• Proceedings of the KIEE Conference
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• 1996.11a
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• pp.425-427
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• 1996

New fabrication technique was developed to make three dimensional silicon microstructure with five fold vertical steps through entire wafer thickness. Each step is pre-defined on multiply stacked thermal oxide and silicon nitride (O/N) layers by photolithographies. Multi-stepped silicon microstructure is formed by anisotropic etch in aqueous KOH solution with the patterned nitride film as masking layer. Fabricated microstructure consists of four $16{\mu}m$ thick flexural spring beams, $290{\mu}m$ thick proof mass, mesas for overrange stop with $10{\mu}m$ height from the surface of the proof mass, and the other mesas and V grooves used for assembling this structure to the packaging frame of pendulous servo accelerometer. Using the numerical finite element method (FEM) simulator: ABAQUS, mechanical characteristics of the fabricated microstructure by the developed technique was compared with those of the same structure processed by one step silicon bulk etch followed by oxidation and patterning the etched region.

• Journal of the Korean Society of Industry Convergence
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• v.26 no.5
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• pp.813-823
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• 2023

In this study, microstructure, hardening layer hardness, and case depth were evaluated after induction hardening(IH) of base metal specimen(BM) treated with annealing and quenching-tempering specimen(QT) treated with quenching and tempering. The microstructure after IH was significantly influenced by the microstructure before IH and the induction coil heating movement speed, but the effect of the induction frequency was very small. The hardness of the hardened layer at an induction coil heating movement speed of 15 mm/s or less was more influenced by the microstructure before IH than the induction coil travel speed and induction frequency. The induction coil travel speed has the significantly effect on the case depth, the induction frequency has effect and the microstructure before IH has a small effect.

• Korean Journal of Materials Research
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• v.27 no.11
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• pp.636-642
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• 2017

In the present study the microstructure of low-carbon steels fabricated by controlled rolling and accelerated cooling processes was characterized and identified based on various microstructure analysis methods including optical and scanning electron microscopy, and electron backscatter diffraction(EBSD). Although low-carbon steels are usually composed of ${\alpha}-ferrite$ and cementite($Fe_3C$) phases, they can have complex microstructures consisting of ferrites with different size, morphology, and dislocation density, and secondary phases dependent on rolling and accelerated cooling conditions. The microstructure of low-carbon steels investigated in this study was basically classified into polygonal ferrite, acicular ferrite, granular bainite, and bainitic ferrite based on the inverse pole figure, image quality, grain boundary, kernel average misorientation(KAM), and grain orientation spread(GOS) maps, obtained from EBSD analysis. From these results, it can be said that the EBSD analysis provides a valuable tool to identify and quantify the complex microstructure of low-carbon steels fabricated by controlled rolling and accelerated cooling processes.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.229-234
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• 2002

The variation of HAZ toughness with nitrogen content and weld cooling rate was investigated and interpreted in terms of both microstructure and the amount of free nitrogen. The presence of free nitrogen in HAZ was investigated by internal friction measurement and its amount was measured by hydrogen hot extraction analysis. Both nitrogen content and weld cooling rate influenced HAZ microstructure and high toughness was obtained at a mixed microstructure of acicular ferrite, feffite sideplate and polygonal ferrite. If nitrogen content is too low or cooling rate is too fast, bainitic microstructure is obtained and toughness is low. On the other hand, if nitrogen content is too high or cooling rate is too slow, coarse polygonal ferritic microstructure is obtained and toughness is deteriorated again. ill addition to the microstructural change, high nitrogen content also resulted in a large amount of free nitrogen. Therefore, nitrogen content should be kept as low as possible even if the mixed micostructure is obtained. In this experimental condition, the maximum toughness was obtained at 0.006% nitrogen content when weld cooling time ($\Delta$t$_{8}$5/)) is 60s.TEX>5/)) is 60s.

• Journal of the Korean Ceramic Society
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• v.42 no.9 s.280
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• pp.599-601
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• 2005

The coarsening process of two different $BaTiO_3$ single crystal seeds, one with a (111) double twin and the other without it, was investigated. Due to the presence of Twin Plane Reentrant Edge (TPRE), the coarsening rate of the twinned seed crystal was significantly higher than that without a twin. For the coarsening by the 2-dimensional nucleation and lateral growth, the energy barrier for nucleation at the TPRE was analyzed to be about a half compared with that at the terrace planes.

