• Geotechnical Engineering
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• v.9 no.4
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• pp.55-64
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• 1993

The Undrained creep tests on the normally consolidated clays with four different consolication ratios(c3c'/clc': 1.0, 0.7, 0.5, 0.4) were performed to investigate the effects of avisotropic consolidation on the undrained creep rupture behavior. The elapsed time to a certain minimum strain rate is decreased with decreasing the value of the consolidation pressure ratio, and the elapsed time to rupture for a certain minimum strain rate is also decreased with decreasing the ratio. The upper yield strength obtained from the equation suggested by Finn and Shead(1.) is coincided well with the creep strength irrespective of the magnitude of the consolidation pressure ratio, and the normallised upper yielding strength by mean confining pressure is decreased with increasing the consolidation pressure ratio. The critical strain for creep rupture, the strain at min. strain rate, is constant irrespective of the magnitude of creep stress, but it increased exponentially with increasing the ratio, It accordingly is dangerous that the potential of in-situ creep rupture is estimated only by the creep rupture test on the isotropically consolidated clay in case of K0-value below 1.0.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.16 no.5
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• pp.151-156
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• 2007

In this paper, the creep characteristics of lead and lead-free solder joint were investigated using the QFP(Quad Flat Package) creep test. Two kind of solder pastes(Sn-3Ag-0.5Cu, Sn-0.2Sb-0.4Ag-37.4Pb) were applied to the QFP solder joints and each specimen was checked the external and internal failures(i.e., wetting failure, void, pin hole, poor-heel fillet) by digital microscope and X-ray inspection. The creep test was conducted at the temperatures of $100^{\circ}C$ and $130^{\circ}C$ under the load of 15$\sim$20% of average pull strength in solder joints. The creep characteristics of each solder joints were compared using the creep strain-time curve and creep strain rate-stress curves. Through the comparison, the Sn-3Ag-0.5Cu solder joints have higher creep resistance than that of Sn-0.3Sb-0.4Ag-37.4Pb. Also, the grain boundary sliding in the fracture surface and the necking of solder joint were observed by FE-SEM.

• 한국금형공학회:학술대회논문집
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• 2008.06a
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• pp.39-44
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• 2008

Magnesium alloys have given high attention to the industry of light-weigh as automobile and electronics with aluminium, titanium and composite alloys due to their high strength, low specific density and good damping characteristics. But the magnesium contained structures under high temperature have the problems related to creep deformation and rupture life, which is a reason of developing the new material against creep deformation to use them safely. The purpose of this study is to predict the creep deformation mechanism and rupture time of AZ31 magnesium alloy. For this, creep tests of AZ31 magnesium alloy were done under constant creep load and temperature with the equipment including automatic temperature controller with acquisition computer. The apparent activation energy Qc and the applied stress exponent n, rupture life have been determined during creep of AZ31 Mg alloy over the temperature range of $150^{\circ}C$ to $300^{\circ}C$. In order to investigate the creep behavior. Constant load creep tests were carried out in the equipment including automatic temperature controller, whose data are sent to computer. At around the temperature of $150^{\circ}C{\sim}300^{\circ}C$ the creep behavior obeyed a simple power-law relating steady state creep rate to applied stress and the activation energy for the creep deformation was nearly equal and a little low, respectively, to that of the self diffusion of Mg alloy.

• Korean Journal of Metals and Materials
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• v.48 no.9
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• pp.791-797
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• 2010

The creep crack growth rate (da/dt) of the Cr-Mo steels tested by pre-crack and the voltage (or resistance) variables were related into fracture parameter (Ct), crack growth coefficient (H), and an exponent (q) in the parts of Base, weld and HAZ. The fracture parameter (Ct) has various variables relating to the specimen and crack shape, applied stress, and creep strain curve. The H and q was inferred by OLS regression (ordinary least square method), and the H values were solved in statistics and probability assessment, which were attained fromPDF's distributions (probability density function). The HAZ part has the highest value of q by OLS regression and the widest distribution of H by PDF of WEIBULL, which means that the crack sensitivity of HAZ should be cautioned against the creep crack growth and failure.

• Proceedings of the KWS Conference
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• 2006.10a
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• pp.184-186
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• 2006

Sn-3Ag-0.5Cu is one of candidate as an alternative approach to conventional lead-tin solder. In order to evaluate that creep characteristic of QFP, we used Sn-3Ag-0.5Cu where the operating temperature is $100^{\circ}C$. The specimens were loaded to failure at average pull strength in the range of 20% to 25%, X-ray machine is used to eliminate effect of void. In this paper, relation of time-displacement and steady state creep rate was studied, and used to analyze the experimental result.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.3
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• pp.280-286
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• 2006

