• 제목/요약/키워드: Micro-indentation machining

검색결과 12건 처리시간 0.026초

누름가공과 AAO 공정을 이용한 나노-마이크로 복합패턴 제작방법 연구 (A Study on Manufacturing Method of Nano-Micro Hybrid Pattern Using Indentation Machining Method and AAO Process)

  • 김한희;전은채;최대희;장웅기;박용민;제태진;최두선;김병희;서영호
    • 한국정밀공학회지
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    • 제32권1호
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    • pp.63-68
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    • 2015
  • Micro/nano patterns for optical concentration and diffusion have been studied in the various fields such as displays, optics, and sensors. Conventional micro patterns were continuous and linear shapes due to using linear-type light sources, however, recently non-continuous patterns have been applied as point sources are used for dot-type light sources such as LEDs and OLEDs. In this study, a hybrid machining technology combining an indentation machining method and an AAO process was developed for manufacturing the non-continuous micro patterns having nano patterns. First, mirror-like surfaces ($R_a<20nm$) of pure Aluminum substrates were obtained by optimizing cutting conditions. Then, The letter of 'K' consisting of the arrays of the micro patterns was manufactured by the indentation machining method which has a similar principle to indentation hardness testing. Finally, nano patterns were machined by AAO process on the micro patterns. Conclusively, a specific letter having nano-micro hybrid patterns was manufactured in this study.

압전구동기를 이용한 초미세 압입장치의 개발 (Development of Ultra-Micro Indentation Device using the PZT Actuator)

  • 박기태;박규열;홍동표
    • 한국공작기계학회:학술대회논문집
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    • 한국공작기계학회 1999년도 춘계학술대회 논문집
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    • pp.51-55
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    • 1999
  • Recently, manufacturing work has been transformed to advanced technology intensive form from mass production with a little items required in the past. It was demanded that superior workpiece surface integrity. However, the study of ductile mode machining was proceeded actively.In this paper, it is developed Ultra-Micro Indentation Device using the PZT actuator. Experimentally, by using theUltra-Micro Indentation device, the micro fracture behavior of the silicon wafer was invesgated. It was possible that ductile-brittle transition point in ultimate surface of brittle material can be detected by adding an acoustic emission sensor system to the Ultra-Micro Indentation apparatus.

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나노인프로세스 형상계측 및 미세가공용 프로브의 개발 (Development of a New Probe to Realize Nano/Micro Mechanical Machining and In-Process Profile Measurement)

  • 권현규;최성대
    • 한국기계가공학회지
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    • 제2권1호
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    • pp.75-84
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    • 2003
  • In this paper, a new nano/micro-mechanical processing test machine was developed. This new test machine, which is based on the principle of the scanning force controlled probe microscope, can realize nano/micro-mechanical machining and in-process profile measurement. Experimental results of nano/micro indentation and scratching show that the controllable cutting depth of the test machine can be controlled by PZT actuator. Profile measurement of the machined surface has also been performed by using the test machine and a conventional AFM(Atomic Force Microscopy). A good agreement of the two measurement results have been achieved.

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수직응력과 압입이론에 기반한 나노스케일 기계가공에서의 크기효과 분석 (Analysis of Size Effect of Nano Scale Machining Based on Normal Stress and Indentation Theories)

  • 전은채;이윤희;제태진
    • 한국기계가공학회지
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    • 제17권6호
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    • pp.1-6
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    • 2018
  • Recently nano meter size pattern (sub-micro scale) can be machined mechanically using a diamond tool. Many studies have found a 'size effect' which referred to a specific cutting energy increase with the decrease in the uncut chip thickness at micro scale machining. A new analysis method was suggested in order to observe 'size effect' in nano scale machining and to verify the cause of the 'size effect' in this study. The diamond tool was indented to a vertical depth of 1,000nm depth in order to simplify the stress state and the normal force was measured continuously. The tip rounding was measured quantitatively by AFM. Based on the measurements and theoretical analysis, it was verified that the main cause of the 'size effect' in nano scale machining is geometrically necessary dislocations, one of the intrinsic material characteristics. st before tool failure.

