• Economic and Environmental Geology
• /
• v.46 no.3
• /
• pp.257-266
• /
• 2013

The geology of Sinaola state consists of Precambrian metamorphic rocks(Sonobari Complex), two Paleozoic units(lower non-differentiated metamorphic rocks and upper Carboniferous sedimentary rocks), five Mesozoic units(metavolcanic, clastic, and calcareous rocks), Cenozoic volcanic rocks, and Quaternary clastic sediments and volcanic flows. The Sinaola state is potentially rich in metallic mineral resources with lower degree of non-metallic mineral resources. They are related to a variety of geological environments and are mainly physiographically located on the Sierra Madre Occidental. Mainly known mineral deposits are of gold and silver followed by zinc, lead, copper and some iron. The state also has deposits of molybdenum, tungsten and bismuth that have been occasionally exploited. There is a reference of nickel and cobalt mineralization, but these deposits have been exploited only at a small scale.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2009.06a
• /
• pp.444-445
• /
• 2009

The metallic contact system of silicon solar cell must have several properties, such as low contact resistance, easy application and good adhesion. Ni is shown to be a suitable barrier to Cu diffusion as well as desirable contact metal to silicon. Nickel monosilicide(NiSi) has been suggested as a suitable silicide due to its lower resistivity, lower sintering temperature and lower layer stress than $TiSi_2$. Copper and Silver can be plated by electro & light-induced plating method. Light-induced plating makes use the photovoltaic effect of solar cell to deposit the metal on the front contact. The cell is immersed into the electrolytic plating bath and irradiated at the front side by light source, which leads to a current density in the front side grid. Electroless plated Ni/ Electro&light-induced plated Cu/ Light-induced plated Ag contact solar cells result in an energy conversion efficiency of 16.446 % on $0.2\sim0.6\;{\Omega}{\cdot}cm$, $20\;\times\;20\;mm^2$, CZ(Czochralski) wafer.

• Journal of the Korean Graphic Arts Communication Society
• /
• v.16 no.1
• /
• pp.55-67
• /
• 1998

The developing agent is the materials which first acts on silver grain and make it into metallic silver by reducing reaction. There are several types in developing agents, and according to Lumiere-Andresen principle, substitution product which has amino or hydroxyl group in benzen nucleus has a developing power, but all reducing substances are not in used .In the developing effect, not only the role of developing agent but also that of assistant materials are important. But In this work, we have studied effect, change by lith developing agent which require high contrast image. We made an developing experiment after having manufactured developing solution used hydroquinone and another developing agents like chlorohydroquinone, pyrocatcchol and pyrogallol as developing agent. And we added that did in addition of diethanolamine and ascorbic acid. and then we examined the possibility of use.

• Journal of the Korean Vacuum Society
• /
• v.12 no.3
• /
• pp.193-199
• /
• 2003

Ti-Cu-N and Ti-Ag-N nanocomposite films with various copper and silver contents were synthesized by arc ion plating and magnetron sputtering hybrid system. The structure and mechanical properties of these films were found to be dependant on the copper and silver concentration. The maximum hardness of Ti-Cu-N and Ti-Ag-N films showed approximately 40 ㎬ below 2 at%Me. The role of soft metallic phase in Ti-Me-N nanosturctured films containing one hard and one soft phase is also discussed.

• Journal of the Korean institute of surface engineering
• /
• v.41 no.1
• /
• pp.33-37
• /
• 2008

Polycarbonate has a high transmittance to light, low specific gravity, flexibility and cost-effectiveness that extends the application field of the polymer to bio-engineering, optics, electronic parts, etc. Moreover, electro plating of metallic film on PC could endow the parts the electromagnetic interference shielding capability. However, poor adhesion of copper on PC limited the wide usage in the industry. In this work, a composite(PC/ABS) and MmSH(Momentary mold Surface Heating) injection process were used to improve the plating characteristics; plating thickness, gloss and adhesion. Also plasma treatment and chemical treatment were employed for improving adhesion. Plating characteristics on PC/ABS were better than those on PC due to the anchoring effect of butadiene. MmSH injection process could ameliorate the gloss and coating adhesion. Also plating thickness and adhesion of PC and PC/ABS were increased by plasma treatment.

