• 제목/요약/키워드: Microcomposite

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Low Temperature Fireable Borosilicate/Si3N4 Microcomposite Substrates

  • 박인용
    • Journal of the Microelectronics and Packaging Society
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    • v.3 no.1
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    • pp.49-56
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    • 1996
  • 저유전 상수와 저온 소성이 가능한 기판 재료의 제조를 위해 sol-gel법으로 borosilicate/Si3N4 Microcomposite 분말을 합성하였다. Microcomposite 분말의 조성은 borosilicate/Si3N4의 부피비로 50/50, 60/40 및 70/30을 선택하였다. Microcomposite의 성형 체는 건식가압법으로 성형하여 700~100$0^{\circ}C$에서 2시간 동안 소결하였다. Microcomposite 의 미세구조는 SEM과 TEM으로 관찰하였고 소결체의 유전 상수와 밀도를 측정하였다. Microcomposite은 85$0^{\circ}C$ 근처에서 치밀화가 일어나고 유전상수는 약 4.2였다.

A COMPARATIVE STUDY ON THE WEAR RESISTANCE OF POLYMERIC VENEERING MATERIALS (치관 전장용 레진의 내마모성에 대한 비교연구)

  • Youn, Soo-Sun;Lee, Sun-Hyung;Yang, Jae-Ho;Chang, Wan-Shik
    • The Journal of Korean Academy of Prosthodontics
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    • v.24 no.1
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    • pp.33-43
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    • 1986
  • The purpose of this study was to compare the wear resistance of heat pressure-cured microcomposite(SR-Isosit-N), photo-cured microcomposite(Dentalcolor), unfilled heat-cured resin(Thermojel) and that of human enmel. Specimens were made with specially designed die and finally polished with #3,000 diamond paste. After 100,000 strokes of tooth brushing at electric tooth-brushing machine, mean thickness loss of each specimen was measured by using surface profile and integration. The results were as follows 1. Mean thickness loss were $84.3{\pm}27.3{\mu}m$ in unfiled heat-cured resin, $9.4{\pm}2.5{\mu}m$ in photocured microcomposite, $7.6{\pm}2.1{\mu}m$ in heat.pressure-cured microcomposite and $0.97{\pm}0.42{\mu}m$ in enamel. 2. Heat.pressure-cured microcomposite and photo-cured microcomposite had no difference in mean thickness loss(p>0.05). 3. Unfilled resin and microcomposite had much differences in mean thickness loss (p<0.005). 4. ha resins used in this experiment had too much mean thickness loss as compared with enamel (p<0.005).

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Simultaneous Detection of Tartrazine-Sunset Yellow in Food Samples Using Bioxide/Carbon Paste Microcomposite with Lanthanum and Titanium

  • Nagles, Edgar;Ceroni, Mario;Hurtado, John
    • Journal of Electrochemical Science and Technology
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    • v.11 no.4
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    • pp.421-429
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    • 2020
  • This report describes the simultaneous detection of the two dyes most commonly used in food, tartrazine (TZ) and sunset yellow (SY), based on a microcomposite of carbon paste decorated with La2O3 and TiO2. Anodic currents for SY-TZ were observed at 0.89-1.21 V by cyclic voltammetry (CV) separated with a ΔV of 0.32 V. The increased anodic peak currents compared to that of the unmodified carbon paste electrode were almost 50 and 41% for SY-TZ, respectively. The detection limits with the optimal amount of La2O3-TiO2 were 0.02 and 0.03 µmol/L, respectively. The relative standard deviation (RSD) based on fifty measurements was less than 3%. The versatility and novelty of the sensor were tested with food samples containing these substances and other substances.

Microstructure and Electrical Conductivity of Cu-16 at % Ag Microcomposite (Cu-16 at % Ag 미세복합재료의 미세구조와 전도도)

  • Im, Mun-Su;An, Jang-Ho;Hong, Sun-Ik
    • Korean Journal of Materials Research
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    • v.9 no.6
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    • pp.569-576
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    • 1999
  • In this study, the effect of the microstructural evolution on the electrical of Cu-Ag microcomposite was investigated. The nature of interfaces between silver filaments and Cu matrix may have pronounced effects on the physical properties of Cu-Ag filamentary microcomposites, little is known about these interfaces. In heavily drawn Cu-Ag filamentary microcomposities, the microstructure is too fine and the interfacial area is too large to maintsin a stable internal dislocation structure because of closely spaced filaments. Rather, most dislocations are thought to be gradually absorbed at the interfaces as the draw ratio increases. The mechanical and electrical properties of Cu-Ag filamentary microcomposites wires were also examined and correlated with the microstructural change caused by thermomechanical treatments. The study on the electrical conductivity combined to resistivity in Cu-Ag filamentary microcomposites and the rapid increase of the electrical conductivity at high annealing temperatures is mainly caused by the dissolution and coarsening of silver filaments. The relatively low ratio of the resistivities is mainly caused by the dissolution and coarsening of silver filaments. The relatively low ratio of the resistivities at 295K($\rho$\ulcorner/$\rho$\ulcorner) in as-drawn Cu-Ag microcomposites can also be explained by the contribution of the interface scattering.

