• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.10a
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• pp.83-88
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• 2004

Micro wires manufactured by the straightening progress are widely used in bio-medical and semi-conductor fields. In this study, we have developed a novel straightener which uses the direct heating method for straightening. In order to avoid the surface oxidization, during the heating process, we supplied the inert gas(Ar) and examined the effect of the gas flow rate. The effect of the tension and the current applied to the tungsten micro wires were thoroughly studied. From various experiments, it was found that when the tension is $500{\sim}600gf$ and the current is about 1.5A, we obtained higher straightness(${\approx}1{\mu}m/1000{\mu}m$) and roundness ($<{\pm}2{\mu}m/100{\mu}m$).

• Transactions of Materials Processing
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• v.28 no.5
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• pp.239-246
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• 2019

Various surface texturing techniques have been studied because of the effective applicability of micro or nano scale surface patterns. Particularly, the most promising types of patterns include the hierarchical patterns, which consists of micro/nano structures. Different processes such as MEMS, laser machining, micro cutting and micro grinding have been applied in the production of hierarchical patterns on various material surfaces. This study demonstrates the process of hot imprinting to induce the hierarchical patterns on the Al alloy surfaces. Wire electrical discharge machining (WEDM) process was used to imprint molds with micro scale sinusoidal pattern. In addition, the sinusoidal pattern with rough surface morphology was obtained as a result of the discharge craters. Consequently, the hierarchical patterns consisting of the sinusoidal pattern and the discharge craters were prepared on the imprinting mold surface. Hot imprinting process for the Al plates was conducted on the prepared mold, and the replication performance was analyzed. As a result, it was confirmed that the hierarchical patterns of the mold were effectively duplicated on the surface of Al plate.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.73-76
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• 2010

A two-facet approach was used to investigate the parametric performance of functional high-speed DDR3 (Double Data Rate) DRAM (Dynamic Random Access Memory) die placed in different types of BGA (Ball Grid Array) packages: wire-bonded BGA (FBGA, Fine Ball Grid Array), flip-chip (FCBGA) and lead-bonded $microBGA^{(R)}$. In the first section, packaged live DDR3 die were tested using automatic test equipment using high-resolution shmoo plots. It was found that the best timing and voltage margin was obtained using the lead-bonded microBGA, followed by the wire-bonded FBGA with the FCBGA exhibiting the worst performance of the three types tested. In particular the flip-chip packaged devices exhibited reduced operating voltage margin. In the second part of this work a test system was designed and constructed to mimic the electrical environment of the data bus in a PC's CPU-Memory subsystem that used a single DIMM (Dual In Line Memory Module) socket in point-to-point and point-to-two-point configurations. The emulation system was used to examine signal integrity for system-level operation at speeds in excess of 6 Gb/pin/sec in order to assess the frequency extensibility of the signal-carrying path of the microBGA considered for future high-speed DRAM packaging. The analyzed signal path was driven from either end of the data bus by a GaAs laser driver capable of operation beyond 10 GHz. Eye diagrams were measured using a high speed sampling oscilloscope with a pulse generator providing a pseudo-random bit sequence stimulus for the laser drivers. The memory controller was emulated using a circuit implemented on a BGA interposer employing the laser driver while the active DRAM was modeled using the same type of laser driver mounted to the DIMM module. A custom silicon loading die was designed and fabricated and placed into the microBGA packages that were attached to an instrumented DIMM module. It was found that 6.6 Gb/sec/pin operation appears feasible in both point to point and point to two point configurations when the input capacitance is limited to 2pF.

