• Title/Summary/Keyword: Micro Molding

Search Result 308, Processing Time 0.024 seconds

A Study on the Mirror Grinding for Mold of a Small Aspherical Lens (소형 비구면 렌즈 금형의 경면 연삭 가공에 관한 연구)

  • Lee, Joo-Sang;Saeki, Masaru;Kuriyagawa, Tsunemoto;Syoji, Katsuo
    • Journal of the Korean Society for Precision Engineering
    • /
    • v.18 no.12
    • /
    • pp.82-87
    • /
    • 2001
  • This paper deals with mirror grinding of a small-sized aspherical lens by the resin bonded diamond spherical wheel. Up to now, a spherical lens has been used for the lens of the optical communication optical part. However, recently, the aspherical optical parts are mainly used in order to attempt the improvement in image quality and miniaturization of the optical device. It is possible to manufacture the aspherical lens which is presently being used in optical instrument through ultra-precision machinery technology. Also, to realize compactability, efforts are being made to produce a micro aspherical lens, for which the development of a high-precision, micro molding die is inevitable. Therefore, extensive research is being done on methods of producing an micro aspherical surface by high-precision grinding. In this paper, the spherical wheel was trued by cup-type truer and tool path was calculated by the radius of curvature of wheel after truing and dressing. And then in the aspherical grinding experiment, WC material which is used as a molding die for the small-sized aspherical lens was ground. It results was that a form accuracy of 0.1918${\mu}m$ P-V and a surface roughness of 0.064${\mu}m$ Rmax.

  • PDF

Fiber Orientation and Warpage of Film Insert Molded Parts with Glass Fiber Reinforced Substrate (유리섬유가 강화된 필름 삽입 사출품의 섬유배향 및 휨)

  • Kim, Seong-Yun;Kim, Hyung-Min;Lee, Doo-Jin;Youn, Jae-Ryoun;Lee, Sung-Hee
    • Composites Research
    • /
    • v.25 no.4
    • /
    • pp.117-125
    • /
    • 2012
  • Warpage of the film insert molded (FIM) part is caused by an asymmetric residual stress distribution. Asymmetric residual stress and temperature distribution is generated by the retarded heat transfer in the perpendicular direction to the attached film surface. Since warpage was not prevented by controlling injection molding conditions, glass fiber (GF) filled composites were employed as substrates for film insert molding to minimize the warpage. Distribution of short GFs was evaluated by using micro-CT equipment. Proper models for micro mechanics, anisotropic thermal expansion coefficients, and closure approximation should be selected in order to calculate fiber orientation tensor and warpage of the FIM part with the composite substrate. After six kinds of micro mechanics models, three models of the thermal expansion coefficient and five models of the closure approximation had been considered, the Mori-Tanaka model, the Rosen and Hashin model, and the third orthotropic closure approximation were selected in this study. The numerically predicted results on fiber orientation tensor and warpage were in good agreement with experimental results and effects of GF reinforcement on warpage of the FIM composite specimen were identified by the numerical results.

Optimization of Process Condition for Fe Nano Powder Injection Molding

  • Oh, Joo Won;Lee, Won Sik;Park, Seong Jin
    • Journal of Powder Materials
    • /
    • v.24 no.3
    • /
    • pp.223-228
    • /
    • 2017
  • Nanopowders provide better details for micro features and surface finish in powder injection molding processes. However, the small size of such powders induces processing challenges, such as low solid loading, high feedstock viscosity, difficulty in debinding, and distinctive sintering behavior. Therefore, the optimization of process conditions for nanopowder injection molding is essential, and it should be carefully performed. In this study, the powder injection molding process for Fe nanopowder has been optimized. The feedstock has been formulated using commercially available Fe nanopowder and a wax-based binder system. The optimal solid loading has been determined from the critical solid loading, measured by a torque rheometer. The homogeneously mixed feedstock is injected as a cylindrical green body, and solvent and thermal debinding conditions are determined by observing the weight change of the sample. The influence of the sintering temperature and holding time on the density has also been investigated. Thereafter, the Vickers hardness and grain size of the sintered samples have been measured to optimize the sintering conditions.

