• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2000년도 춘계학술대회 논문집
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• pp.1051-1054
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• 2000

We developed the micro CSF (celebrospinal fluid) shunt valve with surface and bulk micromachining technology in polymer MEMS. This micro CSF shunt valve was formed with four micro check valves to have a membrane connected to the anchor with the four bridges. The up-down movement of the membrane made the CSF on & off and the valve characteristic such as open pressure was controlled by the thickness and shape of the bridge and the membrane. The membrane, anchor and bridge layer were made of the $O_2$ RIE (reactive ion etching) patterned Parylene thin film to be about 5~10 microns in thickness on the silicon wafer. The dimension of the rectangular nozzle is 0.2＊0.2 $\textrm{mm}^2$ and the membrane 0.45 mm in diameter. The bridge width is designed variously from 0.04 mm to 0.12 mm to control the valve characteristics. To protect the membrane and bridge in the CSF flow, we developed the packaging system for the CSF micro shunt valve with the deep RIE of the silicon wafer. Using this package, we can control the gap size between the membrane and the nozzle, and protect the bridge not to be broken in the flow. The total dimension of the assembled system is 2.5＊2.5 $\textrm{mm}^2$ in square, 0.8 mm in height. We could precisely control the burst pressure and low rate of the valve varing the design parameters, and develop the whole CSF shunt system using this polymer MEMS fabricated CSF shunt valve.

• 센서학회지
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• 제8권4호
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• pp.320-326
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• 1999

센서의 감지막 표면에 흡착되어 있는 이물질을 세척하기 위해 노즐 원리를 도입하여 소형 카트리지를 제작하였다. 세척용 노즐구조는 유동 해석 프로그램(CFD-ACE)의 검증을 통하여 소형 카트리지에 적합하도록 설계하였다. 미세가공기술을 이용하여 제작된 카트리지의 전체 크기는 약 $2.6\;cm{\times}1.5\;cm$이고 세척용 노즐의 크기는 $0.2\;mm{\times}600\;mm$이며, 측정에 필요한 시료의 양은 약 $20\;{\mu}l$이다. REFET과 의사기준전극을 이용한 차동증폭법을 사용하여 기준전극을 소형화하였다. 또한, 미세채널에서 기포로 인한 센서의 오동작을 감지하기 위해 채널 양단에 금속전극을 증착하였다. 제작된 카트리지에 pH-ISFET를 장착하여 노즐에 의한 세척효과를 조사하였다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1996년도 춘계학술대회 논문집
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• pp.146-150
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• 1996

A thermal micro actualtor has been fabricated using surface micromachining techniques. It consists of doped ploysilicon as a moving part and TEOS(Tetra Ethyl Ortho Silicate) as a sacrificial layer. The polysilicon was annealed for the reduction of residual stress which is the main cause to its deformation such as bending and buckling. And the newly developed HF VPE(vapor phase etching)process was also used as an effective release method for the elimination of sacrificaial layer. With noliquid involved during any of the steps for relasing, unlike other reported relase techniques, the HF VPE pocess has produced polysilicon microstructures with virtually no process-induced stiction problem. The actuation is incured by the thermal expasion due to current flow in active polysilicon cantilever, which motion is amplified bylever mechanism. The thickness of pllysilicon is 2 .mu. m and the length of active and passive polysilicon cantilever are 500 .mu. m, respectively. The moving distance of polysilicon actuator was experimentally conformed as large as 21 .mu. m at the input voltage level of 10 V and 50Hz square wave. These micro actuator technology can be utilized for the fabrication of MEMS (microlectromechanical system) such as microrelay, which requires large displacement or contact force but relatively slow response.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.620-623
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• 2003

The material processing by using ultrashort pulse laser, in recently, is actively applying into the micro machining and nano-machining technology since ultrashort pulse has so faster than the time which the electrons energy absorbing photon energy is transmitted to surrounding lattice-phonon that it has many advantages in point of machining. The micro machining of metallic thin film on the plain glass is widely used in the fields such as mask repairing for semiconductor, fabrication of photonic crystal, MEMS devices and data storage devices. Therefore, it is important to secure the machining technology of the sub-micron size. In this research, we set up the machining system by using ultrashort pulse laser and conduct on the Cr 200nm thin film ablation experiments of spot and line with the variables such as energy, pulse number, speed, and so on. And we observed the characteristics of surrounding heat-affected zone and by-products appeared in critical energy density and higher energy density through SEM, and also examined the machining features between in He gas atmosphere which make pulse change minimized by nonlinear effect and in the air. Finally, the pit size of 0.8${\mu}{\textrm}{m}$ diameter and the line width of 1${\mu}{\textrm}{m}$ could be obtained.

• International Journal of Precision Engineering and Manufacturing
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• 제9권1호
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• pp.3-6
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• 2008

Electrical discharge machining (EDM) is one of the most widespread nonconventional machining processes. Recently, a low-power micro-EDM process was introduced using a cylindrical electrode. Since its development, micro-EDM has been applied effectively to micromachining, and because the device setup for this process is simple, it is suitable for a microfactory that minimizes machines to fabricate small products economically in one system. In the EDM process, however, the electrode is also removed along with the workpiece. Therefore, the electrode shape and length vary as machining progresses. In this paper, a control method using a high speed realtime voltage measurement is proposed to regulate the rate and amount of material removed. The proposed method is based on the assumption that the volume of the workpiece removed in a single discharge pulses is nearly constant. The discharge pulses are monitored and controlled to regulate the amount of material removed. For this purpose, we developed an algorithm and apparatus for counting the number of discharge pulses. Electrode wear compensation using pulse number information was applied to EDM milling in a microfactory, in which a slight tilt of the workpiece may occur. The proposed control method improves the machining quality and efficiency by eliminating the inaccuracies caused by electrode wear and workpiece tilt.

