• Asian Pacific Journal of Cancer Prevention
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• v.16 no.4
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• pp.1375-1383
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• 2015

Background: Objective Myocardin-related transcription factor (MRTF)-A is a Rho signaling-responsive co-activator of serum response factor (SRF). The purpose of this study is to investigate the role of MRTF-A and AQP1 (aquaporin 1) in pathological vascular remodeling. Materials and Methods: MRTF-A, AQP1 and neointima expression was detected both in the wire injured femoral arteries of wild-type mice and the atherosclerotic aortic tissues of $ApoE^{-/-}$ mice. Expression of ICAM-1, matrix metallopeptidase 9 (MMP-9) and integrin ${\beta}1$ were also assayed. The intercourse relationship between the molecules were investigated by interfering RNA and inhibitor assay. Results: MRTF-A and AQP1 expression were significantly higher in the wire injured femoral arteries of wild-type mice and in the atherosclerotic aortic tissues of $ApoE^{-/-}$ mice than in healthy control tissues. Both in wire-injured femoral arteries in MRTF-A knockout ($Mkl1^{-/-}$) mice and atherosclerotic lesions in $Mkl1^{-/-}$; $ApoE^{-/-}$ mice, neointima formation were significantly attenuated and the expression of AQP1 were significantly decreased. Expression of ICAM-1, matrix metallopeptidase 9 (MMP-9) and integrin ${\beta}1$, three SRF targets and key regulators of cell migration, and AQP1 in injured arteries was significantly weaker in $Mkl1^{-/-}$ mice than in wild-type mice. In cultured vascular smooth muscle cells (VSMCs), knocking down MRTF-A reduced expression of these genes and significantly impaired cell migration. Underlying the increased MRTF-A expression in dedifferentiated VSMCs were the down-regulation of microRNA-300. Moreover, the MRTF-A inhibitor CCG1423 significantly reduced neointima formation following wire injury in mice. Conclusions: MRTF-A could be a novel therapeutic target for the treatment of vascular diseases.

• Journal of the Korean institute of surface engineering
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• v.49 no.3
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• pp.301-306
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• 2016

The effects of nanotexturing and post-etching on the reflection and quantum efficiency properties of diamond wire sawn (DWS) multicrystalline silicon (mc-Si) solar cell have been investigated. The chemical solutions, which are acidic etching solution (HF-$HNO_3$), metal assisted chemical etching (MAC etch) solutions ($AgNO_3$-HF-DI, HF-$H_2O_2$-DI) and post-etching solution (diluted KOH at $80^{\circ}C$), were used for micro- and nano-texturing at the surface of diamond wire sawn (DWS) mc-Si wafer. Experiments were performed with various post-etching time conditions in order to determine the optimized etching condition for solar cell. The reflectance of mc-Si wafer texturing with acidic etching solution showed a very high reflectance value of about 30% (w/o anti-reflection coating), which indicates the insufficient light absorption for solar cell. The formation of nano-texture on the surface of mc-Si contributed to the enhancement of light absorption. Also, post-etching time condition of 240 s was found adequate to the nano-texturing of mc-Si due to its high external quantum efficiency of about 30% at short wavelengths and high short circuit current density ($J_{sc}$) of $35.4mA/cm^2$.

• IEMEK Journal of Embedded Systems and Applications
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• v.16 no.6
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• pp.267-276
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• 2021

