• Journal of Welding and Joining
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• v.27 no.4
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• pp.73-78
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• 2009

Characterization of the microweld CCFL electrode for the TFT-LCD backlight unit was carried out in terms of the glass beading heat treatment conditions. We evaluate the weld zone and parent metal of the microweld CCFL electrodes that were exposed to simulated glass beading heat treatment. The CCFL electrode was composed of the cup made with pure Ni, the pin made with pure Mo and the lead wire made with Ni-Mn alloy. Each part of the electrode was assembled together by micro spot welding process and then the assembled electrodes were exposed to simulated glass beading temperatures of $700^{\circ}C,\;750^{\circ}C$ and $800^{\circ}C$. The microstructures of the microweld CCFL electrode were observed by using optical microscope, scanning electron microscope and EDS. Micro-tensile and microhardness test were also carried out. The results indicated that the grain coarsening in the HAZs(heat affected zones) for both the cup-pin weld and pin-lead wire were exhibited and the grain coarsening of the HAZ for the cup and the lead wire was more obvious than the HAZ of the pin. The micro-tensile test revealed that the fracture occurred at the cup-pin weld zone for all test conditions. The fracture surface could be classified into two parts such as pin portion and cup portion including weld nugget. The failure was seemed to be initiated from the boundary between nugget and pin through the weld joint. The result of the microhardness measurement exhibited that the relatively low hardness value, about 105HV was recorded at the HAZ of the cup. This value was about 50% less than that of the original value of the cup. The reduction of the microhardness was considered as the cause of the grain coarsening due to welding process. It was also appeared that there was no change in electric resistance for the standard electrodes and heat treated electrodes.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.720-725
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• 2002

In recent years, techniques for micro-assembly with high repeatability under a scanning electron microscope (SEM) are required to construct highly functional micro-devices. Adhesion phenomenon is more significant for smaller objects, becanse adhesional force is proportional to size of the objects while gravitational force is proportional to the third power of it. It is also known that adhesional force between micro-objects exposed to Electron Beam irradiation of SEM increases with the elapsed time. Therefore, mechanical manipulation techniques using a needle-shaped tool by adhesional force are often adopted in basic researches where micro-objects are studied. These techniques, however, have not yet achieved the desired repeatability because many of these could not have been supported theoretically. Some techniques even need the process of trial-and-error. Thus, in this paper, mechanical and adhesional micro-manipulation are analyzed theoretically by introducing new physical factors, such as adhesional force and rolling-resistance, into the kinematic system consisting of a sphere, a needle-shaped tool, and a substrate. Through this analysis, they are revealed that how the micro-sphere behavior depends on the given conditions, and that it is possible to cause the fracture of the desired contact interfaces selectively by controlling the force direction in which the tool-tip loads to the sphere. Based on the acquired knowledge, a mode diagram, which indicates the micro-sphere behavior for the given conditions, is designed. By refening to this mode diagram, the practical technique of the pick and place manipulation of a micro-sphere under an SEM by the selective interface fracture is proposed.

• Journal of Welding and Joining
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• v.23 no.6
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• pp.49-54
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• 2005

Inner Structured and Bonded(ISB) panel, a kind of metallic sandwich panel, consists of two thin skin plates bonded to a micro-patterned inner structure. Its overall thickness is $1\~3mm$and it has attractive properties such as ultra-lightweight, high efficiency in stiffness-to-weight and strength-to-weight ratio. In many previous studies, resistance welding, brazing and adhesive bonding are studied for joining the panel. However these methods did not consider productivity, but focused on structural characteristics of joined panels, so that the joining process is very complicated and expensive. In this paper, a new joining process with resistance welding is developed. Curved surface electrodes are used to consider the productivity and the stopper is used between electrodes during welding time to maintain the shape of inner structure. Welding time, gap of electrodes and distance between welding points are selected as the process parameters. By measuring the tensile load with respect to the variation of welding time and gap of electrodes, proper welding conditions are studied. Welding time is proper between 1.5-2.5cycle. If welding time is too long, then inner structures are damaged by overheating. Gap of electrode should be shorter than threshold value fur joint strength, when total thickness of inner structure and skin plate is 3.3mm, the threshold distance is 3.0mm.

• Proceedings of the KWS Conference
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• 2005.06a
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• pp.106-108
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• 2005

The instrumented fuel irradiation test at a research reactor is needed to evaluate the performance of the developed nuclear fuel. The fuel elements can be designed to measure the center line temperature of fuel pellets during the irradiation test by using temperature sensor. The thermal sensor was composed of thermocouple and sensor sheath. Micro-laser welding technology was adopted to seal between seal tube and sensor sheath with thickness of 0.15 mm. The soundness of welding area has to be confirmed to prevent fission gas of the fuel from leaking out of the element during the fuel irradiation test. In this study, fundamental data for micro-laser welding technology was proposed to seal temperature sensor sheath of the instrumented fuel element. And, micro-laser welding for dissimilar metals between sensor sheath and seal tube was characterized by investigating welding conditions. Moreover, the micro-laser welding technology is closely related to advanced industry. It is expected that the laser material processing technology will be adopted to various a pplications in the industry.

