• 제목/요약/키워드: Micro-display

검색결과 479건 처리시간 0.022초

3-Dimensional Micro Solder Ball Inspection Using LED Reflection Image

  • Kim, Jee Hong
    • International journal of advanced smart convergence
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    • 제8권3호
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    • pp.39-45
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    • 2019
  • This paper presents an optical technique for the three-dimensional (3D) shape inspection of micro solder balls used in ball-grid array (BGA) packaging. The proposed technique uses an optical source composed of spatially arranged light-emitting diodes (LEDs) and the results are derived based on the specular reflection characteristics of the micro solder balls for BGA A vision system comprising a camera and LEDs is designed to capture the reflected images of multiple solder balls arranged arbitrarily on a tray and the locations of the LED point-light-source reflections in each ball are determined via image processing, for shape inspection. The proposed methodology aims to determine the presence of defects in 3D BGA shape using the statistical information of the relative positions of multiple BGA balls, which are included in the image. The presence of the BGA balls with large deviations in relative position imply the inconsistencies in their shape. Experiments were conducted to verify that the proposed method could be applied to inspection without sophisticated mechanism and productivity problem.

UV Roll 임프린팅 공정을 이용한 렌티큘러 렌즈 제작 (Fabrication of Lenticular Lens by Continuous UV Roll Imprinting)

  • 명호;차주원;김석민;강신일
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2005년도 추계학술대회 논문집
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    • pp.91-94
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    • 2005
  • With increasing demands for large-scale micro-optical components in the field of digital display, the establishment of large-scale fabrication technology fur polymeric patterns has become a priority. The starting point of any polymer replication process is the mold, and the mold often has flat surface. However, It is very hard to replicate large-scale micro patterns using the flat mold, because the cost of large-scale flat mold was very high, and some uniformity and releasing problems were often occurred in large scale flat molding process. In this study, a UV roll imprinting system to overcome the financial and fabrication issues of large-scale pattern replication process was designed and constructed. As a practical example of the system, a lenticular lens with radius of curvature of $223{\mu}m$ and pitch of $280{\mu}m$, which was used to provide wide viewing angle in projection TV, was designed and fabricated. The roll stamper was fabricated using direct machining process of aluminum roll base. Finally, the shape accuracy and uniformity of roll imprinted lenticular lens sheet were measured and analyzed.

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레이저를 이용한 웨이퍼 다이싱 특성 (Characteristics of Laser Wafer Dicing)

  • 이용현;최경진;유승열
    • 반도체디스플레이기술학회지
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    • 제5권3호
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    • pp.5-10
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    • 2006
  • This paper investigates cutting qualities after laser dicing and predicts the problems that can be generated by laser dicing. And through 3 point bending test, die strength is measured and the die strength after laser dicing is compared with the die strength after mechanical sawing. Laser dicing is chiefly considered as an alternative to overcome the defects of mechanical sawing such as chipping on the surface and crack on the back side. Laser micromachining is based on the thermal ablation and evaporation mechanism. As a result of laser dicing experiments, debris on the surface of wafer is observed. To eliminate the debris and protect the surface, an experiment is done using a water soluble coating material and ultrasonic. The consequence is that most of debris is removed. But there are some residues around the cutting line. Unlike mechanical sawing, chipping on the surface and crack on the back side is not observed. The cross section of cutting line by laser dicing is rough as compared with that by mechanical sawing. But micro crack can not be seen. Micro crack reduces die strength. To measure this, 3 point bending test is done. The die strength after laser dicing decreases to a half of the die strength after mechanical sawing. This means that die cracking during package assembly can occur.

