• 제목/요약/키워드: Micrometer thickness

검색결과 42건 처리시간 0.023초

진동절삭법을 이용한 절삭깊이의 최소화 (The Minimizing of Cutting Depth using Vibration Cutting)

  • 손성민;안중환
    • 한국정밀공학회지
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    • 제21권11호
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    • pp.38-45
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    • 2004
  • This paper discusses the minimum cutting thickness with a continuous chip in sub-micrometer order precision diamond cutting. An ultra precision cutting model is proposed, in which the tool edge radius and the friction coefficient are the principal factors determining the minimum cutting thickness. The experimental results verify the proposed model and provide various supporting evidence. In order to reduce the minimum cutting thickness a vibration cutting method is applied, and the effects are investigated through a series of experiments under the same conditions as conventional cutting method.

주석-납 기반 페로브스카이트 고농도 전구체 용액을 이용한 광전류 향상 연구 (Study for Improved Photocurrent via High Concentrated Tin-lead Perovskite Precursor Solution)

  • 홍효진;이승민;임정민;노준홍
    • Current Photovoltaic Research
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    • 제11권3호
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    • pp.96-102
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    • 2023
  • Sn-Pb narrow-bandgap perovskite solar cells, which is a light-harvesting layer thicker than 1.3 micrometers, is needed to enhance the low photocurrent. The fabrication of such a thick film through solution processing is a key challenge. Here, we studied and characterized the film by using a precursor solution of increased concentration, comparing it with the universally used 1-micrometer Sn-Pb perovskite film. The increase in molar concentration clearly induced thickness enhancement, but we observed that it also created numerous voids at the interface with bottom charge transporting layer. We hypothesized that these voids might hinder the increase in photocurrent associated with thickness enhancement. By introducing methylammonium chloride (MACl), we successfully fabricated Sn-Pb perovskite film with a thickness of 1.3 micrometer and no voids. Void-controlled Sn-Pb perovskite solar cells not only demonstrated superior short-circuit current density compared to those with voids but also operated smoothly under light exposure.

음향현미경을 이용한 layer의 두께측정에 관한 연구 (A study on the measurement of layer thickness using acoustic microscope.)

  • 고대식;김흥기;전계석
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1988년도 전기.전자공학 학술대회 논문집
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    • pp.43-46
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    • 1988
  • In this paper, a methodology for determination of the thickness of layer on a substrate using reflection acoustic microscope has been presented. It has been shown that the amplitude and the phase of reflection coefficient of the layer-substrate composite has been used for measurement of layer thickness, acoustic velosity, mass density of the layer material. The reflection acoustic microscope operating at a frequency of 15 MHz has been used for the experiment and the measured acoustic impedance value for aluminum sample has agreed with the published data, and the measured layer thickness for silver-glass composite has agreed with that measured using micrometer.

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비접촉 유리 두께 측정 장치 개발 (Developement of a System for Glass Thickness Measurement)

  • 박재범;이응석;이민기;이종근
    • 대한기계학회논문집A
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    • 제33권5호
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    • pp.529-535
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    • 2009
  • This paper describes a measuring device of glass thickness using machine vision and image processing techniques on real-time. Today, the machine vision enable to inspect fast and exactly than human's eyes. The presented system has advantages of continuous measurement, flexibility and good accuracy. The system consists of a laser diode, a CCD camera with PC. The camera located on the opposite side of the incident beam measures the distance between two reflected laser beams from the glass top and bottom surface. We apply a binary algorithm to convert and analyze the image from camera to PC. Laser point coordination by border tracing algorithm is used to find the center of beam circle. The measured result was compared with micrometer and showed 0.002mm accuracy. Finally, the errors were discussed how to minimize the influence of glass wedge angle and angular error of moving stage.

Stress Analysis in Cooling Process for Thermal Nanoimprint Lithography with Imprinting Temperature and Residual Layer Thickness of Polymer Resist

  • Kim, Nam Woong;Kim, Kug Weon
    • 반도체디스플레이기술학회지
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    • 제16권4호
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    • pp.68-74
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    • 2017
  • Nanoimprint lithography (NIL) is a next generation technology for fabrication of micrometer and nanometer scale patterns. There have been considerable attentions on NIL due to its potential abilities that enable cost-effective and high-throughput nanofabrication to the display device and semiconductor industry. Up to now there have been a lot of researches on thermal NIL, but most of them have been focused on polymer deformation in the molding process and there are very few studies on the cooling and demolding process. In this paper a cooling process of the polymer resist in thermal NIL is analyzed with finite element method. The modeling of cooling process for mold, polymer resist and substrate is developed. And the cooling process is numerically investigated with the effects of imprinting temperature and residual layer thickness of polymer resist on stress distribution of the polymer resist. The results show that the lower imprinting temperature, the higher the maximum von Mises stress and that the thicker the residual layer, the greater maximum von Mises stress.

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펌제와 염모제가 곱슬모에 미치는 영향에 관한 연구 (The study on Effects of Curly Hair by the Permnent wave and Dye)

  • 이하나;강상모
    • 한국패션뷰티학회지
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    • 제6권2호
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    • pp.73-79
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    • 2008
  • To study of the rate of damage and morphological change when apply perm and dye according to kinds of curly hair, measured the thickness of hair and divided the samples into groups. Measured the chromaticity and thickness according to kinds of curly hair and chemical treatment with Spectrum colormeter and Micrometer. Measured the tensile strength of hair then calculated the damage rate. After tensile test, took photographs of the section and surface with the electron microscope.

