• ETRI Journal
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• v.32 no.2
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• pp.195-203
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• 2010

A new vertical transition between a substrate integrated waveguide in a low-temperature co-fired ceramic substrate and an air-filled standard waveguide is proposed in this paper. A rectangular cavity resonator with closely spaced metallic vias is designed to connect the substrate integrated waveguide to the standard air-filled waveguide. Physical characteristics of an air-filled WR-22 to WR-22 transition are compared with those of the proposed transition. Simulation and experiment demonstrate that the proposed transition shows a -1.3 dB insertion loss and 6.2 GHz bandwidth with a 10 dB return loss for the back-to-back module. A 40 GHz low-temperature co-fired ceramic module with the proposed vertical transition is also implemented. The implemented module is very compact, measuring 57 mm ${\times}$ 28 mm ${\times}$ 3.3 mm.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.17 no.10 s.113
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• pp.967-975
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• 2006

In this paper, design and implementation of a very compact and cost effective front-end module are presented for IEEE 802.16 FWA(fixed Wireless Access) in the 40 GHz band. A multi-layer LTCC(Low Temperature Co-fred Ceramic) technology with cavity process to achieve excellent electrical performances is used to fabricate the front-end module. The wirebond matching circuit design of switch input/output port and waveguide transition to connect antenna are optimally designed to keep transmission loss low. To reduce the size of the front-end module, the dielectric waveguide filter is developed instead of the metal waveguide filter. The LTCC is composed of 6 layers(with the thickness of a layer of 100 um) having a relative dielectric constant of 7.1. The front-end module is implemented in a volume of $30{\times}7{\times}0.8mm^3$ and shows an overall insertion loss < 5.3 dB, and image rejection value > 49 dB.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.30 no.6
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• pp.518-521
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• 2019

In this paper, an active antenna module operating in the 60 GHz band is designed and fabricated by combining a commercial transmitter chip and patch array antenna. The designed module is composed of an antenna PCB and a PCB with a transmitter chip. The frequency-control and bias-control signals are applied to the transmitter chip, using an Arduino kit. A baseband I/Q signal is also applied to the chip. A ring hybrid balun converts the output of the transmitter module to a single output, which is the output of the transmitter chip that outputs a differential output. The output is delivered to the $2{\times}4$ microstrip patch array antenna PCB as a micro-computer connector. The radiation pattern of the millimeter-wave signal of the final output is compared with the simulation results. The measured radiation patterns of the fabricated active antenna module confirm that the positions of the 3 dB beam width and null point agree well with the simulation results.

• Journal of electromagnetic engineering and science
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• v.18 no.3
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• pp.188-198
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• 2018

In this study, we propose an approach for the design and satisfy the requirements of the fabrication of a small, lightweight, reliable, and stable ultra-wideband receiver for millimeter-wave bands and the contents of the approach. In this paper, we designed and fabricated a stable receiver with having low noise figure, flat gain characteristics, and low noise characteristics, suitable for millimeter-wave bands. The method uses the chip-and-wire process for the assembly and operation of a bare MMIC device. In order to compensate for the mismatch between the components used in the receiver, an amplifier, mixer, multiplier, and filter suitable for wideband frequency characteristics were designed and applied to the receiver. To improve the low frequency and narrow bandwidth of existing products, mathematical modeling of the wideband receiver was performed and based on this spurious signals generated from complex local oscillation signals were designed so as not to affect the RF path. In the ultra-wideband receiver, the gain was between 22.2 dB and 28.5 dB at Band A (input frequency, 18-26 GHz) with a flatness of approximately 6.3 dB, while the gain was between 21.9 dB and 26.0 dB at Band B (input frequency, 26-40 GHz) with a flatness of approximately 4.1 dB. The measured value of the noise figure at Band A was 7.92 dB and the maximum value of noise figure, measured at Band B was 8.58 dB. The leakage signal of the local oscillator (LO) was -97.3 dBm and -90 dBm at the 33 GHz and 44 GHz path, respectively. Measurement was made at the 15 GHz IF output of band A (LO, 33 GHz) and the suppression characteristic obtained through the measurement was approximately 30 dBc.

