• Title/Summary/Keyword: Micro Vision

검색결과 108건 처리시간 0.038초

3-Dimensional Micro Solder Ball Inspection Using LED Reflection Image

  • Kim, Jee Hong
    • International journal of advanced smart convergence
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    • 제8권3호
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    • pp.39-45
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    • 2019
  • This paper presents an optical technique for the three-dimensional (3D) shape inspection of micro solder balls used in ball-grid array (BGA) packaging. The proposed technique uses an optical source composed of spatially arranged light-emitting diodes (LEDs) and the results are derived based on the specular reflection characteristics of the micro solder balls for BGA A vision system comprising a camera and LEDs is designed to capture the reflected images of multiple solder balls arranged arbitrarily on a tray and the locations of the LED point-light-source reflections in each ball are determined via image processing, for shape inspection. The proposed methodology aims to determine the presence of defects in 3D BGA shape using the statistical information of the relative positions of multiple BGA balls, which are included in the image. The presence of the BGA balls with large deviations in relative position imply the inconsistencies in their shape. Experiments were conducted to verify that the proposed method could be applied to inspection without sophisticated mechanism and productivity problem.

마이크로 조립시스템의 원격제어 (A Dexterous Teleoperation System for Micro Parts Handling)

  • 김덕호;김경환;김근영;박종오
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2001년도 춘계학술대회논문집B
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    • pp.158-163
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    • 2001
  • Operators suffer much difficulty in manipulating micro/nano-sized objects without the assistance of human interfaces, due to the scaling effects in micro/nano world. This paper presents a micro manipulation system based on the teleoperation techniques which enables the operators to manipulate the objects with ease by transferring both human motion and manipulation skill to a micromanipulator. An experimental setup consisting of a micromanipulator operated under stereo-microscope with the help of intelligent user interface provides a tool that can be used to visualize and manipulate micro-sized 3D objects in a controlled manner. The key features of a micro manipulation system and control strategies using teleoperation techniques for handling micro objects are presented. Experimental results demonstrate the feasibility of this system in precisely controlling trapping and manipulation of micro objects based on teleoperation techniques.

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화상처리에 의한 등곡률반경 방식의 로봇 제어 (Vision steered micro robot for MIROSOT)

  • 차승엽;김병수;김경태
    • 제어로봇시스템학회:학술대회논문집
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    • 제어로봇시스템학회 1997년도 한국자동제어학술회의논문집; 한국전력공사 서울연수원; 17-18 Oct. 1997
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    • pp.825-827
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    • 1997
  • This paper presents a robot which is steered by vision system. The proposed robot system has an AM188ES CPU(5.3 MIPS) and 2DC motors with encoder and turns accurately at any speed and shows a movement like a human controlled car using a steering wheel. To the robot only steering angle value is sent without considering the speed. We present how to control this robot using our real time vision system.

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마이크로/나노 핸들링을 위한 마이크로 로보틱 플랫폼: 비전 기반 3자유도 절대위치센서 개발 (A Micro-robotic Platform for Micro/nano Assembly: Development of a Compact Vision-based 3 DOF Absolute Position Sensor)

  • 이재하;;;양승한
    • 한국정밀공학회지
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    • 제27권1호
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    • pp.125-133
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    • 2010
  • A versatile micro-robotic platform for micro/nano scale assembly has been demanded in a variety of application areas such as micro-biology and nanotechnology. In the near future, a flexible and compact platform could be effectively used in a scanning electron microscope chamber. We are developing a platform that consists of miniature mobile robots and a compact positioning stage with multi degree-of-freedom. This paper presents the design and the implementation of a low-cost and compact multi degree of freedom position sensor that is capable of measuring absolute translational and rotational displacement. The proposed sensor is implemented by using a CMOS type image sensor and a target with specific hole patterns. Experimental design based on statistics was applied to finding optimal design of the target. Efficient algorithms for image processing and absolute position decoding are discussed. Simple calibration to eliminate the influence of inaccuracy of the fabricated target on the measuring performance also presented. The developed sensor was characterized by using a laser interferometer. It can be concluded that the sensor system has submicron resolution and accuracy of ${\pm}4{\mu}m$ over full travel range. The proposed vision-based sensor is cost-effective and used as a compact feedback device for implementation of a micro robotic platform.

Vision을 이용한 MLGA Chip 장착시스템 개발 (Development of Mounting System for MLAG Chip using Vision)

  • 노병옥;강판식
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2000년도 추계학술대회 논문집
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    • pp.661-665
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    • 2000
  • In this study, the control of mounting system for MLGA package was developed using machine vision for the control of rotating position compensation and mounting position of X-Y table. Two type of material (polymer, alumina )were used for the dielectric insulator of the MLGA. And the illumination system and the algorithm of position compensation that be suitable for these materials was developed. Also, the position control order that compensated by machine vision actuated to micro stepping motor and X-Y servo motor by controlled PC and mounted the MLGA on PCB in resolution to$\pm10\mum$ .