• Journal of the Korean Ceramic Society
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• v.42 no.8 s.279
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• pp.542-547
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• 2005

Keys to the attainment of tailored properties in SiC ceramics are microstructure control and judicious selection of the sintering additives. In this study, three different strategies for controlling microstructure of liquid-phase-sintered SiC ceramics (LPS-SiC) have been suggested: control of the initial $\alpha-SiC$ content in the starting powder, a seeding technique, and a post-sintering heat treatment. The strategies suggested offer substantial flexibility for producing toughened SiC ceramics whereby grain size, grain size distribution, and aspect ratio can be effectively controlled. The present results suggest that the proposed strategies are suitable for the manufacture of toughened SiC ceramics with improved toughness.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.4
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• pp.609-616
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• 2002

The characteristics of mechanical behavior are investigated for Ti-6Al-4V alloy. Four kinds of the specimens are prepared under different heat treatments in order to produce different microstructures. In the present investigations, impact, tensile and fatigue crack growth tests are performed for each test specimen. The results obtained through the investigations are compared. Additionally fr actal dimensions of crack pass are obtained using the box counting method. The results are, 1) the microstructures shows as equiaxed, bimodal and Widmanstatten microstructures respectively, 2) the impact energy and elongation are superior fur the bimodal microstructure, and the hardness and tensile strength are superior fur the Widmanstatten microstructure, 3) the fatigue crack growth rate is similar to all microstructures in low ΔK region while that of equiaxed microstructure is the largest, and that of Widmanstatten microstructure is the lowest in high ΔK region respectively, 4) the fractal dimension D of Widmanstatten microstructure shows higher value than that of the equiaxed and bimodal microstructures under 200 magnification view of the SEM micrographs.

• Journal of Surface Science and Engineering
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• v.28 no.2
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• pp.67-76
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• 1995

The microstructure of 95wt.%Pb/5wt.%Sn and 63wt.%Sn/37wt.%Pb solders for flip chip bonding process has been characterized. Solders were deposited by thermal evaporation and reflowed in the conventional furnace or by rapid thermal annealing(RTA) process. As-deposited films show columnar structure. The microstructure of furnace cooled 63Sn/37Pb solder shows typical lamellar form, but that of RTA treated solder has the structure showing an uniform dispersion of Pb-rich phase in Sn matrix. The grain size of 95Pb/5Sn solder reflowed in the furnace is about $5\mu\textrm{m}$, but the grain size of RTA treated solder is too small to be observed. The microstructure in 63Sn/37Pb solder bump shows the segregation of Pb phase in the Sn rich matrix regardless of reflowing method. The 63Sn/37Pb solder bump formed by RTA process shows more uniform microstructure. These result are related to the heat dissipation in the solder bump.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.8 s.173
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• pp.84-91
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• 2005

The role of microstructure is quite significant in fretting of Ti-6Al-4V since its material properties depend strongly on crystallographic texture. In this study, we adopt crystal plasticity theory with a 2-D planar triple slip idealization to account fur microstructure effects such as grain orientation distribution, grain geometry, as well as $\alpha$ colony size. Crystal plasticity simulations suggest strong implications of microstructure effects at fretting contacts.

• Carbon letters
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• v.3 no.4
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• pp.192-197
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• 2002

Microstructure plays an important role in controlling the fracture behaviour of carbon-carbon composites and hence their mechanical properties. In the present study effort was made to understand how the different interfaces (fiber/matrix interactions) influence the development of microstructure of the matrix as well as that of carbon fibers as the heat treatment temperature of the carbon-carbon composites is raised. Three different grades of PAN based carbon fibres were selected to offer different surface characteristics. It is observed that in case of high-strength carbon fiber based carbon-carbon composites, not only the matrix microstructure is different but the texture of carbon fiber changes from isotropic to anisotropic after HTT to $2600^{\circ}C$. However, in case of intermediate and high modulus carbon fiber based carbon-carbon composites, the carbon fiber texture remains nearly isotropic at $2600^{\circ}C$ because of relatively weak fiber-matrix interactions.