• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.34 no.4
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• pp.262-268
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• 2021

For the past several decades, various next-generation patterning methods have been developed to obtain well-designed nano-to-micro structures, such as imprint lithography, nanotransfer printing (nTP), directed self-assembly (DSA), E-beam lithography, and so on. Especially, nTP process has much attention due to its low processing cost, short processing time, and good compatibility with other patterning techniques in achieving the formation of high-resolution functional patterns. To transfer functional patterns onto desirable substrates, the use of soft materials is required for precise replication of master mold. Here, we introduce a simple and practical nTP method to create highly ordered structures using various polymeric replica materials. We found that polymethyl methacrylate (PMMA), polystyrene (PS), and polyvinylpyridine (PVP) are possible candidates for replica materials for reliable duplication of Si master mold based on systematic analysis of pattern visualization. Furthermore, we successfully obtained well-defined metal and oxide nanostructures with functionality on target substrates by using replica patterns, through deposition and transfer process. We expect that the several candidates of replica materials can be exploited for effective nanofabrication of complex electronic devices.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1507-1510
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• 2005

This study was carried out as a part of the research on the development of a maskless and electroless process for fabricating metal micro/nanostructures by using a nanoindenter and an electroless deposition technique. $2-\mu{m}-deep$ indentation tests on Ni and Cu samples were performed. The elastic recovery of the Ni and Cu was 9.30% and 9.53% of the maximum penetration depth, respectively. The hardness and the elastic modulus were 1.56 GPa and 120 GPa for Ni and 1.49 GPa and 100 GPa for Cu. The effect of single-point diamond machining conditions such as the Berkovich tip orientation (0, 45, and $90^{\circ}$) and the normal load (0.1, 0.3, 0.5, 1, 3, and 5 mN), on both the deformation behavior and the morphology of cutting traces (such as width and depth) was investigated by constant-load scratch tests. The tip orientation had a significant influence on the coefficient of friction, which varied from 0.52-0.66 for Ni and from 0.46-0.61 for Cu. The crisscross-pattern sample showed that the tip orientation strongly affects the surface quality of the machined area during scratching. A selective deposition of Cu at the pit-like defect on a p-type Si(111) surface was also investigated. Preferential deposition of the Cu occurred at the surface defect sites of silicon wafers, indicating that those defect sites act as active sites for the deposition reaction. The shape of the Cu-deposited area was almost the same as that of the residual stress field.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.8 s.185
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• pp.171-177
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• 2006

This study was performed as a part of the research on the development of a maskless and electroless process for fabricating metal micro/nanostructures by using a nanoindenter and an electroless deposition technique. $2-{\mu}m$-deep indentation tests on Ni and Cu samples were performed. The elastic recovery of the Ni and Cu was 9.30% and 9.53% of the maximum penetration depth, respectively. The hardness and the elastic modulus were 1.56 GPa and 120 GPa for Ni and 1.51 GPa and 104 GPa for Cu. The effect of single-point diamond machining conditions such as the Berkovich tip orientation (0, 45, and $90^{\circ}$ ) and the normal load (0.1, 0.3, 0.5, 1, 3, and 5 mN), on both the deformation behavior and the morphology of cutting traces (such as width and depth) was investigated by constant-load scratch tests. The tip orientation had a significant influence on the coefficient of friction, which varied from 0.52-0.66 for Ni and from 0.46- 0.61 for Cu. The crisscross-pattern sample showed that the tip orientation strongly affects the surface quality of the machined are a during scratching. A selective deposition of Cu at the pit-like defect on a p-type Si(111) surface was also investigated. Preferential deposition of the Cu occurred at the surface defect sites of silicon wafers, indicating that those defect sites act as active sites for the deposition reaction. The shape of the Cu-deposited area was almost the same as that of the residual stress field.

• Composites Research
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• v.26 no.6
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• pp.355-362
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• 2013

Carbon particle based nanocomposites have been studied. Nanocomposites containing CNT and graphite particles were manipulated by aligning the micro/nano-size particles with electric field. Electric field is applied to the suspension of epoxy matrix and particulate inclusions in order to align them along the direction of the electric field. Particles aligned in a uniform direction act as a fiber in a CFRP composite. The mechanical strength and physical characteristics highly depend on particles' distribution pattern and amount. In this study, the characteristics of radioactive barrier are emphasized, which has been rarely discussed in the literature. A number of sample coupons were tested to verify their performance. The procedure of manufacturing nanocomposites by means of extremely small size particle alignment is presented in sequence. Several physical and structural performances of composites containing aligned and randomly distributed particles were compared. The results show particle alignment is very effective to enhance directional strength and radioactive barrier performance.

• Journal of the Korean Vacuum Society
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• v.15 no.4
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• pp.354-359
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• 2006

Recently, the interest in lithography without photo exposure has been increased compare to the conventional photolithography in nano meter and micrometer size patterning area. We studied a self aligned dipping of Ag solution through micro contact printing (${\mu}-CP$) with octadecyltrichlorosilane (OTS) treated polydimethylsiloxane (PDMS) soft mold. The OTS monolayer on the patterned PDMS was formed by dipping it into OTS solution. We transferred the OTS monolayer from PDMS mold to the glass. The OTS monolayer changed the surface energy from hydrophilic surface to hydrophobic surface, And then we made self aligned Ag solution patterns just after dipping the substrate, using adhesion difference of Ag solution between OTS treated hydrophobic area and non-OTS treated hydrophilic area. We finally get the Ag patterns through only dip-coating after the ${\mu}-CP$ process. And we observed surface energies on the glass substrate through the contact angle measurements as time goes on.

