• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.1442-1445
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• 2005

Several test methods, including micro strain/deformation measurement techniques, have been studied to more reliably measure the micro properties in micro/nano materials. Therefore, in this study, the continuous measurement of in-plane tensile strain in micro-sized specimens of thin film materials was introduced using the micro-ESPI technique. TiN and Au thin films 1 and $0.47\;\mu{m}$ thick, respectively, were deposited on the silicon wafer and fabricated into the micro-sized tensile specimens using the electromachining process. The micro-tensile loading system and micro-ESPI system were developed to measure the tensile strain during micro-tensile test. The micro-tensile stress-strain for these materials was determined using the algorithm for continuous strain measurement. Furthermore, algorithm for enhancing the sensitivity to measurement of in-plane tensile strain was suggested. According to the algorithm for enhancement of sensitivity, micro-tensile strain data between interfringe were calculated. It is shown that the algorithm for enhancement of the sensitivity suggested in this study makes the sensitivity to the in-plane tensile strain increase.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.220-224
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• 2005

The technology trend of Flat Panel Display (FPD) equipments have been demanded that there are compact and multi-function. Therefore, nano/micro scale patterned on polymeric materials of Back Light Unit (BLU) in Liquid Crystal Display (LCD) that has been investigated. This paper describes a series of Horizontal Type Micro Tensile Tester that were carried out to investigate the load strain distance performance of typical polymeric material sheets. The polymeric materials film that micro size shaped specimens for tensile test are used by Cold-Isostatic-Press (CIP). Test equipment is Horizontal type Micro Tensile Tester that is presented to measure the micro scale mechanical property of thin film for FPD. This paper presents which easy testing tools measure for micro patterned on polyethylene (PET) specimens.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회A
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• pp.45-48
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• 2008

The mechanical behavior of small-sized materials has been investigated for many industrial applications, including MEMS and semiconductors. It is challenging to obtain accurate mechanical properties measurements for thin films due to several technical difficulties, including measurement of strain, specimen alignment, and fabrication. In this work, we used the micro-tensile testing unit with the real-time DIC (Digital Image Correlation) strain measurement system. This system has advantages of real time strain monitoring up to 50 nm resolution during the micro-tensile test, and ability to measure the young's modulus and Poisson's ratio at the same time. The mechanical properties of SCS (Single Crystal Silicon) are measured by uniaxial tension test from freestanding SCS which are $2.5{\mu}m$ thick, $200-500{\mu}m$ wide specimens on the (100) plane. Young's modulus, Poisson's ratio and tensile strength in the <110> direction are measured by micro-tensile testing system.

• 소성∙가공
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• 제13권3호
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• pp.285-289
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• 2004

Micro tensile test specimens of thin film single crystal silicon for the most useful structural materials in MEMS (Micro Electro Mechanical System) devices were fabricated using SOI (Silicon-on-Insulator) wafers and MEMS processes. Dimensions of micro tensile test specimens were thickness of $7\mu\textrm{m}$, width of 50~$350\mu\textrm{m}$, and length of 2mm. Top and bottom silicon were etched using by deep RIE (Reactive Ion Etching). Thin film aluminum markers on testing region of specimens with width of $5\mu\textrm{m}$, lengths of 30~$180\mu\textrm{m}$ and thickness of 200 nm for measuring tensile strain were fabricated by aluminum wet etching method. Fabricated side wall angles of aluminum marker were about $45^{\circ}~50^{\circ}$. He-Ne laser with wavelength of 633nm was used for checking fringed patterns.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2004년도 춘계학술대회
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• pp.240-245
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• 2004

