• 제목/요약/키워드: Micro-holes

검색결과 180건 처리시간 0.03초

다이아몬드 입자 전착 드릴에 의한 알루미나 성형제의 미소구멍가공 (Micro-drilling of alumina green body with diamond abrasive drills)

  • 이학구;방경근;김포진;이대길
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2002년도 춘계학술대회 논문집
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    • pp.926-931
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    • 2002
  • Although ceramic plates with many micro-hales are used as MCP (Micro-channel plate) for electron amplification, catalytic converters, filters, electrical insulators and thermal conductors in integrated circuits, the drilling of micro-hales in the ceramics is difficult because of their low thermal conductivity, high hardness and brittleness. Therefore, in this work, the machining of ceramic green body fellowed by sintering of green body was employed fur fabricating ceramic plates with many micro-holes. The micro-drilling of alumina green body was performed with diamond abrasive WC drills, and the cutting force w.r.t. drilling times was measured for the determination of toot life. From the investigation of the wear of micro-drill tip w.r.t. drilling times, the wear mechanism of tip during micro-drilling of ceramic green body was suggested.

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미세 전해 구멍 가공에서의 가공 특성과 시뮬레이션 (Machining Characteristics in Micro Electrochemical Drilling and Simulation)

  • 김보현;이영수;최덕기;주종남
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2005년도 춘계학술대회 논문집
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    • pp.1202-1205
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    • 2005
  • Micro hole is one of basic elements for micro device or micro parts. By micro ECM, micro holes less than $50\mu{m}$ in diameter can be machined easily. Machining characteristics of micro ECM were investigated according to machining conditions such as electrolyte concentration and pulse conditions. From the investigation, optimal machining conditions were suggested for micro ECM of stainless steel. For the micro machining with high resolution, the change of machining gap should be predicted. By using electrochemical principle equations, the change of machining gap was simulated.

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미세 전해 구멍 가공에서의 가긍 조건에 따른 가공 간극 변화 특성 (Effect of Machining Conditions on machining gap in Micro Electrochemical Drilling)

  • 김보현;박병진;주종남
    • 한국정밀공학회지
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    • 제22권12호
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    • pp.163-169
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    • 2005
  • Micro hole is ode of basic elements for micro device or micro parts. Micro electrochemical machining (ECM) can be applied to the machining of micro holes less than 50 ${\mu}m$ in diameter, which it is not easy to apply other techniques to. For the machining of passivating metals such as stainless steel, machining conditions should be chosen carefully to prevent a passive layer. The machining conditions also affect the machining resolution, In this paper, machining characteristics of micro ECM were investigated according to machining conditions such as electrolyte concentration and pulse conditions. From the investigation, optimal machining conditions were suggested for micro ECM of stainless steel.

광단속센서를 이용한 와이어장력 제어장치 및 마이크로전극 제조 (Wire-tension Control System using Photo-interrupter Sensor and Micro-electrode Fabrication)

  • 강명창;이창훈;김남경
    • 한국기계가공학회지
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    • 제12권3호
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    • pp.28-35
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    • 2013
  • Micro electrical discharge machining (EDM) as a non-contact machining process is very effective for micromachining with a thin electrode because of its low machining reaction force. The micro-electrode machining device has the advantage of maintaining high precision through the whole processes and uses a feeding wire in the thin electrode tool manufacturing process. This study describes the design and evaluation of a micro-electrode machining device using optical photo-interrupter. The electrode was fabricated by reverse electrical discharge machining. The performance of designed system was evaluated to measure tension force according to feed speed of wire. This system for micro electrode fabrication proves the feasibility in the micro-EDM process of the micro holes and parts for industrial applications.

미세 구멍 펀칭 기구 개발 (Development of Micro Punching System)

  • 주병윤;오수익;전병희
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2001년도 춘계학술대회 논문집
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    • pp.213-216
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    • 2001
  • A micro hole punching system was developed and micro holes of 100m in diameter were successfully made on brass sheets of loom in thickness. A micro punch made of tungsten carbide was designed to withstand the punch load, considering the buckling and the bending moment due to possible misalignment error. The punch was fabricated by the grinding process with diamond wheel. The die was designed considering the punch load and fabricated by micro electrodischarge machining process. In this system the stripper is designed to guide punch tip to minimize the possible misalignment. The punch was installed on a vertical stepper and the die was mounted on an X-Y translation unit. The precision motion controller controlled all motions of the micro hole punching system. In this study technical difficulties and solutions in the micro hole punching process were also discussed.

