• 한국지능시스템학회:학술대회논문집
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• 한국퍼지및지능시스템학회 1993년도 Fifth International Fuzzy Systems Association World Congress 93
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• pp.1394-1397
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• 1993

A Fuzzy Microprocessor(FMP) is presented, which is suitable for real-time control applications. The features include high speed inference of maximum 114K FLIPS at 20MHz system clocks, capability of up to 128-rule construction, and handing of 8 input variables with 8-bit resolution. In order to realize these features, the fuzzifier circuit and the processing element(PE) are well optimized for LSI implementation. The chip fabricated in 1.2$\mu\textrm{m}$ CMOS technology contains 71K transistors in 82.8 $\textrm{mm}^2$ die size and is packaged in 100-pin plastic QFP.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part 1
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• pp.621-622
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• 2006

In this paper, we show some experimental results of binder-free WC sintered by Pulsed Electric Current Sintering (PECS) also known as Field Assisted Sintering Technology (FAST). These binder-free WC have extremely hardness and stiffness. However, these mechanical properties are dependent on the sintering condition, e.g., maximum temperature, applied pressure, etc. We show some relationship between mechanical properties and sintering condition to improve to sinter the binder-free WC.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 1998년도 제13차 학술회의논문집
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• pp.100-104
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• 1998

This paper describes the real-time implementation of an adaptive controller fur the robotic manipulator. Digital signal processors(DSPs) are special purpose micro-processors that are particularly powerful for intensive numerical computations involving sums and products of variables. TMS320C50 chips are used in implementing real time adaptive control algorithms to provide an enhanced motion for robotic manipulators. In the proposed scheme, adaptation laws are derived from the improved Lyapunov second stability analysis based on the direct adaptive control theory. The adaptive controller consists of an adaptive feedforward controller and feedback controller. The proposed control scheme is simple in structure, fast in computation, and suitable for real-time control. Moreover, this scheme does not require any accurate dynamic modeling, nor values of manipulator parameters and payload. Performance of the adaptive controller is illustrated by simulation and experimental results for a assembling robot.

• 소성∙가공
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• 제22권1호
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• pp.23-29
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• 2013

In this study, a micro/nano-random-pattern-structure surface was machined by electric discharge machining (EDM) followed by replicating the EDM surface with a silicone elastomer having low energy and greater hydrophobicity. The variation of hydrophobicity was of prime interest and was examined as a function of the surface roughness of the replicated silicone elastomer. The hydrophobicity was evaluated by the water contact angle (WCA) measured on the relevant surface. For the experiments, the original surfaces were machined by die sinking electric discharge machining (DS-EDM) and wire cutting electric discharge machining (WC-EDM). The ranges of surface roughness were Ra $0.8{\sim}19{\mu}m$ for the DS-EDM and Ra $0.5{\sim}4.7{\mu}m$ for the WC-EDM. In order to fabricate a hydrophobic surface, the EDM surfaces were directly replicated using a liquid-state silicone elastomer, which was thermally cured. The measured WCA on the replicated surfaces for DS-EDM was in the range of $115{\sim}130^{\circ}$ and for WC-EDM the WCA was in the range of $123{\sim}150^{\circ}$. Additionally, the dynamic hydrophobicity was evaluated by measuring an advancing and a receding WCA on the replicated silicone elastomer surfaces.

• 마이크로전자및패키징학회지
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• 제21권2호
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• pp.37-41
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• 2014

차세대 전자 소자 기술에서 전력전달은 소자의 전력을 낮추고 발열로 인한 문제 해결을 위해서 매우 중요한 기술로 대두되고 있다. 본 연구에서는 직사각형 ABL 전력 범프를 이용한, Cu-to-Cu 플립 칩 본딩 공정의 신뢰성 문제에 대해 살펴보았다. 다이 내 범프 높이 차이는 전기도금 후 CMP 공정을 진행했을 경우 약 $0.3{\sim}0.5{\mu}m$ 이었고, CMP 공정을 진행하지 않았을 경우는 약 $1.1{\sim}1.4{\mu}m$으로 나타났다. 또한 면적이 큰 ABL 전력 범프가 입출력 범프 보다 높이가 높게 나타났다. 다이 내 범프 높이 차이로 인해 플립 칩 본딩 공정 시 misalignment 문제가 발생하였고, 이는 본딩 quality 에도 영향을 미쳤다. Cu-to-Cu 플립 칩 공정을 위해선 다이 내 범프 높이 균일도와 Cu 범프의 평탄도 조절이 매우 중요한 요소라 하겠다.

• Design & Manufacturing
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• 제14권3호
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• pp.23-30
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• 2020

Laser Assisted Thermo-Compression Bonding (LATCB) has been proposed to improve the "chip tilt due to the difference in solder bump height" that occurs during the conventional semiconductor chip bonding process. The bonding module of the LATCB system has used a piezoelectric actuator to control the inclination of the compression jig on a micro scale, and the piezoelectric actuator has been directly coupled to the compression jig to minimize the assembly tolerance of the compression jig. However, this structure generates a lateral force in the piezoelectric actuator when the compression jig is tilted, and the stacked piezoelectric element vulnerable to the lateral force has a risk of failure. In this paper, the optimal design of the flexure hinge was performed to minimize the lateral force generated in the piezoelectric actuator when the compression jig is tilted by using the displacement difference of the piezoelectric actuator in the bonding module for LATCB. The design variables of the flexure hinge were defined as the hinge height, the minimum diameter, and the notch radius. And the effect of the change of each variable on the stress generated in the flexible hinge and the lateral force acting on the piezoelectric actuator was analyzed. Also, optimization was carried out using commercial structural analysis software. As a result, when the displacement difference between the piezoelectric actuators is the maximum (90um), the maximum stress generated in the flexible hinge is 11.5% of the elastic limit of the hinge material, and the lateral force acting on the piezoelectric actuator is less than 1N.