• Journal of the Korean Magnetics Society
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• v.23 no.2
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• pp.68-76
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• 2013

Currently, wireless power transmission technology based on magnetic induction was employed in battery charger for smart phone application. The system consists of wireless power transmitter in base station and receiver in smart phone. Size and thickness of receiver was strictly limited in the newest smart phone. In order to achieve high efficiency of a tiny small wireless power receiver module, sub-millimeter thick electromagnetic wave shielding sheet having high permeability and Q was essential component. It was found that magnetic field from transmitter to receiver can be intensified by sufficient shielding cause to minimize leakage magnetic flux by those magnetic properties. This leads to high efficiency of wireless power transmission and protects crucial integrated circuit of main board from electromagnetic noise. The important soft magnetic materials were introduced and summarized for the current small-power wireless power charger and NFC application and mid-power home appliance and high-power automotive application in the near future.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.20 no.3
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• pp.264-272
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• 2009

In this paper, a Ka-band 10 W power amplifier module is designed and fabricated using MIC(Microwave Integrated Circuit) module technology which combines multiple power MMIC(Monolithic Microwave Integrated Circuit) chips on a thin film substrate. Modified Wilkinson power dividers/combiners are used for millimeter wave modules and CBFGC-PW-Microstrip transitions are utilized for reducing connection loss and suppressing resonance in the high-gain and high-power modules. The power amplifier module consists of seven MMIC chips and operates in a pulsed mode. for the pulsed mode operation, a gate pulse control circuit supplying the control voltage pulses to MMIC chips is designed and applied. The fabricated power amplifier module shows a power gain of about 58 dB and a saturated output power of 39.6 dBm at a center frequency of the interested frequency band.

• JSTS:Journal of Semiconductor Technology and Science
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• v.17 no.3
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• pp.341-346
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• 2017

In this paper, we present a 60 GHz on-off keying (OOK) modulator in a 90 nm CMOS. The modulator employs a current-reuse technique and a switching modulation for low DC power dissipation, high on/off isolation, and high data rate. The measured gain of the modulator, on/off isolation, and output 1-dB compression point is 9.1 dB, 24.3 dB, and 5.1 dBm, respectively, at 60 GHz. The modulator consumes power consumption of 18 mW, and is capable of handling data rates of 8 Gb/s at bit error rate of less than $10^{-6}$ for $231^{-1}$ PRBS over a distance of 10-cm with an OOK receiver module.

• Journal of electromagnetic engineering and science
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• v.10 no.3
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• pp.138-145
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• 2010

In this paper, we report the test results of a small-scale prototype that implements an analogue-beam-formed phased antenna array in the E-band. A four-channel dual-conversion receive RF module for 71~76 GHz frequency band has been developed and integrated with a linear end-fire antenna array. Measured performance is very close to the simulated results. An ad-hoc wireless communication system has also been demonstrated. Low BER was measured for an 8PSK data stream at 1.5 Gbps with the receive array beam formed in the direction of arrival of the transmitted signal. To our knowledge this is the first steerable antenna array reported to date in the E-band.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.32 no.4
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• pp.241-247
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• 2009

In this paper, we present a wireless RFID glove in emotional learning method. The proposed wireless RFID glove consists of three parts: RF wireless module, RFID reader, and RFID tags. Objects tagged with a small passive RFID tag, can be sensed at short ranges by using wireless RFID glove. We describe the wireless RFID glove prototype, and present some interactive learning programs and games. The proposed system can be utilized to analyze user activities and train the brain of old person.

• JSTS:Journal of Semiconductor Technology and Science
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• v.4 no.3
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• pp.189-195
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• 2004

A 10 Gb/s limiting amplifier IC with the emitter area of $1.5{\times}10{\mu}m^2$ for optical transmission system was designed and fabricated with a AIGaAs/GaAs HBTs technology. In this stud)', we evaluated fine pitch bump using WL-CSP (Wafer Level-Chip Scale Packaging) instead of conventional wire bonding for interconnection. For this we developed WL-CSP process and formed fine pitch solder bump with the $40{\mu}m$ diameter and $100{\mu}m$ pitch on bonding pad. To study the effect of WL-CSP, electrical performance was measured and analyzed in wafer and package module using WL-CSP. In a package module, clear and wide eye diagram openings were observed and the riselfall times were about 100ps, and the output" oltage swing was limited to $600mV_{p-p}$ with input voltage ranging from 50 to 500m V. The Small signal gains in wafer and package module were 15.56dB and 14.99dB respectively. It was found that the difference of small signal gain in wafer and package module was less then 0.57dB up to 10GHz and the characteristics of return loss was improved by 5dB in package module. This is due to the short interconnection length by WL-CSP. So, WL-CSP process can be used for millimeter wave GaAs MMIC with the fine pitch pad.