• Journal of the Mineralogical Society of Korea
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• v.31 no.1
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• pp.47-55
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• 2018

Talc, hydrous magnesium phyllosilicate, is one of the most popular industrial minerals due to their chemical stability and adsorptivity. While micro-sized talc has long been used as a filler and coating, nano-sized talc recently is attracting attention as additives for improving the stability of nanocomposites. In this study, we produced the nano-sized talc powder by mechanical method using high energy ball mill and investigated the changes in particle size and crystallinity with increasing milling time up to 720 minutes. X-ray diffraction results show that the peak width of talc gradually as the milling proceeded, and after 720 minutes of pulverization, the talc showed an amorphous-like X-ray diffraction pattern. Lase diffraction particle size analysis presents that particle size of talc which was ${\sim}12{\mu}m$ decreased to ${\sim}0.45{\mu}m$ as the milling progressed, but no significant reduction of particle size was observed even after grinding for 120 minutes or more. BET specific surface area, however, steadily increases up to the milling time of 720 minutes, indicating that the particle size and morphology change steadily as the milling progressed. Scanning electron microscope and transmission electron microscope images shows that layered particles of about 100 to 300 nm was aggregated as micro-sized particles after pulverization for 720 minutes. As the grinding time increases, the particle size and morphology of talc continuously change, but the nano-sized talc particles form micro sized agglomerates. These results suggest that there is a critical size along the a, b axes in which the size of plates is reduced even though the grinding proceeds, and the reduction of plate thickness along the c axis leads the increase in specific surface area with further grinding. This study could enhance the understanding of the mechanism of the formation of nano-sized talc by mechanical grinding.

• Korean Chemical Engineering Research
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• v.45 no.2
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• pp.149-154
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• 2007

Nanoimprint lithography (NIL) is useful technique because of its low cost and high throughput capability for the fabrication of sub-micrometer patterns which has potential applications in micro-optics, magnetic memory devices, bio sensors, and photonic crystals. Usually, a chemical surface treatment of the stamp is needed to ensure a clean release after imprinting and to protect the expensive original master against contamination. Meanwhile, adhesion promoter between resin and substrate is also important in the nanoscale pattern. In this work, we have investigated the effect of surface treatment using silane coupling agent as release layer and adhesion promoter for UV-Nanoimprint lithography. Uniform SAM (self-assembled monolayer) could be fabricated by vapor deposition method. Vapor phase process eliminates the use of organic solvents and greatly simplifies the handling of the sample. It was also proven that 3-acryloxypropyl methyl dichlorosilane (APMDS) could strongly improve the adhesion force between resin and substrate compared with common planarization layer such as DUV-30J or oxygen plasma treatment.

• Journal of the Korean Society for Heat Treatment
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• v.17 no.3
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• pp.173-179
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• 2004

In this study, the influence of heat treatment and Ca contents on the electrochemical behavior was investigated. Mg-Ca alloys, i.e., Mg-0.22wt%Ca, Mg-0.56wt%Ca, Mg-1.31wt%Ca are prepared by ingot metallurgy. As-cast Mg-Ca alloys exhibited better electrochemical properties than pure Mg. Especially, Mg-0.22wt%Ca alloy improves its anode efficiency up to 62% and lowers the OCP up to -1.72VSCE. Microstructure and XRD patterns of Mg-Ca alloys show that additive Ca element is mainly solid-solutioned. While, the others show the microstructure and XRD pattern with large $Mg_2Ca$ at grain boundary. To assess the effect of heat treatment on the as-cast Mg-alloy, the specimens were heat treated at $200^{\circ}C$ for 2 hours under $CO_2$ gas atmosphere. Although corrosion properties of Mg-Ca alloys are somewhat deteriorated by heat treatment at $200^{\circ}C$ Mg-0.22wt%Ca alloy with uniformly distributed nano-sized $Mg_2Ca$ phase in ${\alpha}$-Mg matrix show still better corrosion properties than pure Mg specimen.

• Korean Journal of Materials Research
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• v.26 no.11
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• pp.635-643
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• 2016

Graphene has shown exceptional properties for high performance devices due to its high carrier mobility. Of particular interest is the potential use of graphene nanoribbons as field-effect transistors. Herein, we introduce a facile approach to the fabrication of graphene nanoribbon (GNR) arrays with ~200 nm width using nanoimprint lithography (NIL), which is a simple and robust method for patterning with high fidelity over a large area. To realize a 2D material-based device, we integrated the graphene nanoribbon arrays in field effect transistors (GNR-FETs) using conventional lithography and metallization on highly-doped $Si/SiO_2$ substrate. Consequently, we observed an enhancement of the performance of the GNR-transistors compared to that of the micro-ribbon graphene transistors. Besides this, using a transfer printing process on a flexible polymeric substrate, we demonstrated graphene-silicon junction structures that use CVD grown graphene as flexible electrodes for Si based transistors.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.10a
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• pp.40-43
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• 2004

Stamps for microcontact processing are fabricated by casting elastomer such as PDMS on a master with a negative of the desired pattern. After curing, the PDMS stamp is peeled away from the master and exposed to a solution of ink and then dried. Transfer of the ink from the PDMS stamp to the substrate occurs during a brief contact between stamp and substrate. Generally, negative-tone masters, which are used for making positive-tone PDMS stamps, are fabricated by using photolithographic technique. The shortcomings of photolithography are a relative high-cost process and require extensive processing time and heavy capital investment to build and maintain the fabrication facilities. The goal of this study is to fabricate a negative-tone master by using Nano-indenter based patterning technique. Various sizes of V-grooves and U-groove were fabricated by using the combination of nanoscratch and HF isotropic etching technique. An achieved negative-tone structure was used as a master in the PDMS replica molding process to fabricate a positive-tone PDMS stamp.