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A Study on the microcooling Fin Fabrication Process for Enhancing Boiling Heat Transfer  

You, Sam-Sang (Korea Maritime University)
Lim, Tae-Woo (Korea Maritime University)
Jeong, Seok-Kwon (Pukyung National University)
Park, Jong-Un (Pukyung National University)
Publication Information
Journal of Fisheries and Marine Sciences Education / v.19, no.3, 2007 , pp. 366-372 More about this Journal
Abstract
This paper presents the fabrication techniques of microcooling fins for microelectronics applications. The various types of cooling fins have been fabricated on the surface of a silicon wafer (4inch-N type) by using wet etching technique. The designed micro fins and micro channels are considered as an effective method for cooling microelectronics devices generating high heat flux. Further we extensively investigate the design processes fabricating micro fins and channels which can cool the heat generated from high density electronics devices.
Keywords
MEMS; Lithography; Photoresist; Silicon Wafer; Deposition; Etching; Microcooling Fin;
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