• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2006년도 춘계학술대회논문집
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• pp.376-379
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• 2006

Reaction Wheel Assembly (RWA) is one of the major disturbance sources that have influence upon the Line of Sight (LOS) of payload. A micro-vibration induced by RWA is propagated through the satellite structure and decrease the LOS stability performance of payload. This effect shall be analyzed through the jitter analysis. If a requirement or specification of payload jitter level is found to be not satisfied according to the jitter analysis campaign, some modification or redesign should be done on the satellite structure or a couple of isolator should be attached on the RWA interface in order to reduce the transmitted vibration level of RWA. The purpose of ???RWA isolator test? is to roughly evaluate the performance of vibration suppression level with a passive RWA isolator made of rubber. For this test, actual RWA is used as a vibration source and a couple of cube-shaped rubber mount designed for satellite is used as a passive isolator. There may be several considerations in order to accommodate RWA isolator to spacecraft such as not only vibration reduction performance but also thermal conduction problem, mechanical size, RWA alignment problem, etc. But in this report the feasibility of RWA isolator is analyzed only in a vibration suppression point of view. As a result, high frequency vibration of RWA above 50Hz is perfectly attenuated with isolators, however, first harmonic components below 50Hz became larger due to the additional low frequency resonance modes of roll, pitch, yaw rigid body motion of RWA+bracket.

• 한국환경과학회지
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• 제6권3호
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• pp.277-283
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• 1997

SPME deuce was applied to determine the THM in an aqueous solution. The 6 kinds of THM was quantitatively detenuned by using GC-ECD which has the sample eutracted on the SPME fiber from an aqueous solution for 10 min. The THM components were well separated from $CHCl_3$ to the last $CHBr_3$ UHh 13 mons at the condition. 6 kinds of the volatile halogenated organic compounds: $CHCl_3$, $CHBrCl_2$, $CHBrtCl_2$, $CHCl_3$, $C_2Cl$. and $CHBr_3$, showed well defirled calibration graph with good llnearlty from a few ppb level up to several tens of pub concentration. $CHBr_2Cl$ and $C_2C1_4$ were detected from a few samples among the 10 of river samples. CHCl3, however, was detected In 4 sea water samples with the highest of 10 ppd among the pouuted 6 positions. Trace level of $CHBr_2Cl$ and few pub level of $CHBr_3$ were also detected at the other two sample stations. Most of the 13 rain water samples collected from 6 sampling stations were contained ppd level of $CHCl_3$, and also $CHBr_2Cl$, and C_2Cl_4$ were only detected at trace level at a few rain samples among them. We could recognize the fact that our Ut and water enoronment has already been contaminated by certain volatile halogenated organic compounds through this study.

• Korean Chemical Engineering Research
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• 제45권6호
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• pp.611-618
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• 2007

아민기로 코팅된 단분산 폴리스티렌 입자를 제조한 뒤 톨루엔-물로 구성된 유중수 액적(oil-in-water emulsion) 내부에서 입자를 자기 조립(self-assembly)시켜 다양한 다면체(polyhedra) 구조의 콜로이드 클러스터(colloidal cluster)를 제조하였다. 콜로이드 클러스터의 표면에서 솔-젤(sol-gel) 반응을 유발한 뒤 표면이 실리카로 코팅된 복합(composite) 콜로이드 클러스터를 제조할 수 있었고 이를 주형(template)으로 활용하여 고온 소성에 의해 내부의 폴리스티렌 입자를 제거하고 마이크로미터 크기의 다양한 구조의 비구형상 공동 입자(hollow particle)를 제조하였다. 밀도구배원심분리법 (density gradient centrifugation)에 의해 폴리스티렌 구성 입자의 수와 구조가 균일한 콜로이드 클러스터를 제조할 수 있었으며 표면 솔-젤 반응에 의해 비구형상 구조의 공동 입자를 제조하였다.

• 청정기술
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• 제13권4호
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• pp.293-299
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• 2007

막-전극 접합체(membrane electrode assembly, MEA)의 설계인자 즉, 구성요소들이 직접 메탄올 연료전지의 성능에 미치는 영향을 알아보았다. MEA에서의 촉매층과 고분자 분리막의 계면저항을 줄이기 위하여 직접 코팅법을 사용하여 제조한 MEA 구조와 조성의 최적화를 실시하였으며, 기체 확산층, 촉매량, 고분자 전해질 분리막의 두께가 직접메탄을 연료전지의 성능에 미치는 영향을 알아보고, 전기화학적 분석법을 사용하여 성능향상 요인을 분석하였다. 본 연구를 통해 직접코팅법으로 제조한 MEA의 구조와 조성에 따른 성능변화 특성을 파악할 수 있었으며, 연료극과 공기극에 총 $4\;m/cm^2$ (Pt 기준)의 촉매를 사용하였을 때, $80^{\circ}C$ 1기압의 운전 조건하에서는 최고성능 $147\;mW/cm^2$, $60^{\circ}C$, 1기압의 운전 조건하에서는 최고성능 $100\;mW/cm^2$을 확보하였다.