• Journal of Adhesion and Interface
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• v.7 no.4
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• pp.24-27
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• 2006

International standards claim the best possible reliability in industrial manufacturing processes. This is also essential for the application with manual applicators. The application of adhesives with manual applicators is one of the most frequently used application techniques. The range of application reaches from the building of prototypes in the automobile industry over the use in single or small-batch manufacturing up to applications in crafts enterprises. Conventional manual applicators for adhesives and sealants don't fulfill the demands in international standards for the best possible reliability. Only the worker is able to control the quality and the quantity of the bond. A velocity-controlled manual applicator solves these restrictions. Special sensors and micro controllers calculate the flow-rate, the velocity and the location of the manual applicator. This leads to stable and repeatable application processes which are claimed in international standards. The location of the bond can be compared with the nominal value, so that it is possible to check the quality of the bond during application. Furthermore there is the potential to document the data of the manufacturing process.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.69-77
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• 2016

We propose nano-scale Cu direct bonding technology using ultra-high density Cu nano-pillar (CNP) with for high stacking yield exascale 2.5D/3D integration. We clarified the joining mechanism of nano-scale Cu direct bonding using CNP. Nano-scale Cu pillar easily bond with Cu electrode by re-crystallization of CNP due to the solid phase diffusion and by morphology change of CNP to minimize interfacial energy at relatively lower temperature and pressure compared to conventional micro-scale Cu direct bonding. We confirmed for the first time that 4.3 million electrodes per die are successfully connected in series with the joining yield of 100%. The joining resistance of CNP bundle with $80{\mu}m$ height is around 30 m for each pair of $10{\mu}m$ dia. electrode. Capacitance value of CNP bundle with $3{\mu}m$ length and $80{\mu}m$ height is around 0.6fF. Eye-diagram pattern shows no degradation even at 10Gbps data rate after the lamination of anisotropic conductive film.

• Journal of Welding and Joining
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• v.26 no.3
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• pp.51-60
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• 2008

This paper is to evaluate fracture characteristics of API 2W Gr.50 TMCP steel weldment typically applied for offshore structures, with the focus on the influence of heat input arising from flux cored arc welding. Based on the results and insights developed from this study, it is found that the toughness for both CTOD and impact exhibits a tendency to decrease as the weld heat input increases. The reheated zone of weldmetal exhibit lower hardness than solidified zone and microstructure that are liable to affect the toughness are acicular ferrite and martensite-austenite constituents (M-A). In particular, M-A is a more effective micro-phase for CTOD toughness than impact toughness.

• Journal of Welding and Joining
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• v.30 no.6
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• pp.80-85
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• 2012

Fatigue cracks in structural components are the most common cause of structural failure when exposed to fatigue loading. In this respect, fatigue crack detection and structural health assessment are very important. Currently, various smart materials are used for detecting fatigue crack and measurement of SIFs(Stress Intensity Factors). So, this paper presented a measurement of SIFs using MFC(Micro Fiber Composite) sensor which is the one of the smart material. MFC sensor is more flexible, durable and reliable than other smart materials. The SIFs of Mode I(K I) as well as Mode II(K II) based on the piezoelectric constitutive law and fracture mechanics are calculated. In this study, the SIF values measured by MFC sensors are compared with the theoretical results.

• Journal of Welding and Joining
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• v.25 no.2
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• pp.55-61
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• 2007

Flash butt weldability of 590MPa dual phase steel is carried out under micro metallographical examination and macro mechanical property tests. The objective of present study is to investigate the cause that brings on bond line fracture, and is to improve mechanical properties of the flash butt welded joint. The joint of flash butt welding has a superior tensile property, but has bad formability due to oxide formed at bond interface. The HAZ softening in the weld joint does not show. It was found that mechanical properties were increased with optimizing welding parameters and making application of oil dripping and post-weld heat treatment.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.6 no.4
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• pp.34-38
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• 1997

This paper presents a joining method by using the silicon wafer in order to apply to joint to the 3-dimensional structures of semiconductor device, high-speed , high integration, micro machine, silicon integrated sensor, and actuator. In this study, the high atomic beam, stabilized by oxidation film and organic materials at the material surface, is investigated, and the purified is obtained by removing the oxidation film and pollution layer at the materials. And the unstable surface is obtained, which can be easily joined. In order to use the low temperatures for the joint method, the main subjects are obtained as follows: 1) In the case of the silicon wafer and the silicon wafer and the silicon wafer of alumina sputter film, the specimens can be jointed at 2$0^{\circ}C$, and the joining strength is 5Mpa. 2) The specimens can not always be joined at the room temperatures in the case of the silicon wafer and the silicon wafer of alumina sputter film.