• 한국재료학회지
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• 제23권1호
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• pp.53-58
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• 2013

Superhydrophobic $SiO_2$ layers with a micro-nano hierarchical surface structure were prepared. $SiO_2$ layers deposited via an electrospray method combined with a sol-gel chemical route were rough on the microscale. Au particles were decorated on the surface of the microscale-rough $SiO_2$ layers by use of the photo-reduction process with different intensities ($0.11-1.9mW/cm^2$) and illumination times (60-240 sec) of ultraviolet light. With the aid of nanoscale Au nanoparticles, this consequently resulted in a micro-nano hierarchical surface structure. Subsequent fluorination treatment with a solution containing trichloro(1H,2H,2H,2H-perfluorooctyl)silane fluorinated the hierarchical $SiO_2$ layers. The change in surface roughness factor was in good agreement with that observed for the water contact angle, where the surface roughness factor developed as a measure needed to evaluate the degree of surface roughness. The resulting $SiO_2$ layers revealed excellent repellency toward various liquid droplets with different surface tensions ranging from 46 to 72.3 mN/m. Especially, the micro-nano hierarchical surface created at an illumination intensity of $0.11mW/cm^2$ and illumination time of 60 sec showed the largest water contact angle of $170^{\circ}$. Based on the Cassie-Baxter and Young-Dupre equations, the surface fraction and work of adhesion for the micronano hierarchical $SiO_2$ layers were evaluated. The work of adhesion was estimated to be less than $3{\times}10^{-3}N/m$ for all the liquid droplets. This exceptionally small work of adhesion is likely to be responsible for the strong repellency of the liquids to the micro-nano hierarchical $SiO_2$ layers.

• 한국정밀공학회지
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• 제21권8호
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• pp.34-42
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• 2004

A new polishing technique for three dimensional micro/meso-scale parts is suggested using a micro quill and a magnetic chain structure. The principle of this method is to polish the target surface with the collected magnetic brushes at a micro tool by the non-uniform magnetic field generated around the tool. In a typical magnetic abrasive finishing process magnetic particles and abrasive particles are unbonded each other. But, to finish the three dimensional small parts bonded magnetic abrasive have to be used. Bonded magnetic abrasives are made from direct bonding, and their polishing characteristics are also examined. Alumina, silicon carbide and diamond micro powders are used as abrasives. Base metal matrix is carbonyl iron powder. It is found that bonded magnetic abrasives are superior to unbonded one by experiment. finally, the polished surface roughness is evaluated by atomic force microscope.

• 한국윤활학회:학술대회논문집
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• 한국윤활학회 2002년도 제35회 춘계학술대회
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• pp.40-44
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• 2002

The motivation of this work is to use SAM(Self-Assembled Monolayer) for developing a rapid and flexible non-photolithographic nano-structure fabrication technique which can be utilized in micro-machining of metals as well as silicon-based materials. The fabrication technique implemented in this work consists of a two-step process, namely, mechanical scribing followed by chemical etching. From the experimental results, it was found that thiol on copper surface could be removed even under a few nN normal load. The nano-tribological characteristics of thiol-SAM on various metals were largely dependent on the native oxide layer of metals. Based on these findings, nano-patterns with sub-micrometer width and depth on metal surfaces such as Cu, Au and Ag could be obtained using a diamond-coated tip.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.1518-1521
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• 2005

The application of focused ion beam (FIB) technology in micro/nano machining has become increasingly popular. Its usage in micro/nano machining has advantages over contemporary photolithography or other micro/nano machining technologies such as small feature resolution, the ability to process without masks and being accommodating for a variety of materials and geometries This paper focus to apply the sputtering technology accumulated by experiments to 3d structure fabrication with high resolution. Therefore some verifications and discussions of the characteristics of FIB sputtering results according to focal length were described in this paper. And we suggested the definition of rectangular pattern profile and made the verifications of sputtering results based on definition of it.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2012년도 춘계학술발표회 논문집
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• pp.153-153
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• 2012

