• International journal of advanced smart convergence
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• v.8 no.3
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• pp.39-45
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• 2019

This paper presents an optical technique for the three-dimensional (3D) shape inspection of micro solder balls used in ball-grid array (BGA) packaging. The proposed technique uses an optical source composed of spatially arranged light-emitting diodes (LEDs) and the results are derived based on the specular reflection characteristics of the micro solder balls for BGA A vision system comprising a camera and LEDs is designed to capture the reflected images of multiple solder balls arranged arbitrarily on a tray and the locations of the LED point-light-source reflections in each ball are determined via image processing, for shape inspection. The proposed methodology aims to determine the presence of defects in 3D BGA shape using the statistical information of the relative positions of multiple BGA balls, which are included in the image. The presence of the BGA balls with large deviations in relative position imply the inconsistencies in their shape. Experiments were conducted to verify that the proposed method could be applied to inspection without sophisticated mechanism and productivity problem.

• Proceedings of the KSME Conference
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• 2001.06b
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• pp.158-163
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• 2001

Operators suffer much difficulty in manipulating micro/nano-sized objects without the assistance of human interfaces, due to the scaling effects in micro/nano world. This paper presents a micro manipulation system based on the teleoperation techniques which enables the operators to manipulate the objects with ease by transferring both human motion and manipulation skill to a micromanipulator. An experimental setup consisting of a micromanipulator operated under stereo-microscope with the help of intelligent user interface provides a tool that can be used to visualize and manipulate micro-sized 3D objects in a controlled manner. The key features of a micro manipulation system and control strategies using teleoperation techniques for handling micro objects are presented. Experimental results demonstrate the feasibility of this system in precisely controlling trapping and manipulation of micro objects based on teleoperation techniques.

• 제어로봇시스템학회:학술대회논문집
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• 1997.10a
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• pp.825-827
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• 1997

This paper presents a robot which is steered by vision system. The proposed robot system has an AM188ES CPU(5.3 MIPS) and 2DC motors with encoder and turns accurately at any speed and shows a movement like a human controlled car using a steering wheel. To the robot only steering angle value is sent without considering the speed. We present how to control this robot using our real time vision system.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.1
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• pp.125-133
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• 2010

A versatile micro-robotic platform for micro/nano scale assembly has been demanded in a variety of application areas such as micro-biology and nanotechnology. In the near future, a flexible and compact platform could be effectively used in a scanning electron microscope chamber. We are developing a platform that consists of miniature mobile robots and a compact positioning stage with multi degree-of-freedom. This paper presents the design and the implementation of a low-cost and compact multi degree of freedom position sensor that is capable of measuring absolute translational and rotational displacement. The proposed sensor is implemented by using a CMOS type image sensor and a target with specific hole patterns. Experimental design based on statistics was applied to finding optimal design of the target. Efficient algorithms for image processing and absolute position decoding are discussed. Simple calibration to eliminate the influence of inaccuracy of the fabricated target on the measuring performance also presented. The developed sensor was characterized by using a laser interferometer. It can be concluded that the sensor system has submicron resolution and accuracy of ${\pm}4{\mu}m$ over full travel range. The proposed vision-based sensor is cost-effective and used as a compact feedback device for implementation of a micro robotic platform.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.11a
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• pp.661-665
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• 2000

In this study, the control of mounting system for MLGA package was developed using machine vision for the control of rotating position compensation and mounting position of X-Y table. Two type of material (polymer, alumina )were used for the dielectric insulator of the MLGA. And the illumination system and the algorithm of position compensation that be suitable for these materials was developed. Also, the position control order that compensated by machine vision actuated to micro stepping motor and X-Y servo motor by controlled PC and mounted the MLGA on PCB in resolution to$\pm10\mum$ .

• Journal of the Korean Society for Precision Engineering
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• v.20 no.12
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• pp.105-114
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• 2003

In this study, a dicing machine with vision system was built and an algorithm for automatic alignment was developed for dual camera system. The system had a macro and a micro inspection tool. The algorithm was formulated from geometric relations. When a wafer was put on the cutting stage within certain range, it was inspected by vision system and compared with a standard pattern. The difference between the patterns was analyzed and evaluated. Then, the stage was moved by x, y, $\theta$ axes to compensate these differences. The amount of compensation was calculated from the result of the vision inspection through the automatic alignment algorithm. The stage was moved to the compensated position and was inspected by vision for checking its result again. Accuracy and validity of the algorithm was discussed from these data.

• Journal of the Semiconductor & Display Technology
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• v.16 no.1
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• pp.29-33
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• 2017

This paper presents a development of vision aligner with three channels for the wafer and plate bonding machine in manufacturing of LED. The developed vision aligner consists of three cameras and performs wafer alignment of rotation and translation, flipped wafer detection, and UV Tape detection on the target wafer and plate. Normally the process step of wafer bonding is not defined by standards in semiconductor's manufacturing which steps are used depends on the wafer types so, a lot of processing steps has many unexpected problems by the workers and environment of manufacturing such as the above mentioned. For the mass production, the machine operation related to production time and worker's safety so the operation process should be operated at one time with considering of unexpected problem. The developed system solved the 4 kinds of unexpected problems and it will apply on the massproduction environment.

• 제어로봇시스템학회:학술대회논문집
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• 2003.10a
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• pp.1105-1108
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• 2003

The micro robot soccer playing system is introduced. Studying and learning, evolving in artificial agents are very difficult problem, but on the other hand we think more powerfully challenging task. In our laboratory, this soccer-system studies mainly centered on single agent learning problem. The construction of such experimental system has involved lots of kinds of challenges such as robot designing, vision processing, motion controlling. At last we will give some results showing that the proposed approach is feasible to guide the design of common agents system.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.4
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• pp.19-23
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• 2021

A statistical approach to inspection of the 3-D shape of micro solder balls is proposed, where an optical method with spatially arranged LED and specular reflection is used. The reflected image captured by a vision system was analyzed to calculate the relative displacements of LED's in the image. Also, the statistics of displacements for the solder balls contained in a captured image are used to detect existing defects, and the usefulness of the proposed method is shown via experiments.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.993-998
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• 1997

The advanced technology of micro-machining is starting to penetrate our lives. This technology, with which it is possible to make micro-structures by means of processing on the order of nm (micrometer = 1/1,000 mm) or less, is realizing machines that were only part of our wildest imagination. However, the fact is that many issues remain in the quest for a variety of applications. With the advent of computing technologies, information technologies, and telecommunications technologies, we foresee the need for new approaches in design, process, and the use of materials, technologies, and people in a globalized manufacturing enterprise. A new thinking paradigm is needed to focus on quality of service on the products we design and manufacture. Factories in different regions need to be co-ordinated through use of the state-of-the-art information on productivity, diagnostics, and service evaluation of manufacturing systems could be shared among different locations and partners. In this research, We develope the internet based Diagnosis system for micro machining and evaluate its characteristics by using mechatronic sensor like Dynamometer, acoustic emission, Acceleration sensor, micro phone, vision, infra-red thermometer.