The automotive industry and academic research have been continuously conducting research on standardization such as AUTOSAR (AUTomotive Open System ARchitecture) and ISO26262 to solve problems such as safety and efficiency caused by the complexity of electric/electronic architecture of automotive. AUTOSAR is an automotive standard software platform that has a layered structure independent of MCU (Micro Controller Unit) hardware, and improves product reliability through software modularity and reusability. And, ISO26262, an international standard for automotive functional safety and suggests a method to minimize errors in automotive ECU (Electronic Control Unit)s by defining the development process and results for the entire life cycle of automotive electrical/electronic systems. These design methods are variously applied in representative automotive safety-critical systems. However, since the functional and safety requirements are different according to the characteristics of the safety-critical system, it is essential to research the AUTOSAR functional safety design method specialized for each application domain. In this paper, a software functional safety mechanism design method using AUTOSAR is proposed, and a new failure management framework is proposed to ensure the high reliability of the product. The AUTOSAR functional safety mechanism consists of memory partitioning protection, timing monitoring protection, and end-to-end protection. The fault management framework is composed of several safety SWCs to maintain the minimum function and performance even if a fault occurs during the operation of a safety-critical system. Finally, the proposed method is applied to the Shift-by-Wire system design to prove the validity of the proposed method.

• Korean Journal of Materials Research
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• v.28 no.10
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• pp.590-594
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• 2018

ZnO micro/nanocrystals are formed by a vapor transport method. Mixtures of ZnO and TiO powders are used as the source materials. The TiO powder acts as a reducing agent to reduce the ZnO to Zn and plays an important role in the formation of ZnO micro/nanocrystals. The vapor transport process is carried out in air at atmospheric pressure. When the weight ratios of TiO to ZnO in the source material are lower than 1:2, no ZnO micro/nanocrystals are formed. However, when the ratios of TiO to ZnO in the source material are greater than 1:1, the ZnO crystals with one-dimensional wire morphology are formed. In the room temperature cathodoluminescence spectra of all the products, a strong ultraviolet emission centered at 380 nm is observed. As the ratio of TiO to ZnO in the source material increases from 1:2 to 1:1, the intensity ratio of ultraviolet to visible emission increases, suggesting that the crystallinity of the ZnO crystals is improved. Only the ultraviolet emission is observed for the ZnO crystals prepared using the source material with a TiO/ZnO ratio of 2:1.

• Korean Journal of Materials Research
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• v.11 no.10
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• pp.820-832
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• 2001

In order to obtain the basic data on the optimum conditions of electroforming process for fabricating the micro wiring pattern for plate type micro- motor core, characteristics of plating bath and properties of deposits were studied with various copper plating baths which contain sulfate, fluoborate, pyrophosphate and cyanide salt, respectively. Cathodic polarization, throwing power, internal stress, texture and surface morphology of deposits were observed. Throwing power of plating solution is deeply related to the polarization curves and the values are in the range of +20∼20%. The order of values ate as follows- pyrophosphate, cyanide, sulfate and fluoborate bath. Internal stresses of deposits are tensile in all of the copper plating bath. Thickness of the deposits plated at the center of holes has the highest value in the pyrophosphate bath and K factor, ratio of height and width of deposit, is 1.44. It was confirmed that the pyrophosphate bath was the best one for the electroforming of wire pattern.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.9
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• pp.825-831
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• 2006

As an increase of chip complexity and level of chip integration, chip input/output (I/O) pad pitches are also drastically reduced. With arrival of high complexity SoC (System on Chip) and SiP (System in Package) products, conventional horizontal type probe card showed its limitation on probing density for wafer level test. To enhance probing density, we proposed new vertical type probe card that has the $70{\mu}m$ probe needle with tungsten wire in $80{\mu}m$ micro-drilled hole in ceramic board. To minimize alignment error, micro-drilling conditions are optimized and epoxy-hardening conditions are also optimized to minimize planarity changes. To apply wafer level test for target devices (T5365 256M SDRAM), designed probe card was characterized by probe needle tension for test, contact resistance measurement, leakage current measurement and the planarity test. Compare to conventional probe card with minimum pitch of $50{\sim}125{\mu}m\;and\;2\;{\Omega}$ of average contact resistance, designed probe card showed only $22{\mu}$ of minimum pitch and $1.5{\Omega}$ of average contact resistance. And also, with the nature of vertical probing style, it showed comparably small contact scratch and it can be applied to bumping type chip test.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.33 no.5
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• pp.331-338
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• 2020

