• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.22 no.5
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• pp.831-836
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• 2013

This study demonstrates the process of fabricating patterns using tribonanolithography (TNL),with laboratory-made micro polycrystalline diamond (PCD) tools that are attached to an atomic force microscope (AFM). The various patterns are easily fabricated using mechanical scratching, under various normal loads, using the PCD tool on single crystal silicon, which is the master mold for replication in this study. Then, polydimethylsiloxane (PDMS) replica molds are fabricated using precise pattern transfer processes. The transferred patterns show high dimensional accuracy as compared with those of TNL-processed silicon micro molds. TNL can reduce the need for high cost and complicated apparatuses required for conventional lithography methods. TNL shows great potential in that it allows for the rapid fabrication of duplicated patterns through simple mechanical micromachining on brittle sample surfaces.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2004.04a
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• pp.466-471
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• 2004

In focused-ion-beam (FIB) application of micromachining and device transplantation, four kinds of FIB processes, namely FIB sputtering, FIB-induced etching, redeposition, and FIB-induced deposition, are well utilized. As with FIB systems, scanning electron microscopes(SEMs) were extensively used in the semiconductor industry. They are the tools of choice for defect review and providing the image resolution needed for process monitoring. The enhanced capabilities of a dual-column on one chamber system are quickly becoming realized by the nano industry for performing a wide range of application.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.211-215
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• 2005

Microsystems combine several microcomponents, optimized an entire system, to provide several specific technical functions by the shape of the microstructure. Microfabrication and micromachining techniques have played the key role in the fast development and commercialization of microsystems. Microreaction technology based on microsystems is a powerful tool for the evaluating new process and reaction pathways in chemical engineering. Because of the small characteristic dimensions of microreaction devices, mass and heat transfer processes are enhanced and, in addition, reaction conditions can be precisely controlled for optimizing yield and selectivity. The paper will report on the mixer design principle and explore several application fields of microreaction technology in the chemical synthesis

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.12 no.3
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• pp.28-35
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• 2013

Micro electrical discharge machining (EDM) as a non-contact machining process is very effective for micromachining with a thin electrode because of its low machining reaction force. The micro-electrode machining device has the advantage of maintaining high precision through the whole processes and uses a feeding wire in the thin electrode tool manufacturing process. This study describes the design and evaluation of a micro-electrode machining device using optical photo-interrupter. The electrode was fabricated by reverse electrical discharge machining. The performance of designed system was evaluated to measure tension force according to feed speed of wire. This system for micro electrode fabrication proves the feasibility in the micro-EDM process of the micro holes and parts for industrial applications.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.13 no.1
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• pp.55-62
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• 2004

This paper addresses the method for figuring out the hole diameter on the mask containing the information about machining depth. With this mask e micro machining is carried out with a simple 2D movement of the mask. Based on e suggested method excimer laser ablation processes are modeled and determination of the optimal laser ablation conditions such as hole diameter, step size, mask movement velocity, etc. is completed. The excimer laser ablation simulation for creating 3D micro lens is carried out by employing determined ablation conditions to prove verification of the method. The results from simulation illustrated the average error of 140nm and e relative error of 2％.

• Journal of Power System Engineering
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• v.5 no.1
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• pp.73-79
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• 2001

정전기력을 이용하는 마이크로가속도계 센서는 단결성 실리콘 SOI(Silicon On Insulator) 웨이퍼의 기판에 절전재료 적층과 등방성 및 이방성 부식공정으로 제작한다. 마이크로가속도 센서 개발에는 3차원 미소구조체의 제작공정에서 가열 및 냉각공정의 온도구배로 야기되는 포핑업과 같은 열변형 해석이 최적 형상설계에 중요한 요건이다. 본 연구에서는 양자역학적 현상인 턴널링전류 원리로 승용차 에어백의 검침부 역할을 하는 마이크로가속도 센서의 제조공정에서 소착현상을 방지하는 부가 비임과 턴널갭의 FIB 절단가공과 백금 적층공정의 열적 거동을 해석한다. 마이크로머시닝 공정에서 온도의존성을 고려하여 연성해석하고 유한요소법의 상용코드인 MARC K6.1로 분석한 결과를 단결정 실리콘 웨이퍼로 가공하는 마이크로가속도 센서의 최적공정 및 형상설계를 위한 기초자료로 활용될 수 있을 것으로 기대된다.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.49 no.6
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• pp.354-359
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• 2000

A new method of measuring residual stress in micromachined film is proposed. An estimation of residual stress is performed by using least squares fit with an appropriate deflection modeling. an exact value of residual stress is obtained without any of the ambiguities that exist in conventional buckling method, and a good approximation is also obtained by using a few data points. Therefore, the test structures area could be greatly decreased by using this method. The measurement can be done more easily and simply without any actuation or any specific measuring equipment. The structure and fabrication processes described in this paper are simple and widely used in surface micromachining. In addition, in-situ measurement is available by using the proposed method when the test structure and the measurement structure are fabricated on a wafer simultaneously.

• Proceedings of the KIEE Conference
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• 1999.07g
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• pp.3286-3288
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• 1999

The electrostatically actuated test structure was presented to measure the micro mechanical characteristics of micromaterials as thin films forming the microactuators. The test structure was fabricated by the surface micromachining processes and driven by the electrostatic force, In order to measure the fracture toughness, the sharp notch in the test structure was introduced by the etching process. On the basis of the beam bending theory, the elastic modulus was measured by using the microcantilevr beam and the mechanical displacement, curvature and deflection curve under the electrostatic force was evaluated by using the electrostatic structure.

• International Journal of Precision Engineering and Manufacturing
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• v.9 no.1
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• pp.3-6
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• 2008

Electrical discharge machining (EDM) is one of the most widespread nonconventional machining processes. Recently, a low-power micro-EDM process was introduced using a cylindrical electrode. Since its development, micro-EDM has been applied effectively to micromachining, and because the device setup for this process is simple, it is suitable for a microfactory that minimizes machines to fabricate small products economically in one system. In the EDM process, however, the electrode is also removed along with the workpiece. Therefore, the electrode shape and length vary as machining progresses. In this paper, a control method using a high speed realtime voltage measurement is proposed to regulate the rate and amount of material removed. The proposed method is based on the assumption that the volume of the workpiece removed in a single discharge pulses is nearly constant. The discharge pulses are monitored and controlled to regulate the amount of material removed. For this purpose, we developed an algorithm and apparatus for counting the number of discharge pulses. Electrode wear compensation using pulse number information was applied to EDM milling in a microfactory, in which a slight tilt of the workpiece may occur. The proposed control method improves the machining quality and efficiency by eliminating the inaccuracies caused by electrode wear and workpiece tilt.

• Journal of Sensor Science and Technology
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• v.17 no.1
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• pp.75-80
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• 2008

In this work, we optimized a microbolometer for application of a $CO_2$ detector by using MEMS technology. We fabricated a stable thermal isolation structure by varying the lengths of supporting legs which affect bolometer performance. We could fabricate more stable thermal isolation structure for the microbolometer through the results of ANSYS simulations, and minimize the fabrication processes by using bulk micromachining to use a $CO_2$ detector. The microbolometer shows a detectivity of $2.5{\times}109$ cmHz$^{1/2}$/W at a chopper frequency of 8 Hz and a bias current of $6.25\;{\mu}A$ with a vacuum package of about $3.0{\times}10.3$ torr. Therefore, we put to conclusion that the microbolometer optimized in this experiment could be useful for the application of a $CO_2$ detector.