• Journal of the Korean Society for Precision Engineering
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• v.21 no.11
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• pp.38-45
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• 2004

This paper discusses the minimum cutting thickness with a continuous chip in sub-micrometer order precision diamond cutting. An ultra precision cutting model is proposed, in which the tool edge radius and the friction coefficient are the principal factors determining the minimum cutting thickness. The experimental results verify the proposed model and provide various supporting evidence. In order to reduce the minimum cutting thickness a vibration cutting method is applied, and the effects are investigated through a series of experiments under the same conditions as conventional cutting method.

• Current Photovoltaic Research
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• v.11 no.3
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• pp.96-102
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• 2023

Sn-Pb narrow-bandgap perovskite solar cells, which is a light-harvesting layer thicker than 1.3 micrometers, is needed to enhance the low photocurrent. The fabrication of such a thick film through solution processing is a key challenge. Here, we studied and characterized the film by using a precursor solution of increased concentration, comparing it with the universally used 1-micrometer Sn-Pb perovskite film. The increase in molar concentration clearly induced thickness enhancement, but we observed that it also created numerous voids at the interface with bottom charge transporting layer. We hypothesized that these voids might hinder the increase in photocurrent associated with thickness enhancement. By introducing methylammonium chloride (MACl), we successfully fabricated Sn-Pb perovskite film with a thickness of 1.3 micrometer and no voids. Void-controlled Sn-Pb perovskite solar cells not only demonstrated superior short-circuit current density compared to those with voids but also operated smoothly under light exposure.

• Proceedings of the KIEE Conference
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• 1988.07a
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• pp.43-46
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• 1988

In this paper, a methodology for determination of the thickness of layer on a substrate using reflection acoustic microscope has been presented. It has been shown that the amplitude and the phase of reflection coefficient of the layer-substrate composite has been used for measurement of layer thickness, acoustic velosity, mass density of the layer material. The reflection acoustic microscope operating at a frequency of 15 MHz has been used for the experiment and the measured acoustic impedance value for aluminum sample has agreed with the published data, and the measured layer thickness for silver-glass composite has agreed with that measured using micrometer.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.33 no.5
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• pp.529-535
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• 2009

This paper describes a measuring device of glass thickness using machine vision and image processing techniques on real-time. Today, the machine vision enable to inspect fast and exactly than human's eyes. The presented system has advantages of continuous measurement, flexibility and good accuracy. The system consists of a laser diode, a CCD camera with PC. The camera located on the opposite side of the incident beam measures the distance between two reflected laser beams from the glass top and bottom surface. We apply a binary algorithm to convert and analyze the image from camera to PC. Laser point coordination by border tracing algorithm is used to find the center of beam circle. The measured result was compared with micrometer and showed 0.002mm accuracy. Finally, the errors were discussed how to minimize the influence of glass wedge angle and angular error of moving stage.

• Journal of the Semiconductor & Display Technology
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• v.16 no.4
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• pp.68-74
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• 2017

Nanoimprint lithography (NIL) is a next generation technology for fabrication of micrometer and nanometer scale patterns. There have been considerable attentions on NIL due to its potential abilities that enable cost-effective and high-throughput nanofabrication to the display device and semiconductor industry. Up to now there have been a lot of researches on thermal NIL, but most of them have been focused on polymer deformation in the molding process and there are very few studies on the cooling and demolding process. In this paper a cooling process of the polymer resist in thermal NIL is analyzed with finite element method. The modeling of cooling process for mold, polymer resist and substrate is developed. And the cooling process is numerically investigated with the effects of imprinting temperature and residual layer thickness of polymer resist on stress distribution of the polymer resist. The results show that the lower imprinting temperature, the higher the maximum von Mises stress and that the thicker the residual layer, the greater maximum von Mises stress.

• Journal of the Korean Society of Fashion and Beauty
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• v.6 no.2
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• pp.73-79
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• 2008

To study of the rate of damage and morphological change when apply perm and dye according to kinds of curly hair, measured the thickness of hair and divided the samples into groups. Measured the chromaticity and thickness according to kinds of curly hair and chemical treatment with Spectrum colormeter and Micrometer. Measured the tensile strength of hair then calculated the damage rate. After tensile test, took photographs of the section and surface with the electron microscope.

