• Title/Summary/Keyword: Micro molding method

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Study on Micro-bubble Generation Characteristics in Venturi Cavitation using Laser Diffractometer (레이저 회절 측정기를 이용한 벤츄리 캐비테이션에서의 마이크로버블 발생 특성 연구)

  • Lim, Yun Gyu;Yang, Hae Jeong;Kim, Yung Il
    • Journal of Drive and Control
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    • v.16 no.1
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    • pp.1-6
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    • 2019
  • The use of micro bubbles in industrial fields has been increasing in the recent years., particularly micro-bubble sterilization and water purification effects. Various methods have been developed for the generation of micro-bubbles. Depending on the method of generating bubbles, the micro-bubbles can be roughly classified into saturation molding, cavitation and rotation flow types. The objective of this study was to use ventilated tube type as a method of generating micro-bubbles in order to purify large amount of water quality such as lakes and reservoirs. This method shows a difference in efficiency in which micro-bubbles are generated depending on the contact ratio of gas to liquid. The study also investigated the optimal gas liquid contact ratio by applying various orifice methods and investigated the optimum condition of micro-bubble generation by gas Based on this, a technology to develop a micro-bubble generator with a venturi type nozzle shape that has a high water purification effect was developed.

Fabrication of the Micro-structured DVD-RAM Substrates (미세 형상을 갖는 DVD-RAM 기판의 성형에 관한 연구)

  • 문수동
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2000.04a
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    • pp.167-170
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    • 2000
  • Recently the sub-micron structured substrates of 0.74 ${mu}ell$ track pitch and 800 $\AA$groove depth are required for DVD-RAM and the track pitch is expected to be narrower as the need for the information storage density is getting higher. For the accurate replication of the land-groove structure in the stamper to the plastic substrates it is important to control the injection -compression molding process such that the integrity of the replication for the land-groove structure is maximized. in the present study polycarbonate substrates were fabricated by injection comression molding and the land-groove structure regarded as one of mold temperature and the compression pressure on the integrity of the replication were examined experimentally. An efficient design methodology using the response surface method (RSM) the central composite design(CCD) technique and the analysis-of-variance (ANOVA) was developed to obtain the optimum processing conditions which maximize the integrity of the replication with a limited number of experiments.

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Development of micro-mold for New Injecton Molder to fabricate Micro-Nano system (Micro-Nano 시스템 제조를 위한 소형 차세대 사출기 개발과 이를 위한 Micro meld의 개발)

  • 황교일;류경주;김훈모
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2002.05a
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    • pp.910-913
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    • 2002
  • Recently, the sensor and actuator are developed with EAP(Electro Active Polymer). Common used of they is close at hand, the bio chip and Lab on a chip are researched. For developed bio and micro system, a researcher applies semiconductor fabrication or make it by his hand. But, this method takes long time and a tolerance is large So they are problem of common used. So In this paper we propose the new inject ion molder and micro mold. The micro mold is different from exist ing mold. In this paper, the fabration of micro mold is introduced to inject.

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A Study on the Optical communication part Lid glass manufacture technology by high temperature and compression molding (광통신 부품 Lid glass 고온압축성형의 관한 연구)

  • Jang, K.C.;Lee, D.G.;Jang, H.
    • Proceedings of the KSME Conference
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    • 2007.05a
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    • pp.1526-1531
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    • 2007
  • Data transmission capacity that is required in 2010 is forecasted that increase by optical communication capacity more than present centuple, and is doing increased demand of optical communication related industry product present. Specially, Lid glass' application that is one of optical communication parts is used in optical communication parts manufacture of Fiber array, Ferrule array, Fanout Black, Silica optical waveguide chip and splitter etc. Also, it is used widely for communication network system, CATV, ATM-PON, FTTH and system. But, Lid glass need much processing times and becomes cause in rising prices of optical communication parts because production cost is expensive. The objectives, of this work is to suggest the micro concave and convex pattern manufacturing technology on borosilicate plate using high temperature and compression molding method. As a result, could developed micro pattern Mold more than 5 pattern, and reduce Lid Glass manufacture cycle time.

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Effect of Micro Surface Structure on Printed Electronics (미세표면구조가 전자인쇄에 미치는 영향)

  • Kim, Seung-Hwan;Kang, Hyun-Wook;Lee, Kyung-Heon;Sung, Hyung-Jin
    • Journal of the Korean Society for Precision Engineering
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    • v.27 no.9
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    • pp.20-25
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    • 2010
  • The effect of micro surface structure on printing for printed electronics has been studied experimentally. The photolithography MEMS fabricationwass used to make a SU-8 molder which has micro structures on the surface, and the PDMS micro structure was fabricated by the PDMS molding method. In the aspect of printed electronics, we used silver paste conductive ink. We measured the surface energy variation on pillar microstructure. The microstructure was used to real printing experiment by a screen printing. We printed 1cm micro lines which have $30{\sim}250{\mu}m$ width, and checked the conductivity to sort out opened line pattern. Printability was defined by success probability of printed patterns and we found that the present microstructures improve the printability significantly.

