• Title/Summary/Keyword: Micro-pin array

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Make Probe Head Module use of Wafer Pin Array Frame (Wafer Pin Array Frame을 이용한 Probe Head Module)

  • Lee, Jae-Ha
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2012.11a
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    • pp.71-71
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    • 2012
  • Memory 반도체 Test공정에서 사용되는 Probe Card의 Probing Area가 넓어지면서 종래에 사용되던 Cantilever제품의 사용이 불가능하게 되고, MEMS공정을 사용한 새로운 형태의 Advanced제품이 시장에 출현을 하였다. MEMS형의 제품은 다수의 Micro Spring을 MLC(Multi Layer Ceramic)위에 MEMS 공정을 사용하여 생성하는 방식으로서 MLC는 좁은 지역에 다수의 Pin을 생성 할 수 있는 공간을 만들어 주며, 또 다른 이유는 전기적 특성인 임피던스를 맞추고 다수의 Pin의 압력에 의하여 생기는 하중을 Ceramic기판으로 지탱하기 위한 목적도 있다. 이에 MLC와 같은 전기적 특성을 임피던스를 맞춘 RF-CPCB를 사용하여 작은 면적에 다수의 Pin접합이 가능한 방법을 마련한 후, 이 RF-PCB를 부착하여 Pin의 하중을 받는 Wafer와 유사한 열팽창을 갖는 Substrate를 사용하여 MLC를 대체하여 다양한 온도 조건에서 사용이 가능하며, 복잡하고 공정비가 많이 드는 MEMS 공정에 의한 일괄 Micro Spring 생성 공정을 전주 도금 또는 2D방식의 도금 Pin으로 대체하였으며, Probe Card의 중요한 물리적 특성인 Pin들의 정렬도를 마련하기 위해 Photo Process를 사용한 Wafer로 만든 Wafer Pin Array Frame을 사용하여 2D 제작 Pin을 일괄 또는 부분 접합이 가능한 방법으로 Probe Array Head를 제작하여 이들을 부착하여 Probe Array Head를 이전의 MEMS공정 방법에 비해 쉽고 빠르게 만들어 probe Card를 제작 할 수 있게 되었다.

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A study on Manufacturing of Micro Dotting Pin (바이오용 마이크로 핀의 제작에 관한 연구)

  • Lee, Young-Soo;Km, Kwang-Soon;Kim, Byeong-Hee
    • Journal of Industrial Technology
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    • v.23 no.A
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    • pp.21-27
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    • 2003
  • The bio-micro pin is usually used for biochemistry analysis. The capability of manufacturing the micro-pin and array with effective and low-cost way is very important to developers. The micro-pin is composed of "sample channel" putting liquid into already fixed volume, "flat tip" having connection with printing quantity, and "head part" for preventing it from rotation of pin in the holder. We analyzed out printing variation in accordance with shape and tip size of the micro-pin point channel, In this study, we suggested the manufacturing progress and shape demand condition of the micro-pin which could put $0.2{\mu}{\ell}$-biochemistry material into the sample volume, and will be able to produce the micro-pin which can put $10n{\ell}$-biochemistry material into the sample volume in the future.

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Manufacturing of Micro Dotting Pin (DNA Chip 용 마이크로 핀에 관한 연구)

  • 신홍규;이영수;남권선;김병희
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 2004.10a
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    • pp.500-504
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    • 2004
  • The bio-micro pin has been usually used for the biochemistry analysis. The manufacturing capability of the micro-pin and the their array with the effective and low-cost way is very important and it gives great economical benefits to developers. The micro-pin is composed of the sample channel for holding the liquid with the fixed volume, the flat tip which determines the printing quality and the pin head for preventing the rotation of the pin in the holder. In this study, we have manufactured newly designed micro-pins by the wire-EDM process with special jigs, and analyzed liquid holding and printing characteristics with respect to the variation of the shape and the tip size of the micro-pin.

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A Parallel Mode Confocal System using a Micro-Lens and Pinhole Array in a Dual Microscope Configuration (이중 현미경 구조를 이용한 마이크로 렌즈 및 핀홀 어레이 기반 병렬 공초점 시스템)

  • Bae, Sang Woo;Kim, Min Young;Ko, Kuk Won;Koh, Kyung Chul
    • Journal of Institute of Control, Robotics and Systems
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    • v.19 no.11
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    • pp.979-983
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    • 2013
  • The three-dimensional measurement method of confocal systems is a spot scanning method which has a high resolution and good illumination efficiency. However, conventional confocal systems had a weak point in that it has to perform XY axis scanning to achieve FOV (Field of View) vision through spot scanning. There are some methods to improve this problem involving the use of a galvano mirror [1], pin-hole array, etc. Therefore, in this paper we propose a method to improve a parallel mode confocal system using a micro-lens and pin-hole array in a dual microscope configuration. We made an area scan possible by using a combination MLA (Micro Lens Array) and pin-hole array, and used an objective lens to improve the light transmittance and signal-to-noise ratio. Additionally, we made it possible to change the objective lens so that it is possible to select a lens considering the reflection characteristic of the measuring object and proper magnification. We did an experiment using 5X, 2.3X objective lens, and did a calibration of height using a VLSI calibration target.