• Composites Research
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• v.35 no.3
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• pp.182-187
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• 2022

In this paper, the thickness of a multilayer PCB was predicted through an empirical formulation based on the physical properties of the prepreg used in multilayer PCB. Since the thickness of prepreg reduction when manufacturing a PCB due to the physical properties and copper foil residual rate, it is necessary to accurately predict the thickness of the PCB through the thickness empirical formulation. To determine the density of the prepreg, the mass and thickness of the prepreg were measured. To manufacture the CCL, the prepreg and copper foil were laminated using a hot press machine, and the thickness was measured using a microscope and micrometer. An 8-layerd PCB was designed with different circuit densities to measure the change in the thickness with the copper foil residual ratio, and the proposed empirical formulation was verified by comparing the measured thickness with the value obtained using the empirical formulation. As a result, the errors for the CCL and multilayer PCB were 2.56% and 4.48%, respectively, which demonstrated the reliability of the empirical formulation.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.20 no.1
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• pp.7-11
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• 2010

The reduction of optical losses in mono-crystalline silicon solar cell by surface texturing is a critical step to improve the overall cell efficiency. In this study, we have changed the sub-micrometer structure on the micrometer pyramidal structure by 2-step texturing. The Ag particles were coated on the micrometer pyramid surface in $AgNO_3$ solution, and then the etching with hydrogen fluoride and hydrogen peroxide created even smaller nano-pyramids in these pyramids. As a result, we observed that the changes of size and thickness of nano structure on pyramidal surface were determined by $AgNO_3$ concentration and etching time. Using 2-step texturing, the surface of wafers is etched to resemble the rough surface of a lotus leaf. Lotus surface can reduce average reflectance from 10% to below 3%. This reflectance is less than conventional textured wafer including anti-reflection coating.

• Journal of the Korean Society for Nondestructive Testing
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• v.19 no.5
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• pp.363-368
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• 1999

Ultrasonic pulse-echo methods measuring the transit time through specimens have been widely used in determination of ultrasonic velocity and thickness of specimens. Usually, to determine the velocity of the ultrasonic. the transit time of the ultrasonic pulse through specimen is measured by using the ultrasonic measuring equipment such as the oscilloscope including ultrasonic pulser/receiver and the thickness of the specimen is measured by using the length measuring instrument such as micrometer or vernier calipers etc., i. e. each parameter is measured by using each measuring method. In the case of the measuring the thickness of a specimen by using the ultrasonics. the ultrasonic equipments, which measure the thickness, such as the ultrasonic thickness gauge must be calibrated by using the reference block of which the ultrasonic velocity is known beforehand. In the present work, we proposed a new method for simultaneous measurement of ultrasonic velocity and thickness without reference blocks. Experimental results for several specimens show that proposed method have good agreements with those by traditional ultrasonic method.

• Korean Journal of Materials Research
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• v.23 no.12
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• pp.702-707
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• 2013

High-quality ${\beta}$-silicon carbide (SiC) coatings are expected to prevent the oxidation degradation of carbon fibers in carbon fiber/silicon carbide (C/SiC) composites at high temperature. Uniform and dense ${\beta}$-SiC coatings were deposited on carbon fibers by low-pressure chemical vapor deposition (LP-CVD) using silane ($SiH_4$) and acetylene ($C_2H_2$) as source gases which were carried by hydrogen gas. SiC coating layers with nanometer scale microstructures were obtained by optimization of the processing parameters considering deposition mechanisms. The thickness and morphology of ${\beta}$-SiC coatings can be controlled by adjustment of the amount of source gas flow, the mean velocity of the gas flow, and deposition time. XRD and FE-SEM analyses showed that dense and crack-free ${\beta}$-SiC coating layers are crystallized in ${\beta}$-SiC structure with a thickness of around 2 micrometers depending on the processing parameters. The fine and dense microstructures with micrometer level thickness of the SiC coating layers are anticipated to effectively protect carbon fibers against the oxidation at high-temperatures.