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Magnetic Properties of Three-layered Ferromagnetic Films with a NiFeCuMo Intermediately Super-soft Magnetic Layer (강자성층 사이에 초연자성 NiFeCuMo 중간층을 삽입한 3층 박막구조의 자기적 특성)

  • Choi, Jong-Gu;Lee, Sang-Suk
    • Journal of the Korean Magnetics Society
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    • v.20 no.4
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    • pp.129-133
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    • 2010
  • Two-layered ferromagnetic alloy films (NiFe, CoFe) with a Conetic (NiFeCuMo) intermediately soft magnetic layer of different thickness were investigated to correlate the coercivity values and magnetization process with the strength of saturation field of hard axis. Thickness dependence of the $H_{EC}$ (coercivity of easy axis), $H_{HS}$ (saturation field of hard axis.), and X (susceptibility) of NiFe and NiFeCuMo thin films for the glass/Ta(5 nm)/[CoFe or NiFe(5 nm-t/2)]/NiFeCuMo(t = 0, 4, 6, 8, 10 nm)/[CoFe or NiFe(5 nm-t/2)]/Ta(5 nm) films prepared by the ion beam deposition method was measured. The magnetic properties $H_{EC}$, $H_{HS}$, and X of two-layered ferromagnetic CoFe, NiFe films with a NiFeCuMo intermediately super-soft magnetic layer were strongly depended on the thickness of NiFeCuMo layer. The value of the coercivity and magnetic susceptibility of the NiFeCuMo film decreased by 25% and doubled relative to that of the NiFe film.