• Aerospace Engineering and Technology
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• v.3 no.2
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• pp.25-33
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• 2004

In this paper, we briefly introduce the micro-vibration test bench of KARI and the test and analysis method of RWA(Reaction Wheel Assembly) micro-vibration. The micro-vibration of RWA is measured on a KISTLER dynamic plate which can measure the time signal of 6 DOF simultaneously up to 400Hz. Measured data are extensively evaluated with respect to the wheel spin rate to identify the complicate wheel dynamic characteristics, and the static/dynamic unbalances are estimated from the extracted first harmonic component as a part of evaluation process. The estimated static and dynamic unbalances. 0.79gcm and 17.4gcm² respectively. The structural resonance mode and two rocking modes observed as a results of its frequency analysis. Several higher order harmonic components observed, which come from its rotor shape as well as the wheel bearing characteristics.

• Journal of Aerospace System Engineering
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• v.8 no.3
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• pp.6-13
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• 2014

A passive launch and on-orbit vibration isolator using SMA(Shape Memory Alloy) washer for both the structural safety of the micro-vibration source by attenuating the transmitted force under launch loads and the micro-vibration isolation during their on-orbit operation has been proposed, which does not require the additional launch locking mechanism. To measure the characteristics of SMA mesh washer, we performed compressive loading tests with a single SMA mesh washer and a vibration isolator using SMA mesh washer. The numerical equivalent model of vibration isolator using SMA mesh washer composed of two spring and viscous damping elements has been verified that both stiffness and viscous damping varied with respect to compressed deformations. In addition, the effectiveness of launch loads and micro-vibration reduction has been investigated through the dynamic characteristics measurement test of cooler assembly combined with passive vibration isolator.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2004.11a
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• pp.695-698
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• 2004

STSAT RWA (Reaction Wheel Assembly) micro-vibration is measured using KISTLER dynamic plate that can provide the time signals of three orthogonal forces and torques simultaneously up to 400Hz. In the post-processing, measured data are evaluated with respect to the wheel spin rate in both time and frequency domains, and the static/dynamic unbalances are evaluated from the extracted first harmonic component. Also the friction torque profile at each wheel speed is estimated from the measured data. Several higher order harmonic components are observed, that comes from its rotor shape as well as the wheel bearing characteristics. One of the most peculiar characteristics of this wheel is that the dynamic properties of two radial unbalance components are much different from each other as the RWA mounting configuration on a spacecraft is different from conventional RWA mounting configuration. Rocking mode is not appeared below 400Hz for all operating speed because the wheel size is very small. The post-processed results will be used for jitter analysis of STSAT due to RWA micro-vibration.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.644-647
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• 2004

Optical add/drop multiplexers (OADMs), one of the new network elements, will play a key role enabling greater connectivity and flexibility in the dense wavelength-division multiplexing (DWDM) networks. The importance of OADMs is that they allow the optical network to be local transmitting/extraction on a wavelength-by-wavelength basis to optimize traffic, efficient network utilization, network growth, and to enhance network flexibility. Also, the automatic assembly system of micro optical filters and fibers is a key technology in the development of optical modules with high functionality. Recently, one of remarkable tends in the development of optical communication industry is the miniaturization and integration of products. In this research, we have developed a system capable of automatic alignment of a film filter and a lensed fiber in order to improve the speed and losses in the optical fiber to filter alignment of optical modules. Using the developed automatic alignment system and silicon optical benches, we have fabricated the micro OADM and measured the insertion loss and aging effect.

• Journal of the Korea Institute of Military Science and Technology
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• v.23 no.1
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• pp.37-42
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• 2020

This study is for a bulletproof experiment through speed acceleration of steel ball(2.385 mm) at the laboratory level. The secondary propulsion method is used for speed acceleration, which uses a sabot assembly consisting of a sabot body, a plunger, water, and a sabot cap. At the core of the secondary drive, it is important that the energy in the water of the private particle is transferred well to the steel ball. The experiment was conducted by selecting a plunger that pushes water and water charged with variables. judging that the longer the contact time, the greater the energy transferred to the steel ball. As a result of experiments with each variable, the amount of water does not affect the speed acceleration efficiency of the steel ball and, when the length of the plunger is increased by 200 %, the speed of the steel ball can be accelerated up to 130 m/s.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.2
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• pp.37-42
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• 2001

The BGA package has been the area array package of choice for several years. Recently, the transition has been to finer pitch configurations called Chip Scale Packages (CSP). Several of these package types are available at 0.5 mm pitch. requiring surface mount assemblers to evaluate and optimize various elements of the assembly process. This presentation describes the issues associated with making the transition from BGA to CSP assembly. Areas addressed will include the accuracy of pick and place equipment, printed wiring board lines and spaces, PWB vias, in-circuit test issues, solder paste printing, moisture related factors, rework and reliability. The transition to 0.5 mm pitch requires careful evaluation of the board design, solder paste selection, stencil design and component placement accuracy. At this pitch, ball and board pad diameters can be as small as 0.25 mm and 0.20 mm respectively. Drilled interstitial vias are no longer possible and higher ball count packages require micro-via board technology. The transition to CSP requires careful evaluation of these issues. Normal paste registration and BGA component tolerances can no longer achieve the required process levels and higher accuracy pick and place machines need to be implemented. This presentation will examine the optimization of these critical assembly operations, contrast the challenges at 0.5 mm and also look at the continuation of the process to incorporate smaller pitch flip chip devices.