• Design & Manufacturing
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• 제11권3호
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• pp.19-24
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• 2017

In these days, increase requirement of TEM (Transmission Electro Microscope) in not only scientific field but also industrial field. Because TEM can measure inner-structure of specimen a variety of materials like metal, bio. etc. When use TEM, specimen should be thin about 50nm. So making for thin specimen, use Ion milling device that include specimen holder. The holder generally made of Aluminium Aluminium holder is worn away easily. For this reason, using time of ion milling with aluminum holder is too short. To solve the problem, we replace aluminium holer to molybdenum alloy holder. In this paper, we design molybdenum alloy holer for CAM and modify CAD modeling for effective machining process. So we array a specimen 3 by 4 and setup orientation for one-shot machining process. Next we make a CAM program for machining. we making a decision two machining strategy that chose condition of tool-path method, step-down, step-over. etc. And then conduct machining using CNC milling machining center. To make clear difference between case.1 and case.2, we fixed machining conditions like feed-rate, main spindle rpm, etc. After machining, we confirm the condition of workpiece and analysis the problems case by case. Finally, case.2 work piece that superior than case.1 cutting with WEDM because that method can not ant mechanical effect on workpiece.

• 보건행정학회지
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• 제27권2호
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• pp.167-176
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• 2017

Background: This study aimed to analyze the impact of community health care resources on the place of death of older adults with dementia compared to those with cancer in South Korea, using public administrative big data. Methods: Based on a literature review, we selected person- and community-level variables that can affect older people's decisions about where to die. Data on place-of-death and person-level attributes were obtained from the 2013 death certification micro data from Statistics Korea. Data on the population and economic and health care resources in the community where the older deceased resided were obtained from various open public administrative big data including databases on the local tax and resident population statistics, health care resources and infrastructure statistics, and long-term care (LTC) insurance statistics. Community-level data were linked to the death certificate micro data through the town (si-gun-gu) code of the residence of the deceased. Multi-level logistic regression models were used to simultaneously estimate the impacts of community as well as individual-level factors on the place of death. Results: In both the dementia (76.1%) and cancer (87.1%) decedent groups, most older people died in the hospital. Among the older deceased with dementia, hospital death was less likely to occur when the older person resided in a community with a higher supply of LTC facility beds, but hospital death was more likely to occur in communities with a higher supply of LTC hospital beds. Similarly, among the cancer group, the likelihood of a hospital death was significantly lower in communities with a higher supply of LTC facility beds, but was higher in communities with a higher supply of acute care hospital beds. As for individual-level factors, being female and having no spouse were associated with the likelihood of hospital death among older people with dementia. Conclusion: More than three in four older people with dementia die in the hospital, while home is reported to be the place of death preferred by Koreans. To decrease this gap, an increase in the supply of end-of-life (EOL) care at home and in community-based service settings is necessary. EOL care should also be incorporated as an essential part of LTC. Changes in the perception of EOL care by older people and their families are also critical in their decisions about the place of death, and should be supported by public education and other related non-medical, social approaches.

• 마이크로전자및패키징학회지
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• 제17권2호
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• pp.55-61
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• 2010

탄탈륨실리사이드 히터가 내장된 소자를 Ag 페이스트와 Au SBB(Stud Bump Bonding)를 이용하여 Au가 코팅 된 기판에 각각 접합 하였다. 전단 테스트와 전류를 흐르면서 열 성능을 측정하였다. Au 스터드 범프 본딩의 최적 플립칩 접합조건은 전단 후 파괴면 관찰하여 설정하였으며, 기판 온도를 $350^{\circ}C$, 소자 온도를 $250^{\circ}C$에서 하중을 300 g/bump 로 하여 접합하는 경우가 최적 조건이였다. 히터에 5 W 인가시 소자의 온도는 Ag 페이스트를 이용한 접합의 경우 최대 온도는 약 $50^{\circ}C$이었으며, Au 금속층을 갖고 있는 실리콘 기판에 Au 스터드 본딩으로 접합된 인 경우 약 $64^{\circ}C$를 나타내었다. 기판과의 접촉면적이 와이어본딩과 Au 스터드 범프 본딩 가 약 300배가 차이가 나는 경우 약 $14^{\circ}C$ 차이를 나타내었고, 전사모사를 통하여 접합면의 접촉저항이 중요한 이유임을 알 수 있었다.

• 한국응용곤충학회지
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• 제41권4호
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• pp.279-284
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• 2002

누에(Bombyx mori) 5령 유충에서 무름병 증상이 발견되었다. 세균성 병원균이 감염 누에 혈액에서 분리되었고, 본 연구에서 동정되었다. 분리된 세균을 각각의 누에 5령 유충에 $5{\times}10^{6}$ cfu(colony-forming unit) 농도로 혈강 주사되었을 때, 뚜렷한 무름병 증상을 유발시켰다. 이렇게 감염된 유충들은 접종 6일 후부터 죽기 시작하여, 10일 경과 후 처리된 유충 모두 사망하였다. Bergey의 세균동정집에 기록된 형태적 및 생리적 형질을 기준으로 이 곤충병원세균이 Staphylo-coccue gallinarum으로 판명되었다. 이 판정은 탄소원 분석 미생물동정장치($MicroLog^{\circledR}$) 분석 결과와 16S-23S rDNA internal transcribed space 구조에 의해서 확인되었다. 이 세균이 발휘하는 살충기작의 일환으로서, 감염 후 누에 유충 혈구에 세포치사 효과를 주어 패혈증을 유발하는 것으로 분석되었다.