자연계에는 다양한 생물체들의 표면 구조가 특수한 기능을 갖는 형태로 되어 있다. 이와 같이 특수한 기능을 갖는 생물체들의 표면 구조는 일반적으로 화학적 조성과 표면의 더불어 나노와 마이크로 구조가 혼합되어 있는, 이른바 hierarchical 구조를 보인다. 그 중에서도 표면 초소수성 특성을 보이는 연잎의 표면과 같은 hierarchical 구조는 self-cleaning effect 등의 기능성 표면 제작에 활용이 가능하여 이를 모사하기 위한 연구가 활발히 진행중에 있다. 이에 본 연구에서는 연잎과 같은 초소수성을 띄는 ZnO nano-in-micro hierarchical 구조를 저온 공정을 통하여 다양한 기판에 제작하였다. 이를 위하여 ZnO 나노 입자 분산 레진을 제작하였고 UV imprinting 과 수열합성법을 통하여 마이크로 패턴 상부에 ZnO 나노 입자가 형성된 ZnO nano-in-micro hierarchical 구조를 형성하였다. 제작된 ZnO hierarchical 구조의 젖음 특성은 표면 접촉각이 $160^{\circ}C$이상인 초소수성을 보였으며, 제작 공정에는 고온의 열처리가 수반되지 않아 PET film 등 다양한 기판에 ZnO hierarchical 구조를 제작할 수 있었다.

• 한국기계가공학회지
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• 제13권4호
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• pp.21-27
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• 2014

The injection molding process has several advantages enabling it to produce large quantities of molded plastic products using a repetitive process. In recent years, it has been necessary to develop an injection molding process with micro/nano-sized patterns for application to the semiconductor industry and to the bio/nano manufacturing industry. In this study, we apply gas pressure to the inside of a mold and consider the gas dissolution phenomenon for a resin filling into a micro pattern with a line structure. Using numerical analysis, we calculate the filling ratio with respect to time for various internal gas pressures and various aspect ratios of the micro-patterns.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2004년도 춘계학술대회
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• pp.252-257
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• 2004

Nanometer-sized structures are being applied to many devices including micro/nano electronics, optoelectronics, quantum devices, MEMS/NEMS, biosensors, etc. Especially, the thin film with submicron thickness is a basic structure for fabricating these devices, but its mechanical behaviors are not well understood. The mechanical properties of the thin film are different from those of the bulk structure and are difficult to measure because of its handling inconvenience. Several techniques have been applied to mechanical characterization of the thin film, such as nanoindentation test, micro/nano tensile test, strip bending test, etc. In this study, we focus on the strip bending test because of its high accuracy and moderate specimen preparation efforts, and measure Au thin film, which is a very popular material in micro/nano electronic devices. Au film is deposited on Si substrate by evaporation process, of which thickness is 100nm. Using the strip bending test, we obtain elastic modulus, yield and ultimate tensile strength, and residual stress of Au thin film.

• 한국추진공학회지
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• 제15권6호
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• pp.15-25
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• 2011

금속 연료 중 널리 사용되는 알루미늄의 연소 특성에 관하여 1차원 연소모델링을 제안하였다. 연소 모델링은 예열영역, 반응영역, 반응 후 영역, 세 영역으로 나누어 수행하였다. 또한 희박연소로 가정하여 단일 입자의 경우 입자크기와 당량비에 따른 화염속도, 나노와 마이크로 입자의 혼합물의 경우 혼합 비율에 따른 화염속도를 압력이 1기압 조건에서 계산하여 실험결과와 비교하였다. 단일입자의 경우, 입자의 크기가 작아질수록 화염속도가 빨라지고, 당량비가 낮아질수록 화염속도가 느려지는 현상이 관찰되었다. 나노와 마이크로 입자의 혼합물의 경우, 나노 입자의 함유량에 따라 화염속도는 빨라지며, 화염구조는 분리화염과 중첩화염이 나타남이 관찰되었다.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2012년도 추계총회 및 학술대회 논문집
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• pp.63-64
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• 2012

• 한국정밀공학회지
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• 제33권4호
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• pp.265-270
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• 2016

Recently, many studies have been conducted on the nano-scale fabrication technology using twophoton- absorbed polymerization induced by a femtosecond laser. The nano-stereolithography process has many advantages as a technique for direct fabrication of true three-dimensional shapes in the range over several microns with sub-100 nm resolution, which might be difficult to obtain by using general nano/microscale fabrication technologies. Therefore, two-photon induced nano-stereolithography has been recently recognized as a promising candidate technology to fabricate arbitrary 3D structures with sub-100 nm resolution. Many research works for fabricating novel 3D nano/micro devices using the two-photon nano-stereolithography process, which can be utilized in the NT/BT/IT fields, are rapidly advancing.