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반도체 절단 공정의 웨이퍼 자동 정렬에 관한 연구 (A study on the automatic wafer alignment in semiconductor dicing)

  • 김형태;송창섭;양해정
    • 한국정밀공학회지
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    • 제20권12호
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    • pp.105-114
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    • 2003
  • In this study, a dicing machine with vision system was built and an algorithm for automatic alignment was developed for dual camera system. The system had a macro and a micro inspection tool. The algorithm was formulated from geometric relations. When a wafer was put on the cutting stage within certain range, it was inspected by vision system and compared with a standard pattern. The difference between the patterns was analyzed and evaluated. Then, the stage was moved by x, y, $\theta$ axes to compensate these differences. The amount of compensation was calculated from the result of the vision inspection through the automatic alignment algorithm. The stage was moved to the compensated position and was inspected by vision for checking its result again. Accuracy and validity of the algorithm was discussed from these data.

웨이퍼 본딩 공정을 위한 3채널 비전 얼라이너 개발 (Development of The 3-channel Vision Aligner for Wafer Bonding Process)

  • 김종원;고진석
    • 반도체디스플레이기술학회지
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    • 제16권1호
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    • pp.29-33
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    • 2017
  • This paper presents a development of vision aligner with three channels for the wafer and plate bonding machine in manufacturing of LED. The developed vision aligner consists of three cameras and performs wafer alignment of rotation and translation, flipped wafer detection, and UV Tape detection on the target wafer and plate. Normally the process step of wafer bonding is not defined by standards in semiconductor's manufacturing which steps are used depends on the wafer types so, a lot of processing steps has many unexpected problems by the workers and environment of manufacturing such as the above mentioned. For the mass production, the machine operation related to production time and worker's safety so the operation process should be operated at one time with considering of unexpected problem. The developed system solved the 4 kinds of unexpected problems and it will apply on the massproduction environment.

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Experiments of soccer robots system

  • Sugisaka, Masanori;Nakanishi, Kiyokazu;Hara, Masayoshi
    • 제어로봇시스템학회:학술대회논문집
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    • 제어로봇시스템학회 2003년도 ICCAS
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    • pp.1105-1108
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    • 2003
  • The micro robot soccer playing system is introduced. Studying and learning, evolving in artificial agents are very difficult problem, but on the other hand we think more powerfully challenging task. In our laboratory, this soccer-system studies mainly centered on single agent learning problem. The construction of such experimental system has involved lots of kinds of challenges such as robot designing, vision processing, motion controlling. At last we will give some results showing that the proposed approach is feasible to guide the design of common agents system.

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통계적 방법에 의한 마이크로솔더볼의 3차원형상검사 (Statistical Approach to 3-Dimensional Shape Inspection of Micro Solder Balls)

  • 김지홍
    • 마이크로전자및패키징학회지
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    • 제28권4호
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    • pp.19-23
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    • 2021
  • 본 논문은 경면반사특성을 갖는 솔더볼의 생산공정 관리와 품질확보를 목적으로 머신비전을 적용한 3차원형상을 결함검사방법으로서, 60미크론 이내의 마이크로 솔더볼을 대상으로 정밀한 위치제어장치가 필요없이 임의로 위치한 솔더볼의 반사영상을 취득 후 통계적으로 분석하여 3차원 형상의 결함유무를 검사하는 방법을 제안한다. 이를 위해 복수개의 LED를 링형태로 배열한 광원을 사용하여 트레이에 위치한 많은 수의 마이크로솔더볼을 동시에 촬영한 영상을 취득하고, 영상처리를 통해 반사되는 LED의 상대적 위치를 구한 후, 통계적 분석을 통하여 결함의 유무를 판단하는 방법을 제안하고 실험을 통해 그 효용성을 보인다.

고속.지능형 마이크로머시닝을 위한 진단시스템 및 특성평가 (Development of Diagnosis System for Intelligent High-Speed Micro-Machining and Evaluation of Micro-Machining Characteristics)

  • 김흥배;이우영;최성주
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 1997년도 추계학술대회 논문집
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    • pp.993-998
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    • 1997
  • The advanced technology of micro-machining is starting to penetrate our lives. This technology, with which it is possible to make micro-structures by means of processing on the order of nm (micrometer = 1/1,000 mm) or less, is realizing machines that were only part of our wildest imagination. However, the fact is that many issues remain in the quest for a variety of applications. With the advent of computing technologies, information technologies, and telecommunications technologies, we foresee the need for new approaches in design, process, and the use of materials, technologies, and people in a globalized manufacturing enterprise. A new thinking paradigm is needed to focus on quality of service on the products we design and manufacture. Factories in different regions need to be co-ordinated through use of the state-of-the-art information on productivity, diagnostics, and service evaluation of manufacturing systems could be shared among different locations and partners. In this research, We develope the internet based Diagnosis system for micro machining and evaluate its characteristics by using mechatronic sensor like Dynamometer, acoustic emission, Acceleration sensor, micro phone, vision, infra-red thermometer.

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