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미세 팁 기판 위에 전기영동법으로 성장시킨 탄소 나노튜브의 전계방출 특성 (Field emission properties of carbon nanotubes grown on micro-tip substrates using an electrophoretic deposition method)

  • 장한빛;노영록;김종필;박진석
    • 반도체디스플레이기술학회지
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    • 제9권4호
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    • pp.7-12
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    • 2010
  • Field-emission characteristics of carbon nanotubes(CNTs), which were grown on conical-type tungsten micro-tips by using an electrophoretic deposition(EPD) method, were examined. The EPD method proved to be convenient to manipulate and arrange CNTs from well dispersed suspensions onto such tip-type substrates. The growth rate of CNTs was proportional to the applied d.c. bias voltage and the process time. It was observed from the Raman study that the EPDproduced CNTs showed better crystal qualities with the Raman intensity ratio( $I_D$/$I_G$) of 0.41-0.42 than the CVD-produced CNTs and their crystal qualities could be further improved by thermal annealing. The electron emitters based on the EPDCNTs showed excellent field emission properties, such as the threshold voltage for electron emission of about 620 V and the maximum emission current of about 345 ${\mu}A$. In addition, the EPD-CNTs exhibited the stable long-term(up to 40 h) emission capability and the emission stability was enhanced by thermal annealing.

Aperture를 이용한 MLA의 효율 개선 (Efficiency Improvement of MLA (Micro Lens Array) using Aperture)

  • 서현우;남민우;오해관;안효찬;김태준;위창현;이기근;양상식;송요탁
    • 반도체디스플레이기술학회지
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    • 제10권1호
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    • pp.91-94
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    • 2011
  • This paper presents light transmission efficiency by optical adhesive thickness between MLA and aperture layer and by aperture hole size. The gap between MLA and Aperture layer is adjusted by the shim. The more optical adhesive thickness increases, the better light transmission efficiency increases up to a point. After that, the light transmission efficiency decreases because stray lights cannot transmit through the aperture layer owing to cut-off by aperture layer. And as a result of light transmission efficiency with changing aperture hole size, the light transmission efficiency is proportional to area of aperture hole. The more specified process is made, the better data and sample will be got.

계면층 형성 및 열처리가 탄소 나노튜브 미세팁의 전계방출 특성에 미치는 영향 (Effects of Interlayer Formation and Thermal Treatment on Field-emission Properties of Carbon Nanotube Micro-tips)

  • 김부종;박진석
    • 반도체디스플레이기술학회지
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    • 제12권2호
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    • pp.1-6
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    • 2013
  • The effects of interlayer formation and thermal treatment on the field-emission properties of carbon nanotubes (CNTs) were investigated. The CNTs were prepared on tungsten (W) micro-tip substrates using the electrophoretic deposition (EPD) method. The interlayers, such as aluminum (Al) and hafnium (Hf) were coated on the W-tips prior to CNT deposition and after the deposition of CNTs all the species were thermally treated at $700^{\circ}C$ for 30 min. The field-emission properties of CNTs were significantly improved by thermal treatment. The threshold electric field for igniting the electron emission was decreased and the emission current was increased. The Raman spectroscopy results indicated that this was attributed mainly to the enhancement of CNTs by thermal treatment. Also, the CNTs deposited on the interlayers showed the remarkably improved results in the long-term emission stability, especially when they were thermally treated. The X-ray photoelectron spectroscopy (XPS) measurement confirmed that this was resulted from the formation of the additional cohesive forces between the CNTs and the underlying interlayers.

NF3 / H2O 원거리 플라즈마 건식 세정 조건 및 SiO2 종류에 따른 식각 이방 특성 (Etching Anisotropy Depending on the SiO2 and Process Conditions of NF3 / H2O Remote Plasma Dry Cleaning)

  • 오훈정;박세란;김규동;고대홍
    • 반도체디스플레이기술학회지
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    • 제22권4호
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    • pp.26-31
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    • 2023
  • We investigated the impact of NF3 / H2O remote plasma dry cleaning conditions on the SiO2 etching rate at different preparation states during the fabrication of ultra-large-scale integration (ULSI) devices. This included consideration of factors like Si crystal orientation prior to oxidation and three-dimensional structures. The dry cleaning process were carried out varying the parameters of pressure, NF3 flow rate, and H2O flow rate. We found that the pressure had an effective role in controlling anisotropic etching when a thin SiO2 layer was situated between Si3N4 and Si layers in a multilayer trench structure. Based on these observations, we would like to provide further guidelines for implementing the dry cleaning process in the fabrication of semiconductor devices having 3D structures.