온도 변화에 따른 Nano/Micro $SiO_2$ 혼합 Epoxy의 체적고유저항 특성

  • Kim, Jeong-Sik;Jeong, In-Beom;Ryu, Bu-Hyeong;Kim, Gwi-Yeol;Hong, Jin-Ung
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2009.11a
    • /
    • pp.153-153
    • /
    • 2009
  • In the study the volume resistivity Characteristics of epoxy resin using nano and micro filler, nano and micro filler are made from insulating material epoxy resin using for transformer equipment and molding several devices as changing amount of addition of diameter 12 [nm] and 7 [${\mu}m$] $SiO_2$, we measured volume resistivity of nano and micro filler by High Resistance Meter(4329A). As the result of measurement, When is micro filler, the volume resistivity continuously increased over 80 [$^{\circ}$].

  • PDF

Effect of Micro Surface Structure on Printed Electronics (미세표면구조가 전자인쇄에 미치는 영향)

  • Kim, Seung-Hwan;Kang, Hyun-Wook;Lee, Kyung-Heon;Sung, Hyung-Jin
    • Journal of the Korean Society for Precision Engineering
    • /
    • v.27 no.9
    • /
    • pp.20-25
    • /
    • 2010
  • The effect of micro surface structure on printing for printed electronics has been studied experimentally. The photolithography MEMS fabricationwass used to make a SU-8 molder which has micro structures on the surface, and the PDMS micro structure was fabricated by the PDMS molding method. In the aspect of printed electronics, we used silver paste conductive ink. We measured the surface energy variation on pillar microstructure. The microstructure was used to real printing experiment by a screen printing. We printed 1cm micro lines which have $30{\sim}250{\mu}m$ width, and checked the conductivity to sort out opened line pattern. Printability was defined by success probability of printed patterns and we found that the present microstructures improve the printability significantly.

Gate Locations Optimization of an Automotive Instrument Panel for Minimizing Cavity Pressure (금형 내부 압력 최소화를 위한 자동차 인스트루먼트 패널의 게이트 위치 최적화)

  • Cho, Sung-Bin;Park, Chang-Hyun;Pyo, Byung-Gi;Cho, Dong-Hoon
    • Journal of the Korean Society for Precision Engineering
    • /
    • v.29 no.6
    • /
    • pp.648-653
    • /
    • 2012
  • Cavity pressure, an important factor in injection molding process, should be minimized to enhance injection molding quality. In this study, we decided the locations of valve gates to minimize the maximum cavity pressure. To solve this problem, we integrated MAPS-3D (Mold Analysis and Plastic Solution-3Dimension), a commercial injection molding analysis CAE tool, using the file parsing method of PIAnO (Process Integration, Automation and Optimization) as a commercial process integration and design optimization tool. In order to reduce the computational time for obtaining the optimal design solution, we performed an approximate optimization using a meta-model that replaced expensive computer simulations. To generate the meta-model, computer simulations were performed at the design points selected using the optimal Latin hypercube design as an experimental design. Then, we used micro genetic algorithm equipped in PIAnO to obtain the optimal design solution. Using the proposed design approach, the maximum cavity pressure was reduced by 17.3% compared to the initial one, which clearly showed the validity of the proposed design approach.

A study on the manufacturing of metal/plastic multi-components using the DSI molding (DSI 성형을 이용한 금속/플라스틱 복합 부품 제조에 관한 연구)

