• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2001.10a
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• pp.75-79
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• 2001

In the recent years, as the research and the development of micro and precision machinery become active, the interest of micro actuators using SMA(Shape Memory Alloy) has been increased. The dynamic characteristic analysis of SMA is necessary for actuator application and many common researches report the material characteristics of SMA sufficiently. However, the research on dynamic characteristics is very deficient. In this paper, the helical spring are fabricated with NiTi SMA wire of high resistivity, The force, response speed, temperature, and displacement are measured by digital force gauge, infrared thermometer, and laser displacement sensor so that the dynamic characteristics of this SMA is analyzed. Also, bidirectional actuator was fabricated and experimented for its performance.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.10b
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• pp.167-174
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• 2003

Microforming technology becomes crucial in variety of industries as up-to-date machinery products and parts are miniaturized Therefore research on micro forming processes are actively conducted because of its high productivity, high precision and efficienct material usage. Since friction during microforming has greater influence than macroforming, hydrostatic pressing is much more efficient. In this paper minimization of bur during fine sheet shear forming and hydrostatic process of multi-filament extrusion to obtain fine wire of micro-order have been conducted.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2003.10a
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• pp.47-52
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• 2003

In the recent years, as the research and the development of micro and precision machinery become active, the interest of micro actuators using SMA(Shape Memory Alloy) has been increased. The dynamic characteristic analysis of SMA is necessary for actuator application and many common researches report the material characteristics of SMA sufficiently. However, the research on dynamic characteristics is very deficient. In this paper, the helical spring are fabricated with NiTi SMA wire of high resistivity. The force, response speed, temperature, and displacement are measured by digital force gauge, infrared thermometer, and laser displacement sensor so that the dynamic characteristics of this SMA is analyzed. Also, bidirectional actuator was fabricated and experimented fir its performance.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.755-758
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• 1997

In the recent years, as the research and the development of micro and precision machinery become active, the interest of micro actuators using SMA(Shape Memory Alloy) has been increased. The dynamic characteristic analysis of SMA is necessary for actuator application and many common researches report the material characteristics of SMA sufficiently. However, the research of dynamic characteristics is very deficient. In this paper, the helical spring is fabricated with NiTi SMA wire of high resistivity The force, response speed, temperature, and displacement are measured by digital force gauge, infrared thermometer, and laser displacement sensor so that the dynamic characteristics of this SMA actuator is analyzed.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2003.04a
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• pp.346-351
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• 2003

In the recent years, as the research and the development of micro and precision machinery become active, the interest of micro actuators using SMA(Shape Memory Alloy) has been increased. The dynamic characteristic analysis of SMA is necessary for actuator application and many common researches report the material characteristics of SMA sufficiently. However, the research on dynamic characteristics is very deficient. In this paper, the helical spring are fabricated with NiTi SMA wire of high resistivity. The force, response speed, temperature, and displacement are measured by digital force gauge, infrared thermometer, and laser displacement sensor so that the dynamic characteristics of this SMT is analyzed. Also, bidirectional actuator was fabricated and experimented for its performance

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.256-259
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• 2008

An micro-probe tip must be manufactured using thin film to evaluate integrity of the semiconductor with narrow distance between pads. In this study, fatigue tests were performed for BeCu thin film which is used in micro-probe tip of semiconductor test machine. The thin film was manufactured by electro plating process, and the specimens were fabricated by wire-cut electric discharge method to make hour glass type specimen of $5000{\mu}m$ width, $29200{\mu}m$ length and $30{\mu}m$ thickness. The fatigue test of load control with 10Hz frequency was performed, in ambient environment. The fatigue cycles were tension-tension with mean stress, at stress ratio, R=0.1.

• Journal of the Korean institute of surface engineering
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• v.43 no.5
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• pp.243-247
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• 2010

The micro Vickers hardness and internal stress of Ni-Fe metal thin film synthesized by electrodeposition method at $25^{\circ}C$ were studied as a function of bath composition, and surface microstructure and atomic compositions of thin films were investigated by SEM and EDS. And the shape change of $200\;{\AA}$ Ni-Fe nanowires made using anodic aluminum oxide(AAO) templates by electrodeposition method were observed by SEM as a function of ultrasonic treatment time and bath composition. The Fe deposition contents on the substrate non-linearly increased with Fe ion concentration over total metal ion concentration. In case of low Fe contents film, the grain size is smaller and denser than high Fe contents deposited films, and the micro Vickers hardness increased with Fe contents of electrodeposited films. These results affected the shape change of nanowire after ultrasonic treatments.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 1999.12a
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• pp.127-154
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• 1999

Interconnect - Wire bonding-> Flip chip interconnect ; At research step, Au stud bump bonding seems to be more proper .Package -Plastic package-> $Z_{0}$ controlled land grid package -Flip Chip will be used for RF ICs and CSP for digital ICs -RF MCM comprised of bare active devices and integrated passive components -Electrical design skills are much more required in RF packaging .Passive Component -discrete-> integrated -Both of size and numbers of passive components must be reduced

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2012.05a
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• pp.135-135
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• 2012

세계 환경유해물질 규제에 대응하여 반도체 substrate의 Pb-free solution의 일환으로 등장한 PPF (Pre-Plated Frame)는 패키지공정 조립성은 물론, 자동차 반도체와 같은 고 신뢰성 및 low cost 요구를 만족하기 위해 초박막 고품질의 도금층과 Sub-micro scale의 rough treatment 와 같은 미세 표면제어 기술, 그리고 Au wire로부터 Cu wire 로의 전환에 대응하는 최적화된 도금층 구조로 발전하고 있다. 이러한 기술적인 진화를 거듭해온 이 기술은 다양한 반도체 substrate에 광범위하게 사용될 수 있기 때문에 향후 PPF기술의 활용저변은 더욱 확대될 전망이다.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.41 no.2
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• pp.150-155
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• 2013

We present a kevlar rope based Non-Explosive Actuator(NEA) device which has simple structure and is activated by burning Ni-Cr wire. Through performance test, we find it can be operated under various pre-load by simply changing turn number of Ni-Cr wire. It shows release time of 680ms and shock level of 110G under pre-load of 6.0kN. Launching environment and space environment tests are planned to verify performance of the NEA based on European Satellite Agency test manual. Conclusively, we expect the proposed NEA can be applicable to release solar panel and fairing separation.