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실리콘고무형과 전자기파에 의한 PDP격벽의 성형에 관한 연구 (A Study on Plasma Display Panel Barrier Rib Fabrication by Silicone Rubber Tooling and electromagnetic Wave)

  • 정해도;손재혁;조인호
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2001년도 춘계학술대회 논문집
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    • pp.20-23
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    • 2001
  • Plasma Display Panel(PDP) is a type of flat panel display utilizing the light emission produced by gas discharge. Barrier Ribs of PDP separating each sub-pixel prevents optical and electrical crosstalks from adjacent sub-pixels. The mold for forming the barrier ribs has been newly researched to overcome the disadvantages of conventional manufacturing processes such as screen printing, sand-blasting and photosensitive glass methods. The mold for PDP barrier ribs have stripes of micro grooves transferring glass-material wall. In this paper, Stripes of grooves of which width 48${\mu}{\textrm}{m}$, depth 124$\mu\textrm{m}$ , pitch 274$\mu\textrm{m}$ was acquired by machining of single crystal silicon with dicing saw blade. Maximum roughness of the bottom of the grooves was 59.6nm Ra in grooving Si. Barrier ribs were formed with silicone rubber mold, which is transferred from grooved Si forming hard mold. Silicone rubber mold has the elasticity, which enable to accommodate the waveness of lower glass plate of PDP. The methods assisted by the microwave and UV was adopted for reducing the forming time of glass paste.

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MEMS 구조 압전 마이크로폰의 최적구조 설계 (Optimal Design of a MEMS-type Piezoelectric Microphone)

  • 권민형;라용호;전대우;이영진
    • 센서학회지
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    • 제27권4호
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    • pp.269-274
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    • 2018
  • High-sensitivity signal-to-noise ratio (SNR) microphones are essentially required for a broad range of automatic speech recognition applications. Piezoelectric microphones have several advantages compared to conventional capacitor microphones including high stiffness and high SNR. In this study, we designed a new piezoelectric membrane structure by using the finite elements method (FEM) and an optimization technique to improve the sensitivity of the transducer, which has a high-quality AlN piezoelectric thin film. The simulation demonstrated that the sensitivity critically depends on the inner radius of the top electrode, the outer radius of the membrane, and the thickness of the piezoelectric film in the microphone. The optimized piezoelectric transducer structure showed a much higher sensitivity than that of the conventional piezoelectric transducer structure. This study provides a visible path to realize micro-scale high-sensitivity piezoelectric microphones that have a simple manufacturing process, wide range of frequency and low DC bias voltage.

초정밀 대면적 미세 형상 가공기의 구조 특성 해석 (Structural Characteristic Analysis of an Ultra-Precision Machine for Machining Large-Surface Micro-Features)

  • 김석일;이원재
    • 대한기계학회논문집A
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    • 제31권12호
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    • pp.1173-1179
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    • 2007
  • In recent years, research to machine large-surface micro-features has become important because of the light guide panel of a large-scale liquid crystal display and the bipolar plate of a high-capacity proton exchange membrane fuel cell. In this study, in order to realize the systematic design technology and performance improvements of an ultra-precision machine for machining the large-surface micro-features, a structural characteristic analysis was performed using its virtual prototype. The prototype consisted of gantry-type frame, hydrostatic feed mechanisms, linear motors, brushless DC servo motor, counterbalance mechanism, and so on. The loop stiffness was estimated from the relative displacement between the tool post and C-axis table, which was caused by a cutting force. Especially, the causes of structural stiffness deterioration were identified through the structural deformation analysis of sub-models.