롤압연, 압출, 단조 등 전통 기계가공법의 모사 응용을 통한 다양한 나노패턴의 대면적 연속생산 기술 구현 (Development of Continuous and Scalable Nanomanufacturing Technologies Inspired by Traditional Machining Protocols Such as Rolling, Pullout, and Forging)

  • 옥종걸;곽문규
    • 한국생산제조학회지
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    • 제24권2호
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    • pp.198-202
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    • 2015
  • We present a series of simple but novel nanopatterning methodologies inspired by traditional mechanical machining processes involving rolling, pullout, and forging. First, we introduce roll-to-roll nanopatterning, which adapts conventional rolling for continuous nanopatterning. Then, nano-inscribing and nano-channel lithography are demonstrated, whereby seamless nanogratings can be continuously pulled out, as in a pullout process. Finally, we discuss vibrational indentation micro- and nanopatterning. Similarly to the forging/indentation process, this technique employs high-frequency vertical vibration to indent periodic micro/nanogratings onto a horizontally fed substrate. We discuss the basic principles of each process, along with its advantages, disadvantages, and potential applications. Adopting mature and reliable traditional technologies for small-scale machining may allow continuous nanopatterning techniques to cope with scalable and low-cost nanomanufacturing in a more productive and trustworthy way.

잔류응력을 고려한 미세구조물의 강도해석 (Stress Analysis of the Micro-structure Considering the Residual Stress)

  • 심재준;한근조;안성찬;한동섭
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2002년도 춘계학술대회 논문집
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    • pp.820-823
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    • 2002
  • MEMS structures Generally have been fabricated using surface-machining, but the interface failure between silicon substrate and evaporated thin film frequently takes place due to difference of linear coefficient of thermal expansion. Therefore this paper studied the effect of the residual stress caused by variable external loads. This study did not analyzed accurate quantity of the residual stress but trend for the effect of residual stress. Several specimens were fabricated using other material(Al, Au and Cu) and thermal load was applied. The residual stress was measured by nano-indentation using AFM. The results showed the existence of the residual stress due to thermal load. The indentation area of the thermal loaded thin film reduced about 3.5% comparing with the virgin thin film caused by residual stress. The finite element analysis results are similar to indentation test.

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음향방출과 다구찌 방법을 이용한 나노머시닝 가공조건의 최적화 (Optimization of Nano Machining Parameters Using Acoustic Emission and the Taguchi Method)

  • 이성환;손정무
    • 한국정밀공학회지
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    • 제21권3호
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    • pp.163-170
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    • 2004
  • Atomic force microscope (AFM) techniques are increasingly used fur tribological studies of engineering surfaces at scales ranging from atomic and molecular to micro-scale. Recently, AFM with suitable tips is being used for nano fabrication/nano machining purposes. In this paper, machining characteristics of silicon were investigated by nano indentation and nano scratch. Nano-scale material removal mechanisms are studied and the Taguchi method was introduced to acquire optimum parameters for nano machining. Also, Acoustic Emission (AR) is used for the monitoring of nano machining.

보로실리케이트 표면의 나노/마이크로 패터닝을 위한 식각 시간, 하중에 따른 유기 힐록의 성장거동 관찰 (Observation of Growth Behavior of Induced Hillock for Nano/Micro Patterning on Surface of Borosilicate with Etching Time and Load)

  • 조상현;윤성원;강충길
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2005년도 추계학술대회 논문집
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    • pp.182-185
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    • 2005
  • Indentation pattern and line pattern were machined on borosilicate(Pyrex 7740 glass) surface using the combination of mechanical machining by $Nanoi-indenter\circledR$ XP and HF wet etching, and a etch-mask effect of the affected layer of the nano-scratched and indented Pyrex 7740 glass surface was investigated. In this study, effects of indentation and scratch process with etching time on the morphologies of the indented and scratched surfaces after isotropic etching were investigated from an angle of deformation energies.

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