• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2012년도 추계총회 및 학술대회 논문집
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• pp.71-71
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• 2012

Memory 반도체 Test공정에서 사용되는 Probe Card의 Probing Area가 넓어지면서 종래에 사용되던 Cantilever제품의 사용이 불가능하게 되고, MEMS공정을 사용한 새로운 형태의 Advanced제품이 시장에 출현을 하였다. MEMS형의 제품은 다수의 Micro Spring을 MLC(Multi Layer Ceramic)위에 MEMS 공정을 사용하여 생성하는 방식으로서 MLC는 좁은 지역에 다수의 Pin을 생성 할 수 있는 공간을 만들어 주며, 또 다른 이유는 전기적 특성인 임피던스를 맞추고 다수의 Pin의 압력에 의하여 생기는 하중을 Ceramic기판으로 지탱하기 위한 목적도 있다. 이에 MLC와 같은 전기적 특성을 임피던스를 맞춘 RF-CPCB를 사용하여 작은 면적에 다수의 Pin접합이 가능한 방법을 마련한 후, 이 RF-PCB를 부착하여 Pin의 하중을 받는 Wafer와 유사한 열팽창을 갖는 Substrate를 사용하여 MLC를 대체하여 다양한 온도 조건에서 사용이 가능하며, 복잡하고 공정비가 많이 드는 MEMS 공정에 의한 일괄 Micro Spring 생성 공정을 전주 도금 또는 2D방식의 도금 Pin으로 대체하였으며, Probe Card의 중요한 물리적 특성인 Pin들의 정렬도를 마련하기 위해 Photo Process를 사용한 Wafer로 만든 Wafer Pin Array Frame을 사용하여 2D 제작 Pin을 일괄 또는 부분 접합이 가능한 방법으로 Probe Array Head를 제작하여 이들을 부착하여 Probe Array Head를 이전의 MEMS공정 방법에 비해 쉽고 빠르게 만들어 probe Card를 제작 할 수 있게 되었다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2012년도 추계학술대회 논문집
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• pp.163-164
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• 2012

• 산업기술연구
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• 제23권A호
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• pp.21-27
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• 2003

The bio-micro pin is usually used for biochemistry analysis. The capability of manufacturing the micro-pin and array with effective and low-cost way is very important to developers. The micro-pin is composed of "sample channel" putting liquid into already fixed volume, "flat tip" having connection with printing quantity, and "head part" for preventing it from rotation of pin in the holder. We analyzed out printing variation in accordance with shape and tip size of the micro-pin point channel, In this study, we suggested the manufacturing progress and shape demand condition of the micro-pin which could put $0.2{\mu}{\ell}$-biochemistry material into the sample volume, and will be able to produce the micro-pin which can put $10n{\ell}$-biochemistry material into the sample volume in the future.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2011년도 춘계학술대회 논문집
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• pp.795-796
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• 2011

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2004년도 추계학술대회 논문집
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• pp.500-504
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• 2004

The bio-micro pin has been usually used for the biochemistry analysis. The manufacturing capability of the micro-pin and the their array with the effective and low-cost way is very important and it gives great economical benefits to developers. The micro-pin is composed of the sample channel for holding the liquid with the fixed volume, the flat tip which determines the printing quality and the pin head for preventing the rotation of the pin in the holder. In this study, we have manufactured newly designed micro-pins by the wire-EDM process with special jigs, and analyzed liquid holding and printing characteristics with respect to the variation of the shape and the tip size of the micro-pin.

• 제어로봇시스템학회논문지
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• 제19권11호
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• pp.979-983
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• 2013

The three-dimensional measurement method of confocal systems is a spot scanning method which has a high resolution and good illumination efficiency. However, conventional confocal systems had a weak point in that it has to perform XY axis scanning to achieve FOV (Field of View) vision through spot scanning. There are some methods to improve this problem involving the use of a galvano mirror [1], pin-hole array, etc. Therefore, in this paper we propose a method to improve a parallel mode confocal system using a micro-lens and pin-hole array in a dual microscope configuration. We made an area scan possible by using a combination MLA (Micro Lens Array) and pin-hole array, and used an objective lens to improve the light transmittance and signal-to-noise ratio. Additionally, we made it possible to change the objective lens so that it is possible to select a lens considering the reflection characteristic of the measuring object and proper magnification. We did an experiment using 5X, 2.3X objective lens, and did a calibration of height using a VLSI calibration target.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1996년도 하계학술대회 논문집 C
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• pp.1950-1953
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• 1996