• Structural Engineering and Mechanics
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• v.55 no.2
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• pp.315-334
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• 2015

This study's primary aim is to check the existence of a representative volume element for granular materials and determine the link between the properties (responses) of macro structures and the size of the discrete particle assembly used to represent a constitutive relation in a two-scale model. In our two-scale method the boundary value problem on the macro level was solved using finite element method, based on the Cosserat continuum; the macro stresses and modulus were obtained using a solution of discrete particle assemblies at certain element integration points. Meanwhile, discrete particle assemblies were solved using discrete element method under boundary conditions provided by the macro deformation. Our investigations focused largely on the size effects of the discrete particle assembly and the radius of the particle on macro properties, such as deformation stiffness, bearing capacity and the residual strength of the granular structure. According to the numerical results, we suggest fitting formulas linking the values of different macro properties (responses) and size of discrete particle assemblies. In addition, this study also concerns the configuration and displacement fluctuation of discrete particle assemblies on the micro level, accompanied with the evolution of bearing capacity and deformation on the macro level.

• Bulletin of the Korean Chemical Society
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• v.29 no.7
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• pp.1349-1352
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• 2008

We report a novel patterning method for a homo-polymeric poly(3-hexylthiophene) (P3HT) nanofilm particularly capable of strong adhesion to a $SiO_2$ surface. An oxidized silicon wafer substrate was micro-contact printed with n-octadecyltrichlorosilane (OTS) monolayer, and subsequently its negative pattern was selfassembled with three different amino-functionalized alkylsilanes, (3-aminopropyl)trimethoxysilane (APS), N- (2-aminoethyl)-3-aminopropyltrimethoxy silane (EDAS), and (3-trimethoxysilylpropyl) diethylenetriamine (DETAS). Then, P3HT nanofilms were selectively grown on the aminosilane pre-patterned areas via the vapor phase polymerization method. To evaluate the adhesion, patterning, and the film itself, the PEDOT nanofilms and SAMs were investigated with a $Scotch^{(R)}$ tape test, contact angle analyzer, ATR-FT-IR, and optical and atomic force microscopes. The evaluation showed that the newly developed all bottom-up process can offer a simple and inexpensive patterning method for P3HT nanofilms robustly adhered to an oxidized Si wafer surface by the mediation of $FeCl_3$ and amino-functionalized alkylsilane SAMs.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.04a
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• pp.27-34
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• 2001

The BGA Package has been the area array package of choice for several rears. Recently, the transition has been to finer pitch configuration called Chip Scale Packages (CSP). Several of these package types are available at 0.5 mm pitch, requiring surface mount assemblers to evaluate and optimize various elements of the assembly process. This presentation describes the issues associated with making the transition from BGA to CSP assembly. Areas addressed will include the accuracy of pick and piece equipment, printed wiring board lines and spaces, PWB vias, in-circuit test issues, solder paste printing, moisture related factors, rework and reliability. The transition to 0.5 mm pitch requires careful evaluation of the board design, solder paste selection, stencil design and component placement accuracy. At this pitch, ball and board pad diameters can be as small as 0.25 mm and 0.20 mm respectively. Drilled interstitial vias are no longer possible and higher ball count packages require micro-via board technology. The transition to CSP requires careful evaluation of these issues. Normal paste registration and BGA component tolerances can no longer achieve the required process levels and higher accuracy pick and place machines need to be implemented. This presentation will examine the optimization of these critical assembly operations, contrast the challenges at 0.5 mm and also look at the continuation of the process to incorporate smaller pitch flip chip devices.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.11a
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• pp.21-26
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• 2002

Solder flip chip bumping and subsequent coining processes on PCB were investigated to solve the warpage problem of organic substrates for high pin count flip chip assembly by providing good co-planarity. Coining of solder bumps on PCB has been successfully demonstrated using a modified tension/compression tester with height, coining rate and coining temperature variables. It was observed that applied loads as a function of coined height showed three stages as coining deformation : (1) elastic deformation at early stage, (2) linear increase of applied load, and (3) rapid increase of applied load. In order to reduce applied loads for coining solder bumps on PCB, effects of coining process parameters were investigated. Coining loads for solder bump deformation strongly depended on coining rates and coining temperatures. As coining rates decreased and process temperature increased, coining loads decreased. Among the effect of two factors on coining loads, it was found that process temperature had more significant effect to reduce applied coining loads during the coining process. Lower coining loads were needed to prevent substrate damages such as micro-via failure and build-up dielectric layer thickness change during applying loads. For flip chip assembly, 97Pb/Sn flip chip bumped devices were successfully assembled on organic substrates with 37Pb/Sn coined flip chip bumps.