  • Ha, Seok-Jae;Cha, Baeg-Soon;Ko, Young-Bae
    • Design & Manufacturing
    • /
    • v.14 no.4
    • /
    • pp.71-77
    • /
    • 2020
  • Various manufacturing technologies, including over-molding and insert-injection molding, are used to produce hybrid plastics and metals. However, there are disadvantages to these technologies, as they require several steps in manufacturing and are limited to what can be reasonably achieved within the complexities of part geometry. This study aims to determine a practical approach for producing metal/plastic hybrid components by combining plastic injection molding and metal die casting to create a new hybrid metal/plastic molding process. The integrated metal/plastic hybrid injection molding process developed in this study uses the proven method of multi-component technology as a basis to combine plastic injection molding with metal die casting into one integrated process. In this study, the electrical conductivity and ampacity were verified to qualify the new process for the production of parts used in electronic devices. The electrical conductivity was measured, contacting both sides of the test sample with constant pressure, and the resistivity was measured using a micro ohmmeter. Also, the specific conductivity was subsequently calculated from the resistivity and contact surface of the conductor path. The ampacity defines the maximum amount of current a conductive path can carry before sustaining immediate or progressive deterioration. The manufactured hybrid multi-components were loaded with increasing currents, while the temperature was recorded with an infrared camera. To compare the measured infrared images, an electro-thermal simulation was conducted using commercial CAE software to predict the maximum temperature of the power loaded parts. Overall, during the injection molding process, it was demonstrated that multifunctional parts can be produced for electric and electronic applications.

A Study on the Injection Molding for the Light Guide Plate of a Small Sized LCD (2) : Influences of Processing Conditions on the Brightness (소형 LCD 도광판의 사출성형에 관한 연구 (2) : 공정조건이 휘도에 미치는 영향)

  • 이호상
    • Transactions of Materials Processing
    • /
    • v.11 no.4
    • /
    • pp.341-348
    • /
    • 2002
  • For the light guide plate of the TFT-LCD, there have been increasing demands for higher brightness, thin and light-weight design, and lower power consumption. To meet these demands, a micro-prism-type frontlight that integrates a prismatic sheet and a light-guiding plate has been developed. In this paper, the influences of processing conditions on the brightness were studied lot the injection molding of the light guide plate. Based on the experiment with an actual mold, the design of experiments and the neural network theory were used lot choosing the optimal processing parameters to increase the brightness and the uniformity. The verification experiment also showed that the brightness and the uniformity were increased dramatically with the chosen processing conditions.

Minimization of Weld Lines in Two Shot Molded Parts with Microlenses (미소 렌즈가 내재화된 이중사출 성형제품의 웰드라인 최소화)

  • 신주경;민병권;김영주;강신일
    • Transactions of Materials Processing
    • /
    • v.13 no.3
    • /
    • pp.230-235
    • /
    • 2004
  • A new design based on the appropriate geometry of molded part and type of runner system under the optimal processing conditions was proposed to minimize the micro weld lines on the sub deco surface molded by two shot molding. Theoretical and experimental studies were conducted to examine the cause of the weld lines during the overmolding process in two shot molding. Various dimensions and geometries of substrate$(1^{st}shot)$ and the wall thickness of overmold$(2^{nd}shot)$ have been proposed to avoid the weld lines which are the most inevitable appearance defects occurred on the sub deco. The each design proposal was analyzed by mold flow analysis after part modeling. The analysis results were compared with molded part from mass production tool. It could be seen that from the analysis that the proper geometry of plastic part and type of runner system considering pressure drop under the optimal processing conditions were the most influential factors to avoid weld lines occured on the sub deco.

Fabrication of the Micro-structured DVD-RAM Substrates (미세 형상을 갖는 DVD-RAM 기판의 성형에 관한 연구)

  • 문수동
    • Proceedings of the Korean Society for Technology of Plasticity Conference
    • /
    • 2000.04a
    • /
    • pp.167-170
    • /
    • 2000
  • Recently the sub-micron structured substrates of 0.74 ${mu}ell$ track pitch and 800 $\AA$groove depth are required for DVD-RAM and the track pitch is expected to be narrower as the need for the information storage density is getting higher. For the accurate replication of the land-groove structure in the stamper to the plastic substrates it is important to control the injection -compression molding process such that the integrity of the replication for the land-groove structure is maximized. in the present study polycarbonate substrates were fabricated by injection comression molding and the land-groove structure regarded as one of mold temperature and the compression pressure on the integrity of the replication were examined experimentally. An efficient design methodology using the response surface method (RSM) the central composite design(CCD) technique and the analysis-of-variance (ANOVA) was developed to obtain the optimum processing conditions which maximize the integrity of the replication with a limited number of experiments.

  • PDF