In this study, the characteristic of a 3-D micro-woven material, which is one of the newly developed periodic open-cell structure, is analyzed through various computational simulations. To increase the accuracy of the numerical simulations, the distance between each directional wire is parameterized using six design variables, and its model geometry is precisely discretized using tetrahedron elements. Using the improved computational model, the material properties of the mechanical, thermal, and fluidic behavior are investigated using commercial software and compared with the previous experimental results. By changing the space between the x- and y-directional wires, a parametric test is performed to determine the tendency of the change in the material properties. In addition, the correlation between two different material properties is investigated using the Ashby chart. The result can further be used in determining the optimal pattern and wire spacing in 3-D micro-woven materials.

• Journal of the Korea Convergence Society
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• v.11 no.1
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• pp.175-180
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• 2020

In this study, we developed a micropattern technology in the shape of RFID TAG antenna using ultrasonic micropattern manufacturing system developed to enable micropattern technology. The ultrasonic tool horn in longitudinal vibration mode was installed in the micropattern manufacturing system to develop the ultrasonic press technology for the micropattern antenna shape of the RFID TAG antenna shape on the insulating sheet surface. The ultrasonic shaping technology was manufactured by applying the resonance design technique to a 60kHz tool horn, and by using the micropattern manufacturing system, the coil wire having a thickness of 25㎛ can be ultrasonically press-molded on an insulating sheet of 200㎛ or less. In ultrasonic press technology, the antenna shape having a minimum line width of 150㎛ could be molded without disconnection, peeling, or twisting of the coil wire.

• Journal of Welding and Joining
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• v.21 no.5
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• pp.568-574
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• 2003

In the welding for the steel structure of H-beam with mild steel and 490N/$\textrm{mm}^2$ high tensile steel, we applied the fillet weld mostly and 6-8mm weld length(AISC-spec.). And a new developed metal-cored-wire is used in automatic welding as well as semi-automatic welding. In this study we have attempted to raise the welding productivity and to stabilize the quality on horizontal positions of fillet welding with the following items: - We improved the weld productivity using metal based cored wire with a high deposition rate in the steel structure of H-beam. - We tested the weldability and evaluated the quality of the weldmetal by horizontal fillet $CO_2$ welding. The process is carried out in combination with a special purpose metal-based FCW with excellent resistance to porosity and high welding speed. - We studied the micro structure of the weldmetal by the various welding conditions. - We studied the effect of welding residual stress by the welding conditions in T-joint. Therefore, it can be assured that more productive and superior quality of the weldmetal can be taken from this study results.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.175-175
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• 1999

Circumventing problems lying in the conventional lithographic techniques, we devised a new method for the fabrication of nanometer scale metal wires inspired by the unique characteristics of carbon nanotubes (CNTs). Since carbon nanotubes could act as masks when CNT-coated thin Au/Ti layer on a SiO2 surface was physically etched by low energy argon ion bombardment 9ion milling), Au/Ti nano-wires were successfully formed just below the CNTs exactly duplicating their lateral shapes. Cross-sectional analysis by transmission electron microscopy revealed that the edge of the metal wire was very sharply developed indicating the great difference in the milling rates between the CNTs and the metal layer as well as the good directionality of the ion milling. We could easily find a few nanometer-wide Au/Ti wires among the wires of various width. After the formation of nano-wires, the CNTs could be pushed away from the metal nano-wire by atomic force microscopy, The lateral force for the removal of the CNTs are dependent upon the width and shape of the wires. Resistance of the metal nano-wires without the CNTs was also measured through the micro-contacts definted by electron beam lithography. since this CNT-based lithographic technique is, in principle, applicable to any kinds of materials, it can be very useful in exploring the fields of nano-science and technology, especially when it is combines with the CNT manipulation techniques.