• Animal cells and systems
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• 제1권2호
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• pp.317-321
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• 1997

Tau protein is one of the microtubule-associated proteins in the mammalian brain. In Alzheimer's disease, tau protein is immobilized in the somatodendritic compartment of certain nerve cells, where it forms a part of the paired helical filament (PHF). To understand the role of tau protein in the formation of PHF, a recombinant human tau protein expressed in Escherichia coli and five synthetic peptide fragments (peptide 1 to peptide 5), corresponding to the C-terminal region of tau protein, were prepared and their ability in self-assembly to form filamentous structures was examined. The recombinant human tau protein formed short rod-like structures in 0.1M MES buffer containing 1 mM $MgCI_2$, while a synthetic peptide fragment 1 containing 55 amino acid residues could assemble into a lot of long filamentous structures in water and particularly twisted helical structures in 0.1M MES buffer containing 1 mM $MgCI_2$. This suggests that the C-terminal region possesses a filament-forming ability and may be related to the formation of the helical structure by providing a powerful filament-forming driving force.

• 대한기계학회논문집A
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• 제21권9호
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• pp.1432-1440
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• 1997

The flexibility as well as the stiffness is required to perform mechanical function of a structure such as compliant mechanisms, which can be applied to MEMS(Micro-Electro-Mechanical Systems), flexible manufacturing devices, and design for no assembly. In this paper, the optimal design problem to achieve both structural flexibility and stiffness is formulated using multi-objective function, and the optimization problem is resolved by using Finite Element Method(FEM) and Sequential Linear Programming(SLP). Design examples of compliant mechanisms are presented to validate the design method.

• 마이크로전자및패키징학회지
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• 제18권3호
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• pp.53-57
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• 2011

In the modern packaging technologies highly condensed metal interconnects are typically formed by highcost processes. These methods inevitably require the precise controls of mutually dependant process parameters, which usually cause the difficulty of the change in the layout design for interconnects of chip to-chip, or chip-to-substrate. In order to overcome these problems, the unique concept and methodology of self-assembly even in micro-meter scale were developed. In this report we focus on the factors which influenced the self-formed bumps by analyzing the phenomenon experimentally. In case of RMA flux, homogenous pattern was obtained in both plain surface and cross-section surface observation. By using RA flux, the phenomena were accelerated although the self-formtion results was inhomogenous. With ussage of moderate RA flux, reaction rate of the self-formation was accelerated with homogeneous pattern.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2003년도 추계학술대회논문집
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• pp.207-210
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• 2003

The purpose of this work is to find an appropriate welding approach for rotor assembly of a marine turbocharger. The friction welding and laser welding of dissimilar materials, IN713LC and SCM440 were investigated. The quality of the welded joints obtained from two welding processes was evaluated by microstructure observation, micro-hardness and tensile tests. The friction welded joint indicated a good bonding structure in the weld interface. On the other hand, the laser welded joint showed the weld defects and non-welded area in the weld interface.

• 대한기계학회논문집
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• 제12권2호
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• pp.389-396
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• 1988

본 연구에서는 위의 세가지 보간 알고리즘 가운데서 가장 속도의 균일성이 좋은 DDA방식을 채택하였다. 그리고 윤곽제어에서 가공경로는 대개 직선과 원호 구간의 조합으로 구성되어질 수 있기 때문에, 본 연구에서는 직선 및 원호보간만 고려하기로 한다.

• Journal of Welding and Joining
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• 제21권4호
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• pp.25-30
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• 2003

There have been many researches for small scale packages such as CSP, BGA, and Flipchip. Underfill encapsulant technology is one of the latest assembly technologies. The underfill encapsulant could enhance the reliability of the packages by flowing into the gap between die and substrate. In this paper, the effects of underfill packages by both aspects of thermal and mechanical reliabilities are studied. Especially, it is focused to value board-level reliability whether by the underfill is applied or not. First of all, The predicted thermal fatigue lifes of underfilled and no underfilled $\mu$ BGA solder joints are performed by Coffin-Manson's equation and FEA program, ANSYS(version 5.62). Also, the thermal fatigue lifes of $\mu$ BGA solder joints are experimented by thermal cycle test during the temperature, 218K to 423k. Consequently, both experimental and numerical study show that $\mu$ BGA with underfill has over ten times better fatigue lift than $\mu$ BGA without underfill.