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재순환 유동 공기 자가흡입에 의한 마이크로버블 발생 오리피스 노즐 시스템에 대한 실험적 연구 (An Experimental Study on the Orifice Nozzle System that Generates Micro-bubbles by Self-suction of Air with a Recirculating Flow)

  • 오신일;박상희
    • 한국기계가공학회지
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    • 제17권1호
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    • pp.82-88
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    • 2018
  • An experimental study was performed on the orifice nozzle system that generates micro-bubbles by air self-suction using a venturi nozzle. This study experimentally investigates the amount of air sucked into the venturi nozzle and the number of micro-bubbles generated by the orifice nozzle system in Cases 1 and 2. The experimental conditions were varied by changing the diameter of the orifice nozzle (d=2~7 mm) and the number of holes of the perforated plate nozzle (n = 2-12). In Case 1, the air self-suction was more than 2 LPM at $d{\leq}4mm$. When d = 4 mm, the total number of bubbles was 29,777, and it was confirmed that micro-bubbles occupied approximately 65% of the total number of bubbles. In Case 2, the air self-suction was maintained constant at approximately 2.5 LPM regardless of the number (n) of holes. The total amount of bubbles increased when n increased but remained constant at approximately 44,000 when $n{\geq}7EA$. It was also confirmed that more than 80% of all bubbles were micro-bubbles when $n{\geq}10EA$. Thus, the number of micro-bubbles increased by approximately 15% compared to the experimental result of Case 1, which was optimized with d = 4 mm.

MLCC 적층용 진공척의 자기연마와 ELID연삭을 이용한 미세버 제거 기술 (Deburring Technology of Vacuum Plate for MLCC Lamination Using Magnetic Abrasive Polishing and ELID Process)

  • 이용철;신건휘;곽태수
    • 한국기계가공학회지
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    • 제14권3호
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    • pp.149-154
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    • 2015
  • This study has focused on the deburring technology of a vacuum plate for MLCC lamination using electrolytic in-process dressing (ELID) grinding, and the magnetic-assisted polishing (MAP) process. The surface of the vacuum plate has many micro-holes for vacuum suction. They are easily blocked by the burrs created in the surface-flattening process, such as the conventional grinding process. In this study, the MAP process, the ELID grinding process, and an ultrasonic vibration table are examined to remove the micro-burrs that lead to the blockage of the holes. In the results of the experiments, the MAP process and ELID grinding technology showed significant improvements of surface roughness and deburring performance.

마이크로 방전가공에서 Round Trip Method를 이용한 전극마모 보정 (Tool Electrode Wear Compensation using Round Trip Method for Machining Cavities in Micro EDM Process)

  • 박성준;김영태;민병권;이상조
    • 한국정밀공학회지
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    • 제21권10호
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    • pp.42-49
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    • 2004
  • Electrical discharge machining (EDM) is one of the most extensively used non-conventional material removal process. The recent trend in reducing the size of product has given micro EDM a significant amount of research attention. Micro EDM is capable of machining not only micro holes and micro shafts as small as a few micrometers in diameter but also complex three dimensional micro cavities. But, longitudinal tool wear by electrical discharge is indispensable and this affects the machining accuracy in micro EDM process. Therefore, newly developed tool wear compensation strategy called round trip method is suggested and verified by experiment. In this method, machining depth of cut, overlap effect and critical travel length are also considered.

Formation of an Aluminum Parting Layer in the Fabrication of Field Emitter Arrays Using Reflow Method

  • Kang, Seung-Youl;Jung, Moon-Youn;Cho, Young-Rae;Song, Yoon-Ho;Lee, Sang-Kyun;Kim, Do-Hyung;Lee, Jin-Ho;Cho, Kyoung-Ik
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2000년도 제1회 학술대회 논문집
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    • pp.219-220
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    • 2000
  • We propose a new method for the formation of an aluminum parting layer in the fabrication of field emitter arrays, in which we used a reflow property of aluminum at a lower temperature than the deformation point of glass. After the sputtered aluminum layer on the gate metal was etched for the formation of gate holes, we carried out a rapid thermal annealing process, by which the aluminum slightly diffused into the gate hole. This reflowed aluminum could be used as a parting layer and emitter arrays were easily fabricated using this method.

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