Investigation on the Injection Molding Characteristics Using Taguchi Method (다구찌법을 이용한 미세사출 성형 인자에 대한 고찰)

  • Shin K. H.;Yoon G. S.;Chang S. H.;Jung W. C.;Kim M. Y.;Heo Y. M.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2005.09a
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    • pp.147-152
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    • 2005
  • In recent industry, according to pursuit the miniaturization and high-precision of machine part with development of new technology as IT, BT the development of mold manufacturing technology for mass production is accompanied. In this study, the spiral type injection mold with a $200{\mu}m$ thickness shape is made for investigation of influence for injection molding process variables and the flow length is measured through an experiment. Beside, the result of each experiment Is compared with the analysis result of CAE. Taguchi method is used in this experiment and the obtained data are analyzed using ANOVA method.

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Optimization of preform mold injection molding process for hemispheric plastic structure fabrication (반구형 플라스틱 구조체 성형을 위한 프리폼 몰드 사출성형공정 최적화)

  • Park, Jeong-Yeon;Ko, Young-Bae;Kim, Dong-Earn;Ha, Seok-Jae;Yoon, Gil-Sang
    • Design & Manufacturing
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    • v.13 no.2
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    • pp.30-36
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    • 2019
  • Traditional cell culture(2-dimensional) is the method that provide a nutrient and environment on a flat surface to cultivate cells into a single layer. Since the cell characteristics of 2D culture method is different from the characteristics of the cells cultured in the body, attempts to cultivate the cells in an environment similar to the body environment are actively proceeding in the industry, academy, and research institutes. In this study, we will develop a technology to fabricate micro-structures capable of culturing cells on surfaces with various curvatures, surface shapes, and characteristics. In order to fabricate the hemispheric plastic structure(thickness $50{\mu}m$), plastic preform mold (hereinafter as "preform mold") corresponding to the hemisphere was first prepared by injection molding in order to fabricate a two - layer structure to be combined with a flat plastic film. Then, thermoplastic polymer dissolved in an organic solvent was solidified on a preform mold. As a preliminary study, we proposed injection molding conditions that can minimize X/Y/Z axis deflection value. The effects of the following conditions on the preform mold were analyzed through injection molding CAE, [(1) coolant inlet temperature, (2) injection time, (3) packing pressure, (4) volume-pressure (V/P). As a result, the injection molding process conditions (cooling water inlet temperature, injection time, holding pressure condition (V / P conversion point and holding pressure size)) which can minimize the deformation amount of the preform mold were derived through CAE without applying the experimental design method. Also, the derived injection molding process conditions were applied during actual injection molding and the degree of deformation of the formed preform mold was compared with the analysis results. It is expected that plastic film having various shapes in addition to hemispherical shape using the preform mold produced through this study will be useful for the molding preform molding technology and cast molding technology.

Fracture Toughness Measurement of the Semiconductor Encapsulant EMC and It's Application to Package (반도체 봉지수지의 파괴 인성치 측정 및 패키지 적용)

  • 김경섭;신영의;장의구
    • Electrical & Electronic Materials
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    • v.10 no.6
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    • pp.519-527
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    • 1997
  • The micro crack was occurred where the stress concentrated by the thermal stress which was induced during the cooling period after molding process or by the various reliability tests. In order to estimate the possibility of development from inside micro crack to outside fracture, the fracture toughness of EMC should be measured under the various applicable condition. But study was conducted very rarely for the above area. In order to provide a was to decide the fracture resistance of EMC (Epoxy Molding Compound) of plastic package which is produced by using transfer molding method, measuring fracture is studied. The specimens were made with various EMC material. The diverse combination of test conditions, such as different temperature, temperature /humidity conditions, different filler shapes, and post cure treatment, were tried to examine the effects of environmental condition on the fracture toughness. This study proposed a way which could improve the reliability of LOC(Lead On Chip) type package by comparing the measured $J_{IC}$ of EMC and the calculated J-integral value from FEM(Finite Element Method). The measured $K_{IC}$ value of EMC above glass transition temperature dropped sharply as the temperature increased. The $K_{IC}$ was observed to be higher before the post cure treatment than after the post cure treatment. The change of $J_{IC}$ was significant by time change. J-integral was calculated to have maximum value the angle of the direction of fracture at the lead tip was 0 degree in SOJ package and -30 degree in TSOP package. The results FEM simulation were well agreed with the results of measurement within 5% tolerance. The package crack was proved to be affected more by the structure than by the composing material of package. The structure and the composing material are the variables to reduce the package crack.ack.

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Transient filling simulations in unidirectional fibrous porous media

  • Liu, Hai Long;Hwang, Wook-Ryol
    • Korea-Australia Rheology Journal
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    • v.21 no.1
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    • pp.71-79
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    • 2009
  • The incomplete saturation and the void formation during the resin infiltration into fibrous porous media in the resin transfer molding process cause failure in the final product during its service. In order to better understand flow behavior during the filling process, a finite-element scheme for transient flow simulation across the micro-structured fibrous media is developed in the present work. A volume-of- fluid (VOF) method has been incorporated in the Eulerian frame to capture the evolution of flow front and the vertical periodic boundary condition has been combined to avoid unwanted wall effect. In the microscale simulation, we investigated the transient filling process in various fiber structures and discussed the mechanism leading to the flow fingering in the case of random fiber distribution. Effects of the filling pressure, the shear-thinning behavior of fluid and the volume fraction on the flow front have been investigated for both intra-tow and the inter-tow flows in dual-scale fiber tow models.