• Archives of Plastic Surgery
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• v.41 no.6
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• pp.768-772
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• 2014

Background To compare clinical and radiographic outcomes between intramedullary nail fixation and percutaneous K-wire fixation for fractures in the distal third portion of the metacarpal bone. Methods A single-institutional retrospective review identified 41 consecutive cases of metacarpal fractures between September 2009 and August 2013. Each of the cases met the inclusion criteria for closed, extra-articular fractures of the distal third of the metacarpal bone. The patients were divided by the method of fixation (intramedullary nailing or K-wire). Outcomes were compared for mean and median total active motion of the digit, radiographic parameters, and period until return to work. Complications and symptoms were determined by a questionnaire. Results During the period under review, 41 patients met the inclusion criteria, and the fractures were managed with either intramedullary nailing (n=19) or percutaneous K-wire fixation (n=22). The mean and median total active range of motion and radiographic healing showed no statistically significant difference between the two groups. No union failures were observed in either group. The mean operation time was shorter by an average of 14 minutes for the percutaneous K-wire fixation group. However, the intramedullary nailing group returned to work earlier by an average of 2.3 weeks. Complications were reported only in the K-wire fixation group. Conclusions Intramedullary nailing fixation is advisable for fractures in the distal third of the metacarpal bone. It provides early recovery of the range of motion, an earlier return to work, and lower complication rates, despite potentially requiring a wire removal procedure at the patient's request.

• Proceedings of the Korean Magnestics Society Conference
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• 2003.12a
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• pp.68-68
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• 2003

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.10a
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• pp.39-40
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• 2012

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.10a
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• pp.206-206
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• 2003

• Tribology and Lubricants
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• v.32 no.6
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• pp.201-206
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• 2016

In this study, we attempt to produce a semi-elliptical riblet with a shark skin-like surface using wire electrical discharge machining (WEDM) and micro molding techniques. Our design for the production of the semi-elliptical mold includes an electrode, a winding roller, and a guide on the WEDM system. A replication mold with negative riblets is machined using WEDM, and a shark skin inspired surface with positive riblets is fabricated using a micro molding technique. For a comparison with the original shark skin, a shark skin replica is also produced using the micro molding technique directly from a shark skin template. Droplet contact angles on a flat surface, the shark skin replica, and the epoxy resin-based micro riblet shark skin-like surface are evaluated. The effect of a Teflon coating on the contact angles for the three different surfaces is also investigated. The results show the micro riblet with a shark skin-like surface has a similar contact angle as the shark skin replica, which means that the simplified riblet shark skin surface strongly influences the performance of wettability. This study confirms the effectiveness of using the WEDM method to prepare hydrophobic surfaces with diverse surface patterns.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2005.09a
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• pp.67-88
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• 2005

Mold-Flow 3 Die Stack CSP of Mold array packaging with different Gate types. As high density package option such as 3 or 4 die stacking technologies are developed, the major concerning points of mold related qualities such as incomplete mold, exposed wires and wire sweeping issues are increased because of its narrow space between die top and mold surface and higher wiring density. Full 3D rheokinetic simulation of Mold flow for 3 die stacking structure case was done with the rheological parameters acquired from Slit-Die rheometer and DSC of commercial EMC. The center gate showed severe void but corner gate showed relatively better void performance. But in case of wire sweeping related, the center gate type showed less wire sweeping than corner gate types. From the simulation results, corner gate types showed increased velocity, shear stress and mold pressure near the gate and final filling zone. The experimental Case study and the Mold flow simulation showed good agreement on the mold void and wire sweeping related prediction. Full 3D simulation methodologies with proper rheokinetic material characterization by thermal and rheological instruments enable the prediction of micro-scale mold filling behavior in the multi die stacking and other complicated packaging structures for the future application.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.2
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• pp.322-328
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• 2002

In wire-electrical discharge machining (W-EDM), the dielectric plays an important role as the working fluid. It affects the material removal rate and the properties of the machined surface. This paper deals with the effects of the electrical conductivity of dielectric and cobalt percentage of sintered carbides on the machining characteristics and the machined surface integrities with deionized water as dielectric. A series of experiments have been performed on sintered carbides having different cobalt contents. Experimental results show that a higher cobalt content of WC decreases the metal removal rate and worsens the surface quality. Lower electrical conductivity of the dielectric results in a higher metal removal rate as the gap between wire electrode and workpiece reduced. Especially, the surface integrities of rough-cut workpiece, wire electrode, and debris were analyzed also through scanning electron microscopy(SEM) and surface roughness tester. By energy dispersive spectrometry(EDS), it is confirmed that micro cracks and some of electrode material are found on the workpiece surface.