Design and Fabrication of Micro Mirror with Staple and Pin (경첩과 핀을 사용한 가동 마이크로 미러의 설계와 제작)

  • Ji, Chang-Hyeon;Kim, Yong-Kweon;Yoon, Eui-Joon;Choi, Bum-Kyoo
    • Proceedings of the KIEE Conference
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    • 1996.07c
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    • pp.1950-1953
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    • 1996
  • A $1\;{\times}\;4$ micro mirror array is designed and fabricated. In contrast to other micro mirrors which utilize torsional flexure hinges or cantilevers for restoring torque and supporting purpose, we have placed a substrate hinge structure under each mirror. Each micro mirror consists of address electrode, substrate hinge consisting of pin and staple, supporter post, and mirror plate. Electrical connection between mirror plate and ground electrode is established by substrate hinge. Mirror undergoes a rotational motion due to electrostatic force when voltage difference is applied between address electrode and mirror plate. Micro mirrors with two different types of staple shape and two different pin sizes are designed and fabricated. Each mirror is designed to have ${\pm}\;10^{\circ}$ of deflection angle and have $100\;{\times}\;110\;{\mu}m^2$ of size.

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Friction Characteristics of Hexagonal Array Micro-scale Dimple Pattern by Density (Hexagonal Array Micro-Scale Dimple Pattern의 밀도에 따른 마찰특성)

  • Chae, Young-Hoon;Jang, Chung-Sun;Choi, Won-Sik
    • Tribology and Lubricants
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    • v.24 no.6
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    • pp.368-373
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    • 2008
  • This paper will investigate the friction characteristics of a 100m Hexagonal Array, Micro-scale Dimple Pattern, on bearing steel. These characteristics are researched by utilizing a pin-on-disk wear test machine, under various test conditions. The reduction of friction is a necessary requirement for the improved efficiency of this machine. As the speed increases, there is a decrease in the effect of the dimple of friction characteristic, with substantially little change to density. Conversely, as the load increases, the dimple pattern grows larger, resulting in a difference in the texture of these two components. At a dimple density of 10% the friction characteristic is easily demonstrated, with a consistent change in both speed and load.

Experimental investigation of Scalability of DDR DRAM packages

  • Crisp, R.
    • Journal of the Microelectronics and Packaging Society
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    • v.17 no.4
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    • pp.73-76
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    • 2010
  • A two-facet approach was used to investigate the parametric performance of functional high-speed DDR3 (Double Data Rate) DRAM (Dynamic Random Access Memory) die placed in different types of BGA (Ball Grid Array) packages: wire-bonded BGA (FBGA, Fine Ball Grid Array), flip-chip (FCBGA) and lead-bonded $microBGA^{(R)}$. In the first section, packaged live DDR3 die were tested using automatic test equipment using high-resolution shmoo plots. It was found that the best timing and voltage margin was obtained using the lead-bonded microBGA, followed by the wire-bonded FBGA with the FCBGA exhibiting the worst performance of the three types tested. In particular the flip-chip packaged devices exhibited reduced operating voltage margin. In the second part of this work a test system was designed and constructed to mimic the electrical environment of the data bus in a PC's CPU-Memory subsystem that used a single DIMM (Dual In Line Memory Module) socket in point-to-point and point-to-two-point configurations. The emulation system was used to examine signal integrity for system-level operation at speeds in excess of 6 Gb/pin/sec in order to assess the frequency extensibility of the signal-carrying path of the microBGA considered for future high-speed DRAM packaging. The analyzed signal path was driven from either end of the data bus by a GaAs laser driver capable of operation beyond 10 GHz. Eye diagrams were measured using a high speed sampling oscilloscope with a pulse generator providing a pseudo-random bit sequence stimulus for the laser drivers. The memory controller was emulated using a circuit implemented on a BGA interposer employing the laser driver while the active DRAM was modeled using the same type of laser driver mounted to the DIMM module. A custom silicon loading die was designed and fabricated and placed into the microBGA packages that were attached to an instrumented DIMM module. It was found that 6.6 Gb/sec/pin operation appears feasible in both point to point and point to two point configurations when the input capacitance is limited to 2pF.

Pressure Drop and Catalytic Dehydrogenation of NaBH4 Solution Across Pin Fin Structures in a Microchannel Reactor (마이크로 Pin Fin 화학반응기에서 수소화붕소나트륨 수용액의 압력강하 및 탈수소 화학반응 연구)

  • Jung, Ki Moon;Choi, Seok Hyun;Lee, Hee Joon
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.41 no.6
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    • pp.381-387
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    • 2017
  • Dehydrogenation from the hydrolysis of a sodium borohydride ($NaBH_4$) solution has been of interest owing to its high theoretical hydrogen storage capacity (10.8 wt.%) and potentially safe operation. An experimental study has been performed on the catalytic reaction rate and pressure drop of a $NaBH_4$ solution over both a single microchannel with a hydraulic diameter of $300{\mu}m$ and a staggered array of micro pin fins in the microchannel with hydraulic diameter of $50{\mu}m$. The catalytic reaction rates and pressure drops were obtained under Reynolds numbers from 1 to 60 and solution concentrations from 5 to 20 wt.%. Moreover, reacting flows were visualized using a high-speed camera with a macro zoom lens. As a result, both the amount of hydrogenation and pressure drop are 2.45 times and 1.5 times larger in a pin fin microchannel array than in a single microchannel, respectively.