As a way to expand electric capacity in conductor with electric power demand, STACIR/AW (Super Thermal-resistant Aluminum-alloy Conductors Aluminum-clad Invar-Reinforced) conductor which has high electric current and heat resistance characteristics have been developed. STACIR/AW power line is mechanical composite wire composed of steel cores for dip control and aluminum conductors for sending electric current. Recently, to ensure stable operation and prediction of wire life span of STACIR/AW conductor, a heat property of STACIR/AW conductor have been investigated. In the present work, a change of essential property with long term-heat exposure of STACIR/AW conductor and its structure material, INVAR wire and Al conductor, have been investigated. INVAR/AW is approximately $3.2\;{\mu}m/m^{\circ}C$. thermal expansion coefficient of INVAR/AW wire increases with time of heat exposure. the thermal expansion coefficient of INVAR/AW is markedly influenced by heat and mechanical treatment. creep rate(0.242) of STACIR/AW $410\;mm^2$ conductor at room temperature is much higher than that(0.022) at $210\;^{\circ}C$ STACIR/AW $410\;mm^2$ conductor has minimum creep rate at operating temperature. To lower creep rate with increase temperature is more unique characteristics in STACIR/AW. It is expected that STACIR/AW turned its tension to INVAR/AW at the transition temperature. at room temperature, the tension apportionment of INVAR/AW in STACIR/AW is about $50\;\%$. but whole tension of STACIR/AW is placed on the INVAR/AW alone of core metal above transition temperature.

• Journal of Ocean Engineering and Technology
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• v.2 no.2
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• pp.104-111
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• 1988

This paper deals with the micro-surface-cracks behavior on the unnotched smooth specimens of Type 304 stainless steel at $593^{\circ}C$ in air under creep and creep-fatigue conditions that have 10 mim and 1 min load holding times respectively. The behaviors of the micro-surface-cracks have been visualized by means of surface replica method and optical micro-photography. The quantitative characteristics of initiation, growth and coalescence of micro-surface-cracks have been investigated by observing and measuring the crack growth behaviors. some of the important results are as follows: Main crack initiates at grain boundary in the early stage(10 to 20%)of its life time and grows through coalescence and finally leads to fracture. The distribution of micro-surface-crack length, 2a, can be plotted against the composite Weibull distribution. The growth rate of the main crack can be plotted against the stress intensity factor, crack tip opering displacement and J integral.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.3
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• pp.29-35
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• 2003

The Sn-based lead-free solders with varying microstructure were prepared by changing the cooling rate from the melt. Bulky as-cast SnAg, SnAgCu, and SnCu, alloys were cold rolled and thermally stabilized before the creep tests so that there would be very small amount of microstructural change during creep (TS), and thin specimens were water quenched from the melt (WQ) to simulate microstructures of the as-reflowed solders in flip chips. Cooling rates of the WQ specimens were 140∼150 K/sec, and the resultant $\beta-Sn$ globule size was 5∼10 times smaller than that of the TS specimens. Subsequent creep tests showed that the minimum strain rate of TS specimens was about $10_2$ times higher than that of the WQ specimens. Fractographic analyses showed that creep rupture of the TS-SnAgCu specimens occurred by the nucleation of voids on the $Ag_3Sn$ Sn or $Cu_6Sn_5$ particles in the matrix, their subsequent growth by the power-law creep, and inter-linkage of microcracks to form macrocracks which led to the fast failure. On the other hand, no creep voids were found in the WQ specimens due to the mode III shear rupture coming from the thin specimens geometry.

• Transactions of the Korean Society of Automotive Engineers
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• v.14 no.5
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• pp.73-78
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• 2006

In this paper, creep tests of Mg-Zn-Mn and Mg-Zn-Mn-Ca alloys, which were casted by mold with Mg-3%Zn-1%Mn and Mg-3%Zn-1%Mn-0.2%Ca, were done under the temperature range of 473-573K and the stress range of 23.42-78.00Mpa. The activation energies and the stress exponents were measured to investigate the creep plastic deformation of those alloys, and the rupture lifes of Mg-Zn-Mn alloy were also measured to investigate the fracture behavior. From the results, the activation energy of Mg-Zn-Mn and Mg-Zn-Mn-Ca alloys under the temperature range of 473-493K were measured as 149.87, 145.98KJ/mol, respectively, and the stress exponent were measured as 5.13, 6.06 respectively. Also the activation energies Mg-Zn-Mn and Mg-Zn-Mn-Ca alloys under the temperature range of 553-573K were obtained as 134.41, 129.22KJ/mol, respectively, and tress exponent were obtained as 3.48, 4.63, respectively. Finally stress dependence of rupture life and the activation energy of rupture life of Mg-Zn-Mn under the temperature range of 473-493K was measured as 8.05, 170.0(KJ/mol), respectively, which were a little higher than the results of steady state creep.

• Proceedings of the Korea Concrete Institute Conference
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• 2008.11a
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• pp.717-720
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• 2008

This study analyzed the basic characteristics and the characteristic of drying shrinkage and creep of high performance concrete complexly metathesized by BS and FA and the results are summarized as the followings. Regarding to the compressive strengths according to the passage of aging, OPC was appeared to be larger than B2F1 at the initial aging but B2F1 was appeared to be higher than OPC at aging 28days. Regarding to the changing rate of drying shrinkage according to the passage of aging, both OPC and B2F1 were appeared to be increased and, at aging 60days, B2F1 was appeared to be largely increased by about 42% as -21${\times}$10-6 및 -51${\times}$10-6 as compared to OPC. The transforming rate of creep was appeared to have been largely increased at the initial aging and then be smoothly increased somewhat as the aging was passed. And regardign to the transforming rate of creep after 60 days had been passed, B2F1 was appeared to be largely increased by about 13% as compared to OPC.