A $1\;{\times}\;4$ micro mirror array is designed and fabricated. In contrast to other micro mirrors which utilize torsional flexure hinges or cantilevers for restoring torque and supporting purpose, we have placed a substrate hinge structure under each mirror. Each micro mirror consists of address electrode, substrate hinge consisting of pin and staple, supporter post, and mirror plate. Electrical connection between mirror plate and ground electrode is established by substrate hinge. Mirror undergoes a rotational motion due to electrostatic force when voltage difference is applied between address electrode and mirror plate. Micro mirrors with two different types of staple shape and two different pin sizes are designed and fabricated. Each mirror is designed to have ${\pm}\;10^{\circ}$ of deflection angle and have $100\;{\times}\;110\;{\mu}m^2$ of size.

• Tribology and Lubricants
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• 제24권6호
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• pp.368-373
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• 2008

This paper will investigate the friction characteristics of a 100m Hexagonal Array, Micro-scale Dimple Pattern, on bearing steel. These characteristics are researched by utilizing a pin-on-disk wear test machine, under various test conditions. The reduction of friction is a necessary requirement for the improved efficiency of this machine. As the speed increases, there is a decrease in the effect of the dimple of friction characteristic, with substantially little change to density. Conversely, as the load increases, the dimple pattern grows larger, resulting in a difference in the texture of these two components. At a dimple density of 10% the friction characteristic is easily demonstrated, with a consistent change in both speed and load.

• 마이크로전자및패키징학회지
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• 제17권4호
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• pp.73-76
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• 2010

A two-facet approach was used to investigate the parametric performance of functional high-speed DDR3 (Double Data Rate) DRAM (Dynamic Random Access Memory) die placed in different types of BGA (Ball Grid Array) packages: wire-bonded BGA (FBGA, Fine Ball Grid Array), flip-chip (FCBGA) and lead-bonded $microBGA^{(R)}$. In the first section, packaged live DDR3 die were tested using automatic test equipment using high-resolution shmoo plots. It was found that the best timing and voltage margin was obtained using the lead-bonded microBGA, followed by the wire-bonded FBGA with the FCBGA exhibiting the worst performance of the three types tested. In particular the flip-chip packaged devices exhibited reduced operating voltage margin. In the second part of this work a test system was designed and constructed to mimic the electrical environment of the data bus in a PC's CPU-Memory subsystem that used a single DIMM (Dual In Line Memory Module) socket in point-to-point and point-to-two-point configurations. The emulation system was used to examine signal integrity for system-level operation at speeds in excess of 6 Gb/pin/sec in order to assess the frequency extensibility of the signal-carrying path of the microBGA considered for future high-speed DRAM packaging. The analyzed signal path was driven from either end of the data bus by a GaAs laser driver capable of operation beyond 10 GHz. Eye diagrams were measured using a high speed sampling oscilloscope with a pulse generator providing a pseudo-random bit sequence stimulus for the laser drivers. The memory controller was emulated using a circuit implemented on a BGA interposer employing the laser driver while the active DRAM was modeled using the same type of laser driver mounted to the DIMM module. A custom silicon loading die was designed and fabricated and placed into the microBGA packages that were attached to an instrumented DIMM module. It was found that 6.6 Gb/sec/pin operation appears feasible in both point to point and point to two point configurations when the input capacitance is limited to 2pF.

• 대한기계학회논문집B
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• 제41권6호
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• pp.381-387
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• 2017

수소화붕소나트륨은 안정적으로 수소가 저장된 물질이며, 촉매반응으로 수소를 용이하게 분리할 수 있다. 본 연구에서는 탈수소 반응률을 높이기 위해 비표면적이 큰 마이크로 pin fin 화학반응기를 제작하여 수소화붕소나트륨 수용액의 압력강하 및 탈수소 화학반응 실험을 수행하였다. 나노공정을 이용하여 실리콘웨이퍼에 높이 $300{\mu}m$, 직경 $50{\mu}m$의 pin fin을 축간격 1.3, 횡간격 1.5으로 엇갈림 배열하였다. 수소화붕소나트륨 수용액은 5~20 wt.% 농도로 Re수 1~60으로 공급되었으며, 초고속카메라를 이용하여 탈수소반응 유동양상을 관찰하였다. 실험 결과 마이크로 pin fin 화학반응기는 동일 수력학적직경을 가지는 직관 마이크로채널 화학반응기보다 화학반응 성능이 2.45배 우수한 반면, 압력강하는 1.5배 증가하였다.