• Title/Summary/Keyword: Micro deposition

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Study on the Fabrication and Characterization of Hydrophobic Surface with Hierarchical Microstructure using Spray Coating Deposition Method (스프레이 코팅 증착 방식을 이용한 계층적 미세 구조의 발수표면 제작 및 특성 분석에 대한 연구)

  • Jongyun Choi;Kiwoong Kim
    • Journal of the Korean Society of Visualization
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    • v.21 no.3
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    • pp.15-22
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    • 2023
  • This research introduces an innovative approach for fabricating microstructure surfaces using spray-coating deposition. The resulting surface, referred to as Magnetically Responsive Microstructures (MRM), exhibits hierarchically structured micro-pillar arrays with remarkably high aspect ratios. The fabrication process involves precisely mixing PDMS and hexane with Carbonyl iron powders, followed by ultrasonication and spray-coating on the top of a PDMS substrate placed on the neodymium magnet. The MRM surface shows hydrophobic properties, characterized by a contact angle surpassing 150° and an aspect ratio exceeding 10. Through a comprehensive exploration of critical parameters, including spray amount, magnet-substrate distance, and solution ratio enhanced dynamic tunability and exceptional hydrophobic characteristics are attained. This novel approach holds significant potential for diverse applications in the realm of dynamically tunable microstructures and magnetically responsive surfaces.

Fabrication Method and Performance Evaluation of Micro Igniter for MEMS Thruster (MEMS 추력기를 위한 마이크로 점화기의 제작 방법 및 성능 평가)

  • Lee, Jongkwang
    • Journal of the Korean Society of Propulsion Engineers
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    • v.19 no.1
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    • pp.1-8
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    • 2015
  • Micro igniter on the glass membrane for MEMS thruster was developed. The stability of the micro igniter by using a glass membrane with a thickness of tens of microns was improved. The micro igniter was fabricated by anisotropic wet etching of photosensitive glass and deposition of Pt/Ti for electric heat coil. The solid propellant was loaded into the propellant chamber without an especial technique due to the high structural stability of the glass membrane. Ignition tests were performed successfully. The minimum ignition delay was 27.5 ms with an ignition energy of 19.3 mJ.

Fabrication of MFISFET Compatible with CMOS Process Using $SrBi_2Ta_2O_9$(SBT) Materials

  • You, In-Kyu;Lee, Won-Jae;Yang, Il-Suk;Yu, Byoung-Gon;Cho, Kyoung-Ik
    • Transactions on Electrical and Electronic Materials
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    • v.1 no.1
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    • pp.40-44
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    • 2000
  • Metal-ferroelectric-insulator-semoiconductor field effect transistor (MFISFETs) were fabricated using CMOS processes. The Pt/SBT/NO combined layers were etched for forming a conformal gate by using Ti/Cr metal masks and a two step etching method, By the method, we were able to fabricate a small-sized gate with the dimension of $16/4{\mu}textrm{m}$ in the width/length of gate. It has been chosen the non-self aligned source and drain implantation process, We have deposited inter-layer dielectrics(ILD) by low pressure chemical vapor deposition(LPCVD) at $380^{circ}C$ after etching the gate structure and the threshold voltage of p-channel MFISFETs were about 1.0 and -2.1V, respectively. It was also observed that the current difference between the $I_{ON}$(on current) and $I_{OFF}$(off current) that is very important in sensing margin, is more that 100 times in $I_{D}-V_{G}$ hysteresis curve.

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A Study on the microcooling Fin Fabrication Process for Enhancing Boiling Heat Transfer (비등열전달 향상을 위한 초소형 핀 제작공정에 관한 연구)

  • You, Sam-Sang;Lim, Tae-Woo;Jeong, Seok-Kwon;Park, Jong-Un
    • Journal of Fisheries and Marine Sciences Education
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    • v.19 no.3
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    • pp.366-372
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    • 2007
  • This paper presents the fabrication techniques of microcooling fins for microelectronics applications. The various types of cooling fins have been fabricated on the surface of a silicon wafer (4inch-N type) by using wet etching technique. The designed micro fins and micro channels are considered as an effective method for cooling microelectronics devices generating high heat flux. Further we extensively investigate the design processes fabricating micro fins and channels which can cool the heat generated from high density electronics devices.

Anisotropic Superomniphobic Wettability on Hierarchical Structures of Micro Line Array Combined with Fluorinated Wax (C24F50)

  • Jeon, Deok-Jin
    • Proceedings of the Korean Vacuum Society Conference
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    • 2014.02a
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    • pp.209.2-209.2
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    • 2014
  • In recent years, researches about hydrophobic and hydrophilic surfaces have been executed however their other effects have not been researched enough. In this paper, the fabrication method of hierarchical structures of micro line array combined with fluorinated wax for anisotropic superomniphobic wettability is presented. We have achieved anisotropic and superomniphobic surface via simple two step methods, which are maskless photolithography and wax deposition. In order to prove how to provide those characteristics, SEM, contact angle measurement tool and X-ray diffraction are used. Fluorinated wax is crystalized self-assembly and it is subordinated on micro line array so that it is able to display anisotropic wettability. Understanding on anisotropic superomniphobic surface and simple fabrication method has been attracted to apply for lots of applications which range from self-cleaning surface, microfluidic chip, to directionally fluid control device, even in oily fluid.

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Luminescent and Electrical Characterization of ZnS:Tb Thin-Film Electroluminescent Devices Using Multilayered Insulators

  • Kim, Yong-Shin;Kang, Jung-Sook;Yun, Sun-Jin
    • 한국정보디스플레이학회:학술대회논문집
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    • 2000.01a
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    • pp.37-38
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    • 2000
  • The ZnS:Tb thin-film electroluminescent devices were grown by atomic layer deposition with utilizing single-layer aluminum oxide and/or multilayered tantalum aluminum oxide, $Ta_xAl_yO$, as upper and lower insulating layers. These devices were investigated in terms of the luminescent and electrical characteristics. From this analysis, the devices using the $Ta_xAl_yO$ instead of $Al_2O_3$ were observed to have a lower threshold voltage for emission due to the higher relative dielectric constant of $Ta_xAl_yO$ insulators than that of the $Al_2O_3$ device. And there was a large amount of dynamic space charge generation in the phosphor of the device with the $Ta_xAl_yO$ insulators seemingly due to electron multiplication such as trap ionization.

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Effect of Nitrogen Gas Pressure on the Property of TiN-Coated Layer of High Speed Steel by Arc ion Plating (AIP 법에서 질소가스 압력이 고속도강의 TiN 코팅층 성질에 미치는 영향)

  • Kim, Hae-Ji;Joun, Man-Soo
    • Journal of the Korean Society for Precision Engineering
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    • v.25 no.7
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    • pp.124-130
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    • 2008
  • The effect of nitrogen gas pressure in arc ion plating on surface properties of the TiN-coated high speed steel(SKH51) is presented in this paper. The surface roughness, micro-particle, micro-hardness, coated thickness, atomic distribution of TiN, and adhesion strength are measured fur various nitrogen gas pressures. It has been shown that the nitrogen gas pressure has a considerable effect on the surface roughness, adhesion strength, atomic distribution of TiN, and surface deposition of TiN of the high speed steels but that it has little influence on the micro-hardness and coated thickness.