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다층 PCB의 두께 예측을 위한 실험식 도출 연구 (An Empirical Formulation for Predicting the Thickness of Multilayer PCB)

  • 김남훈;한관희;이민수;김현호;신광복
    • Composites Research
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    • 제35권3호
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    • pp.182-187
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    • 2022
  • 본 논문은 다층 PCB에 사용되는 프리프레그의 물성을 파악하여 제시한 두께 실험식을 통해 PCB의 두께를 예측하기 위한 연구를 수행하였다. 프리프레그는 물성과 동박 잔존율에 의해서 PCB 제작시 두께가 감소하기 때문에 두께 실험식을 통한 정확한 PCB의 두께 예측이 필요하다. 두께 실험식에 사용되는 프리프레그의 밀도를 파악하기 위해 질량 및 두께를 측정하여 밀도를 도출하였다. 이후 CCL을 제작하기 위해 프리프레그와 동박을 적층하여 핫 프레스기를 사용하였고 광학현미경과 마이크로미터를 사용하여 두께를 측정하였다. 또한 동박 잔존율에 따른 두께 변화를 측정하기 위해 회로밀도를 다르게 구성하여 8층 PCB를 설계하였고 두께 측정 결과와 두께 실험식으로 도출된 두께를 비교하여 두께 실험식을 검증하였다. 비교 결과 CCL의 경우 2.56%, 다층 PCB의 경우 4.48%의 오차를 보였고 이를 통해 두께실험식의 신뢰성을 확인하였다.

고효율 실리콘 태양전지를 위한 lotus surface 구조의 형성 (Formation of lotus surface structure for high efficiency silicon solar cell)

  • 정현철;백용균;김효한;음정현;최균;김형태;장효식
    • 한국결정성장학회지
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    • 제20권1호
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    • pp.7-11
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    • 2010
  • 단결정 실리콘 태양전지의 광학적 손실을 감소시키는 표면 텍스쳐링은 최종 셀의 효율을 향상시키기 위하여 매우 중요하다. 본 연구에서는 2-step texturing의 공정으로 기존의 텍스쳐링에서 이루어진 피라미드에 수 많은 sub-micrometer 사이즈의 구조를 형성시켰다. $AgNO_3$ 용액으로 웨이퍼 표면에 Ag코팅을 한 후, 그 웨이퍼를 다시 HF/$H_2O_2$ 용액으로 수십초 동안 식각을 거치게 된다. 결과적으로, 피라미드 위에 생성된 수 nm사이즈의 구조물들은 $AgNO_3$의 농도 및 식각 시간의 변화에 의해 그 크기와 굵기가 변화하는 것을 알 수 있었다. 웨이퍼의 표면이 2-step texturing에 의해 식각이 이루어지면 연잎의 거친 표면과 비슷해지고, 그 결과 평균 10% 이상의 반사율을 보이던 기존 웨이퍼에서 3% 이하의 낮은 반사율을 얻을 수 있었다. 이는 일반적인 텍스쳐링과 anti-reflection coating을 거친 웨이퍼의 반사율보다 낮은 결과이다.

두개의 탐촉자를 사용한 등방성 균일 고체의 초음파 속도 및 두께 동시 측정법 (Simultaneous Measurement of Ultrasonic Velocity and Thickness of Isotropic and Homogeneous Solids Using Two Transducers)

  • 이정기;권진오;김영환
    • 비파괴검사학회지
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    • 제19권5호
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    • pp.363-368
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    • 1999
  • 시험체의 두께나 초음파 속도를 측정하기 위해서 초음파 펄스-에코법이 널리 사용되고 있다. 초음파 속도를 결정하기 위해서는 초음파 송수신 장치를 포함한 오실로스코우프와 같은 초음파 측정 장치를 사용하여 시험편에서의 초음파진행 시간을 측정하고, 초음파 진행 거리에 해당하는 시험편의 두께를 버어니어 캘리퍼스 또는 마이크로미터와 같은 길이측정 도구를 사용하여 측정한다. 그리고 초음파를 이용하여 시험편의 두께를 측정할 때에는 초음파 속도를 알고 있는 대비 시험편으로 기준을 설정하여야 한다. 본 연구에서는, 대비 시험편 없이 재료의 두께와 초음파 속도를 동시에 구하는 방법을 제시하였다. 재질과 두께를 달리한 여러 시험편에서 측정된 초음파 속도와 두께가 기존의 방법에 의해 측정한 값과 잘 일치하였다.

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Protective SiC Coating on Carbon Fibers by Low Pressure Chemical Vapor Deposition

  • Bae, Hyun Jeong;Kim, Baek Hyun;Kwon, Do-Kyun
    • 한국재료학회지
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    • 제23권12호
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    • pp.702-707
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    • 2013
  • High-quality ${\beta}$-silicon carbide (SiC) coatings are expected to prevent the oxidation degradation of carbon fibers in carbon fiber/silicon carbide (C/SiC) composites at high temperature. Uniform and dense ${\beta}$-SiC coatings were deposited on carbon fibers by low-pressure chemical vapor deposition (LP-CVD) using silane ($SiH_4$) and acetylene ($C_2H_2$) as source gases which were carried by hydrogen gas. SiC coating layers with nanometer scale microstructures were obtained by optimization of the processing parameters considering deposition mechanisms. The thickness and morphology of ${\beta}$-SiC coatings can be controlled by adjustment of the amount of source gas flow, the mean velocity of the gas flow, and deposition time. XRD and FE-SEM analyses showed that dense and crack-free ${\beta}$-SiC coating layers are crystallized in ${\beta}$-SiC structure with a thickness of around 2 micrometers depending on the processing parameters. The fine and dense microstructures with micrometer level thickness of the SiC coating layers are anticipated to effectively protect carbon fibers against the oxidation at high-temperatures.