• 대한기계학회논문집A
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• 제35권5호
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• pp.495-501
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• 2011

나노간극에서 발생하는 전기방전에 대해서 실험적으로 연구하고 그 결과를 분석하였다. Pt-Ir 합금으로 구성된 음극과 금으로 박막코팅된 양극사이에 전기방전을 하였다. 음극과 양극에서 전기장을 10V~80V 범위에서 제어하였으며, 간극은 50nm 에서 800nm 로 제어하였다. 이때 발생된 전기방전신호, 쇼트신호 등은 간접적으로 나노간극에서 발생하는 현상들을 이해할 수 있었다. 실험결과 전기방전은 전기장과 음극의 전극첨단의 반경에 매우 밀접하게 관련이 있었다. 작은 간극에서 발생하는 전기방전은 비교적 산포도가 크고 랜덤한 형태를 보였으며 음극 전극첨단의 반경에 민감하게 반응하였다.

• 마이크로전자및패키징학회지
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• 제8권4호
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• pp.43-45
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• 2001

본 연구는 레이저 처리기술에 의한 $Li_2O-A1_2O_3-SiO_2$계 유리의 미세가공과 레이저에 의한 유리의 광활성반응에 관한 것으로서, 1064 nm와 355 nm의 파장을 갖는 Nd:YAG laser를 유리에 조사하여 유리의 파괴특성 및 광학적변화를 관찰하였다. 1064 nm레이저에 의한 유리의 파괴 부분은 광학현미경과 주사전자현미경 (SEM)으로서 파괴특성을 평가하였으며, 355 nm 레이저에 의한 유리의 변화는 흡수대역은 측정함으로서 그 광학적 특성을 나타내었다. 이와 같은 레이저에 의한 가공은 유리내부의 3차원적인 미세구조물 형성이나, internal waveguide, 또는 광 흡수대역의 변화에 따른 광기록방법으로 응용될 것으로 예상된다.

• Transactions on Electrical and Electronic Materials
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• 제6권3호
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• pp.110-114
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• 2005

We present a micro fluxgate magnetic sensor having solenoid coils and racetrack shaped magnetic core, which was designed to decrease the .operating power and magnetic flux leakage. Electroplated copper coils of $6\;{\mu}m$ thickness and the core of $3\;{\mu}m$ thickness were separated by benzocyclobutane (BCB) having a high insulation and good planarization characters. Permalloy $(Ni_{0.8}Fe_{0.2})$ as a magnetic core was also electroplated under 2000 gauss to induce the magnetic anisotropy. The core had the high DC effective permeability of $\~1,300$ and coercive field of $\~0.1$ Oe. The fabricated fluxgate sensor had the very small actual size of $3.0\times1.7\;mm^2$. The fluxgate sensor with a racetrack shaped core had the high sensitivity .of $\~350$ V/T at excitation condition of 3 $V_{P-P}$ and 2 MHz square wave. When two fluxgates were perpendicularly aligned in terrestrial field, their two-axis output signals were very useful to commercialize an electronic azimuth compass for the portable navigation system.

• 한국기계가공학회지
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• 제12권6호
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• pp.23-29
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• 2013

In this paper, pure $I_{ph}$ and hybrid carbon nanotube reinforced $I_{ph}$ were sintered using the SPS(spark plasma sintering) method for high densification. A nanosecond laser (${\lambda}=1063nm$, ${\tau}P=10ns$) and a femtosecond laser (${\lambda}=1027nm$, ${\tau}P=380fs$) were installed on an optical system for the micromachining test. The ablation characteristics of the pure $I_{ph}$ and CNT/$I_{ph}$ composites, such as thermal effect and ablation depth, were investigated using FE-SEM and a confocal microscope device. Laser machining results for the two mating materials showed improved performances: CNT/$I_{ph}$ composites showed good surface morphology of hole drilling without a melting zone due to the composites' high thermal properties; also, the ablated depth of CNT/$I_{ph}$ was higher than that of pure $I_{ph}$.

• Journal of Electrical Engineering and Technology
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• 제3권2호
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• pp.271-275
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• 2008

The MAM(Megasonic Agitated Module) has been fabricated for improving the characteristics of wet etching. The characteristics of the MAM are investigated during the wet etching with and without megasonic agitation in this paper. The adoption of the MAM has improved the characteristics of wet etching, such as the etch rate, etch uniformity, and surface roughness. Especially, the etching uniformity on the entire wafer was less than ${\pm}1%$ in both cases of Si and glass. Generally, the initial root-mean-square roughness($R_{rms}$) of the single crystal silicon was 0.23nm. Roughnesses of 566nm and 66nm have been achieved with magnetic stirring and ultrasonic agitation, respectively, by some researchers. In this paper, the roughness of the etched Si surface is less than 60 nm. Wet etching of silicon with megasonic agitation can maintain nearly the original surface roughness during etching. The results verified that megasonic agitation is an effective way to improve etching characteristics of the etch rate, etch uniformity, and surface roughness and that the developed micromachining system is suitable for the fabrication of devices with complex structures.