• 한국해양공학회지
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• 제4권2호
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• pp.244-244
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• 1990

This paper deals with investigating experimentally the effects of PWHT on the weld quality such as strength, toughness, hardness and micro-structure of the welded joints in friction welding of torsion bar material SUP9A bar to bar. The results obtained are summarized as follows; 1) It was certified that the condition of the post-weld heat treatment(PWHT) for the friction welded joints was very satisfactory because both strength and toughness of the joints were improved as almost same as those of the base metal or better by the PWHT. 2) The peak of hardness distribution of the friction welded joints can be eliminated by PWHT, resulting in being almost equalized at the weld interface, the HAZ(heat affected zone) and the base metal. 3) The micro-structure of the base meta., HAZ and weld interface(WI) of friction welded joints welded at the optimum welding condition consists of the same sorbite structure obtained by PWHT and fined sorbite at WI, resulting in increasing toughness as well as strength, and no micro structural defect has been found at the friction welded zone.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2004년도 춘계 학술발표대회 개요집
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• pp.39-41
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• 2004

This study is to optimize the condition of pulse parameters using the response surface method in micro pulse TIG welding of pleated type metallic filter. The input parameters used were pulse current, base current, pulse duty, frequency and welding speed and the hydraulic pressure was used as the output parameter. The central composite design was designed using second order regression model, As the results, the optimal welding condition to manufacture the pleated type metallic filter was obtained.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2003년도 추계학술발표대회 개요집
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• pp.234-236
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• 2003

• Journal of Welding and Joining
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• 제26권2호
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• pp.12-15
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• 2008

• Journal of Welding and Joining
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• 제30권5호
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• pp.1-3
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• 2012

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2001년도 춘계학술발표대회 개요집
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• pp.305-307
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• 2001

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 1993년도 특별강연 및 춘계학술발표 개요집
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• pp.132-134
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• 1993

The conventional way of molten nugget size measurement in welding process have utilized the metal-microscope by examining the micro sectioned weld specimen after micro-etching procedure. This paper proposes a new method for exact measurement of molten nugget size with the aid of the digital image processing unit and some developed software. This method proved to be convenient and precise in that resulting resolution and accuracy are as good as that of the conventional method.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2004년도 추계학술발표대회 개요집
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• pp.79-81
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• 2004

In this study EB(Electron Beam) welder was modified to apply Ef welder to micro-joining for soldering and micro-brazing. The power and beam current of EB welder is 6kW, 100mA(60kV) and the minimum current was 1mA. The minimum current of EB welder was modified to decrease the amount of beam current to 0.0lmA and the monitoring system to observe materials was made up. The system is developed including teaching function for generating patterns. The control system and CAD/CAM software for EB direct writing was developed and the deflection beam was controlled without moving workpieces. the possibility of applying EB welder to micro-joining for soldering and brazing was studied through this experiments.

• Journal of Welding and Joining
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• 제13권4호
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• pp.14-23
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• 1995

Micro soldering 기술의 응용은 주로 전자제품에 이용되며, 특히 컴퓨터 정보 통신 기기의 집합.접속 기술의 중추적인 역할을 하고 있다. 아울러 이 분야는 일본, 미국이 선구적인 역할을 하고 있으며, 예를 들어 일본 전자산업의 1994년도 생산액이 앤 고의 열쇠에 불구하고 민생용.산업용 전자기기 및 전자 부품의 3부분에서 약 .yen.30조(250조원)에 달한 것으로 보면 그 규모 및 중요성을 알 수 있다. 이것은 기본 적으로 반도체의 집적도가 높아진것(LSI.rarw.VLSI.rarw.ULSI)과 아울러 소자를 접합 접속시키는 기술이 확보되었기 때문에 이루어진 결과라고 말할 수 있다. 따라서 본 기술 해설에서는 접합.접속 기술의 하나인 Micro soldering의 각종 프로세스 중에서 도 특히 기본이 되는 리플로우 프로세스(reflow process)를 중심으로 기술하였으며 아울러 신뢰성의 제반사항에 관하여 간략하게 기술하였다.

• Journal of Welding and Joining
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• 제32권3호
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• pp.19-26
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• 2014

Through Silicon Via (TSV) technology is the shortest interconnection technology which is compared with conventional wire bonding interconnection technology. Recently, this technology has been also noticed for the miniaturization of electronic devices, multi-functional and high performance. The short interconnection length of TSV achieve can implement a high density and power efficiency. Among the TSV technology, TSV filling process is important technology because the cost of TSV technology is depended on the filling process time and reliability. Various filling methods have been developed like as Cu electroplating method, molten solder insert method and Ti/W deposition method. In this paper, various TSV filling methods were introduced and each filling materials were discussed.