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The surface stress effects on the buckling analysis of porous microcomposite annular sandwich plate based on HSDT using Ritz method

  • Mohsen Emdadi;Mehdi Mohammadimehr;Borhan Rousta Navi
    • Computers and Concrete
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    • v.32 no.5
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    • pp.439-454
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    • 2023
  • In this article, the surface stress effects on the buckling analysis of the annular sandwich plate is developed. The proposed plate is composed of two face layers made of carbon nanotubes (CNT) reinforced composite with assuming of fully bonded to functionally graded porous core. The generalized rule of the mixture is employed to predict the mechanical properties of the microcomposite sandwich plate. The derived potentials energy based on higher order shear deformation theory (HSDT) and modified couple stress theory (MCST) is solved by employing the Ritz method. An exact analytical solution is presented to calculate the critical buckling loads of the annular sandwich plate. The predicted results are validated by carrying out the comparison studies for the buckling analysis of annular plates with those obtained by other analytical and finite element methods. The effects of various parameters such as material length scale parameter, core thickness to total thickness ratio (hc/h), surface elastic constants based on surface stress effect, various boundary condition and porosity distributions, size of the internal pores (e0), Skempton coefficient and elastic foundation on the critical buckling load have been studied. The results can be served as benchmark data for future works and also in the design of materials science, injunction high-pressure micropipe connections, nanotechnology, and smart systems.

Effect of Silicone-modified Microsilica Content on Electrical and Mechanical Properties of Cycloaliphatic Epoxy/Microsilica System

  • Park, Jae-Jun;Yoon, Chan-Young;Lee, Jae-Young;Cheong, Jong-Hoon;Kang, Geun-Bae
    • Transactions on Electrical and Electronic Materials
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    • v.17 no.3
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    • pp.155-158
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    • 2016
  • The effect of microsilica content modified with silicone-modified epoxy on electrical and mechanical properties of cycloaliphatic epoxy/microsilica system was investigated. The cycloaliphatic epoxy resin was diglycidyl 1,2-cyclohexanedicarboxylate and curing agent was an anhydride. Surface of microsilica was modified with silicone-modified epoxy. Electrical breakdown strength, the most important property for electrical insulation materials was tested. Tensile and flexural tests were also performed using universal testing machine (UTM). The microcomposite with 60 wt% microsilica shows maximum values in electrical breakdown strength.

Low Temperature Fireable Cordierite/Microcomposite Ceramic Substrates (Cordierite/Microcopmposite 저온 소성 세라믹 기판재료)

  • 구본급
    • Journal of the Microelectronics and Packaging Society
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    • v.2 no.1
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    • pp.49-58
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    • 1995
  • 출발물질은 cordierite 유리와 borosilicate/Si3N4 복합분말을 사용하였다. Cordierite 유리조성은 무게비로 17.8MgO-23.1Al2O3-48.1ASiO2-5.0ZnO-1.0B2O3를 선택하였다. Borosilicate/Si3N4복합분말은 sol-gel법으로 a-si3N4 core 분말에 borosilicate 겔을 코팅하여 얻었다. 복합분말과 cordierite 유리 분말을 부피비로 0/100, 12.5/87.5 및 25/75의 조성으로 혼합하여 tape casting 에 의해 green sheet를 제작하였다. 이들 sheet들을 800~100$0^{\circ}C$에서 2시간 소성하여 얻은 시편을 SEM, XRD, 밀도, 유전상수 등을 측정하여 저 유전율의 저온 소성 기판재료를 제조하기 위한 조건들을 검토하였다.

Thermal Residual Stress Relaxation Behavior of Alumina/SiC Nanocomposites (Alumina/SiC 나노복합재료에서의 잔류 열응력 완화거동에 관한 연구)

  • Choa, Y.H.;Niihara, K.;Ohji, T.;Singh, J.P.
    • Proceedings of the Korean Powder Metallurgy Institute Conference
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    • 2002.04b
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    • pp.11-11
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    • 2002
  • Plastic deformation was observed by TEM around the intragranular SiC particles in the $Al_2O_3$ matrix for $Al_2O_3/SiC$ nanocomposite system. The dislocations are generated at selected planes and there is a tendency for the dislocations to form a subgrain boundary structure with low-angel grain boundaries and networks. In this study, dislocation generated in the $Al_2O_3$ matrix during cooling down from sintering temperatures by the highly localized thermal stresses within and/or around SiC particles caused from the thermal expansion mismatch between $Al_2O_3$ matrix and SiC particle was observed. In monolithic $Al_2O_3$ and $Al_2O_3/SiC$ microcomposite system. These phenomena is closely related to the plastic relaxation of the elastic stress and strain energy associated with both thermal misfitting inclusions and creep behaviors. The plastic relaxation behavior was explained by combination of yield stress and internal stress.

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Rheological Behavior of Polymer/Layered Silicate Nanocomposites under Uniaxial Extensional Flow

  • Park Jun-Uk;Kim Jeong-Lim;Kim Do-Hoon;Ahn Kyung-Hyun;Lee Seung-Jong;Cho Kwang-Soo
    • Macromolecular Research
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    • v.14 no.3
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    • pp.318-323
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    • 2006
  • We investigated the rheological behaviors and orientation of three different types of layered silicate composite systems under external flow: microcomposite, intercalated and exfoliated nanocomposites. Rheological measurements under shear and uniaxial extensional flows, two-dimensional, small-angle X-ray scattering and transmission electron microscopy were conducted to investigate the properties, as well as nano- and micro-structural changes, of polymer/layered silicate nanocomposites. The preferred orientation of the silicate layers to the flow direction was observed under uniaxial extensional flow for both intercalated and exfoliated systems, while the strain hardening behavior was observed only in the exfoliated systems. The degree of compatibility between the polymer matrix and clay determined the microstructure of polymer/clay composites, strain hardening behavior and spatial orientation of the clays under extensional flow.