Tensile properties of hard coating material, TiN, were evaluated using micro-tensile testing system. TiN has been known as a hard coating material commonly used today. Micro-tensile testing system consisted of a micro tensile loading system and a micro-ESPI(Electronic Speckle Pattern Interferometry) system. Micro-tensile loading system had a maximum load capacity of 500mN and a resolution of 4.5 nm in stroke. TiN thin film $1{\mu}m$ thick was deposited on the Si wafer pre-deposited of $Si_3N_4$ film substrate by the closed field unbalanced magnetron sputtering (CFUBMS) process. Three kinds of micro-tensile specimen with the respective width of $50{\mu}m$, $100{\mu}m$ and $500{\mu}m$ were fabricated by MEMS process. The mechanical properties including tensile strength and elastic modulus were determined using the micro-tensile testing system and compared by those obtained by nano-indentation

• 소성∙가공
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• 제11권7호
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• pp.561-568
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• 2002

Micro tensile test is the most direct and convenient method to measure material properties such as Young's modulus and fracture strength. It, however, needs more accurate measurement system, mote stable and repetitive alignment and more sensitive gripping than conventional tensile test. Many researchers have put their effort on overcoming these difficulties for tile development of micro tensile tester, fabricating micro specimens of functional materials and measuring their properties. This paper will review the related vigorous researches over the world in the recent decade and explain how to apply them to a design of the fester which is under our own development.

• 한국세라믹학회지
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• 제52권6호
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• pp.441-448
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• 2015

Silicon carbide (SiC) coatings for tri-isotropic (TRISO) nuclear fuel particles were fabricated using a chemical vapor deposition (CVD) process onto graphite. A micro-tensile-testing system was developed for the mechanical characterization of SiC coatings at high temperatures. The fracture strength of the SiC coatings was characterized by the developed micro-tensile test in the range of $25^{\circ}C$ to $1000^{\circ}C$. Two types of CVD-SiC films were prepared for the micro-tensile test. SiC-A exhibited a large grain size (0.4 ~ 0.6 m) and the [111] preferred orientation, while SiC-B had a small grain size (0.2 ~ 0.3 mm) and the [220] preferred orientation. Free silicon (Si) was co-deposited onto SiC-B, and stacking faults also existed in the SiC-B structure. The fracture strengths of the CVD-SiC coatings, as measured by the high-temperature micro-tensile test, decreased with the testing temperature. The high-temperature fracture strengths of CVD-SiC coatings were related to the microstructure and defects of the CVD-SiC coatings.

• 열처리공학회지
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• 제30권3호
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• pp.106-112
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• 2017

In this study dual-phase steels with different ferrite grain size and martensite fraction were fabricated by varying micro-alloying elements and intercritical anneling temperatures, and then the tensile properties were investigated in terms of yield and tensile strengths, elongation, and yield ratio. The addition of micro-alloying elements reduced ferrite grain size, and the increased intercritial transformation tempeature increased the martensite fracton. The tensile test results showed that yield and tensile strengths of all the steel specimens increased with increasing the martensite fraction. However, the elongation and yield ratio were differently changed according to variations in the morphology and carbon content of martensite, ferrite grain size, and precipitates resulting from the addition of micro-alloying elements and intercritical annealing.

• Elastomers and Composites
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• 제36권4호
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• pp.255-261
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• 2001

Precut을 가지고 있는 고무 시편에서 서로 다른 온도에서 인장 강도의 영향을 조사하였다. 온도 조건에 따라 precut이 있는 시편과 precut이 없는 시편의 인장 강도는 서로 다른 거동을 보였다. $80^{\circ}C$에서는 임계 Precut 크기보다 더 큰 precut를 가지는 시편은 상온에서 시편보다 높은 인장 강도를 보였다. 상온에서 측정한 시편에 비하며 $80^{\circ}C$에서 측정한 시편은 잘 발달된 2차 균열들을 가지고 있는 반면, $110^{\circ}C$에서 측정한 시편의 경우 2차 균열들이 명확하게 발달하지 못하였다. 서로 다른 온도에서 인장강도의 차이는 인장시 발달된 결정화도와 균열 끝 부분에서 형성된 미세 균열 형상과 관계가 있는 것으로 보인다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2008년도 춘계학술대회 논문집
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• pp.139-140
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• 2008