• Proceedings of the KSME Conference
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• 2003.11a
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• pp.1787-1792
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• 2003

Recently with the development of semiconductor technology, the miniaturization of parts and products as well as their high precision is required. In addition, as the national competitiveness is increasingly affected by the development of the micro parts through micro machining technology, the study of the micro machining technology is being conducted in many countries. The goal of this study is to fabricate micro tools under the size of $20{\mu}m$ and to machine micro holes using them. The fabrication is done by grinding and the application of ELID to the grinding wheel. The surface roughness of the micro tools is measured to evaluate the study.

• Journal of Institute of Convergence Technology
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• v.2 no.2
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• pp.25-29
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• 2012

Micro machining technologies have been required to satisfy various conditions in a high-technology industry. Micro electrochemical process is one of the most precision machining methods. Micro electrochemical process has been divided into electrochemical etching through protective layer and electrochemical machining using ultrashort voltage pulses. Micro shaft can be fabricated by electrochemical etching. The various protective layers such as photo-resist, oxide layer and oxidized recast layer have been used to protect metal surface during electrochemical etching. Micro patterning on metal surface can be machined by electrochemical etching through protective layer. Micro hole, groove and structures can be easily machined by electrochemical machining using ultrashort voltage pulses. Recently, the groove with subnanometer was machined using AFM.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2003.04a
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• pp.161-166
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• 2003

The micro-extruding die is a die for manufacturing of fine-wire by extruding process. The fine-wire made from the micro-extruding can be effectively applied to fields of semiconductor parts and medical parts etc. It is predicted that the demand of fine-wire in industry is more and more increasing. In this study $\phi50\mu m$ micro-drill which is coated with diamond is used for drilling of super micro-hole sizes. For the machining of taper parts of entrance and exit, drill having $\phi50\mu\textrm{mm}$ inclination angle $20^{\circ}$and angle $30^{\circ}$ is used. This is useful for anti tool-breakage and excessive too-wear in drilling process. After micro-drilling, the polishing process by diamond abrasive and polishing wood s carried out for increasing surface roughness.

• Journal of Sensor Science and Technology
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• v.20 no.3
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• pp.187-192
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• 2011

Abrasive blaster is similar to sand blaster, and effectively removes hard and brittle materials. Exiting abrasive blaster has applied to rough working such as deburring and rough finishing. As the need for machining of ceramics, semiconductor, electronic devices and LCD are increasing, micro abrasive blaster was developed, and became the inevitable technique to micromachining. This paper describes the performance of the micro blaster in MEMS process of glass and succeed in domestically producing complete micro blaster. Diameter of hole and width of line in this etching is 100 ${\mu}m$ ~ 1000 ${\mu}m$. Experimental results showed good performance in micro channel and hole in glass wafer. Therefore, this micro blaster could be effectively applied to the micro machining of semiconductor, micro PCR chip.

• Journal of the Korean Society for Precision Engineering
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• v.25 no.7
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• pp.139-144
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• 2008

Micro electrochemical machining was investigated to machine micro internal features. This method uses a micro disk tool electrode and can easily machine micro features inside of a micro hole, which are very difficult to make by the conventional processes. In order to limit the machining area and localize the electrochemical dissolution, ultra short pulses were used as power source and a micro disk electrode with insulating layer on its surface was used as a tool electrode. By electrochemical process, internal features, such as groove array, were fabricated on the stainless steel plate.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1997.10a
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• pp.37-42
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• 1997

This paper describes result of experiment of parameters affecting the micro hole drilling time, kind of assisting gas and it's pressure. The result reveals that parameter value of 0.08J, 20Hz, dwell time of 300 microseconds can be a good machining condition to make micro hole diameter range of 50-70${\mu}{\textrm}{m}$, Assistant gas such air, O2, Ar, N2 was adapted. Assistant gas of air makes heat affected zone enlarge due to burning of material, also it makes hole irregular and damage because of refusion stick to caused by chemical reaction with Al2O3 ceramic material. O2(99.9%) has good characteristic to get good drilling and smooth surface on pressure of 0.2kgf/$\textrm{cm}^2$, but it is expensive. Ar, N2 makes material burn and crack severely and proved to be an appropriate but, Ar was better than N2.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.18 no.1
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• pp.101-108
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• 2019

In this study, the hole-cavity resonance technology and the micro pore stainless chip sintering technology were fused to develop silencers with excellent noise attenuation performance even at fluid pressures exceeding 30 bar for the first time at home and abroad. As a result of this study, the noise attenuation performance was greatly improved as reflection, loss, and resonance were made to occur thousands of times simultaneously when fluids pass through the sintered micro pore stainless steel chip sound absorber. The noise of the gas emitted from the bomb without the silencer was shown to be 125dB. And noise test conducted after installation of the silencer showed the noise of 67dB. Given the study results, the amount of noise was greatly reduced in the sintered silencer.

• Journal of the Optical Society of Korea
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• v.13 no.1
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• pp.48-52
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• 2009

Micro-hole targets are studied to generate energetic protons from laser-thin foil targets by using 2-dimensional particle-in-cell simulations. By using a small hole, the maximum energy of the accelerated proton is increased to 4 times higher than that from a simple planar target. The main proton acceleration mechanism of the hole-targets is the electrostatic field created between the fast electrons accelerated by the laser pulse ponderomotive force combined with the vacuum heating and the target rear surface. But in this case, the proton angular distribution shows double-peak shape, which means poor collimation and low current density. By using a small cone-shaped hole, the maximum proton energy is increased 3 times higher than that from a simple planar target. Furthermore, the angular distribution of the accelerated protons shows good collimation.

• The KSFM Journal of Fluid Machinery
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• v.9 no.3 s.36
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• pp.36-43
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• 2006

Recently, micro hydropower and it's useful utilization are taking a growing interest as a countermeasure of global worming by carbon dioxide and exhaustion of fossil fuel. The purpose of this study is to investigate the possibility of extracting micro hydropower wasted by a valve in water supply system using micro cross-flow hydraulic turbine. In order to fulfill the functions of controlling flow rate and pressure in substitute for the valve, air and water are supplied into an air suction hole which is installed on the side wall of micro cross-flow hydraulic turbine. The results show that in case of supplying a lot of air into the air suction hole, about 50% of flow rate and relatively high value of loss coefficient are controlled by the turbine. Moreover, including high possibility of applying the micro cross-flow turbine to water supply system, extended application of the turbine to the water discharge system of drainage and irrigation canal.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.11 no.1
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• pp.62-67
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• 2012

Recently UV laser is widely used to process micro parts using various materials such as polymers, metals and ceramics because it has a very high intensity at the focused spot area. It is generally known that there are still some difficulties for alumina($Al_2O_3$) ceramics to directly make micro patterns like holes and lines on the surface of working material using 355nm UV laser because the alumina has a very low absorption coefficient at that wavelength. But nowadays new alumna with nano-porous holes is developed and applied to advanced micro functional parts of IT, BT and BT industries. In this paper, we are going to show the mechanism of photo-thermal ablation for nano-porous ceramics. Inside hole there is a lot of multiple reflections along the depth of hole. Experimentally we can find the micro hole drilling and micro grooving on the surface of nano-porous alumina.