• Journal of Conservation Science
• /
• v.29 no.1
• /
• pp.69-79
• /
• 2013

This study aims at identifying the variation of physicochemical properties for galena ore in order to use it in understanding of manufacturing techniques in terms of metallurgical method and smelting or refining process for obtaining lead. The ores in the study obtained from the operating mine have been washed and pre-treated for a test. Metallic lead has been extracted by roasting process. The result displays that galena is still in present in the matt despite of exposure to high temperature, over $1000^{\circ}C$. Nearly $11.1g/cm^3$ specific gravity metallic lead has been collected from the refining test of which aim was to remove the remnant galena and a trace of concentrated silver has been identified at the grain boundary. The result suggests that at least one refining process was essential to acquire high purity metallic lead and cupellation had been executed to remove remnant silver.

• Clean Technology
• /
• v.21 no.2
• /
• pp.85-89
• /
• 2015

Utilized in a variety of electronic components, electronic components industry with metallic ink technology was established itself as a major technology research and development was gradually increasing, silver ink that is excellent in conductivity and stability, have long been used in the industry of electronic components in recent years and silver ink has been the size of nanoscale particles dispersed by developing display, an electronic tag, a flexible circuit board or the like used in the semiconductor and electronics as has been highlighted in, however industry modernization of equipment by increasing the production and consumption of products generated during the production process and environmental pollutants by use of waste products is expected to bring a serious environmental problem. In this study, prepared by a wet reduction method, the manufacturing process of the silver nano-ink to the entire process of the environmental impact assessment (LCA) was evaluated using the techniques. Life cycle assessment software GaBi 6 was used as received from the relevant agencies of the silver nano-ink data with reference to the manufacturing process, building inventory was international organization for standardization (ISO) 14040, 14044 compliant LCA conducted over four stages.

• The korean journal of orthodontics
• /
• v.47 no.1
• /
• pp.3-10
• /
• 2017

Objective: Microbial aggregation around dental implants can lead to loss/loosening of the implants. This study was aimed at surface treating titanium microimplants with silver nanoparticles (AgNPs) to achieve antibacterial properties. Methods: AgNP-modified titanium microimplants (Ti-nAg) were prepared using two methods. The first method involved coating the microimplants with regular AgNPs (Ti-AgNP) and the second involved coating them with a AgNP-coated biopolymer (Ti-BP-AgNP). The topologies, microstructures, and chemical compositions of the surfaces of the Ti-nAg were characterized by scanning electron microscopy (SEM) equipped with energy-dispersive spectrometer (EDS) and X-ray photoelectron spectroscopy (XPS). Disk diffusion tests using Streptococcus mutans, Streptococcus sanguinis, and Aggregatibacter actinomycetemcomitans were performed to test the antibacterial activity of the Ti-nAg microimplants. Results: SEM revealed that only a meager amount of AgNPs was sparsely deposited on the Ti-AgNP surface with the first method, while a layer of AgNP-coated biopolymer extended along the Ti-BP-AgNP surface in the second method. The diameters of the coated nanoparticles were in the range of 10 to 30 nm. EDS revealed 1.05 atomic % of Ag on the surface of the Ti-AgNP and an astounding 21.2 atomic % on the surface of the Ti-BP-AgNP. XPS confirmed the metallic state of silver on the Ti-BP-AgNP surface. After 24 hours of incubation, clear zones of inhibition were seen around the Ti-BP-AgNP microimplants in all three test bacterial culture plates, whereas no antibacterial effect was observed with the Ti-AgNP microimplants. Conclusions: Titanium microimplants modified with Ti-BP-AgNP exhibit excellent antibacterial properties, making them a promising implantable biomaterial.

• Journal of the Microelectronics and Packaging Society
• /
• v.20 no.4
• /
• pp.47-52
• /
• 2013

Gold wire has long been used as a proven method of connecting a silicon die to a substrate in wide variety of package types, delivering high yield and productivity. However, with the high price of gold, the semiconductor packaging industry has been implementing an alternate wire material. These materials may include silver (Ag) or copper (Cu) alloys as an alternative to save material cost and maintain electrical performance. This paper will analyze and compare the electrical characteristics of several wire types. For the study, typical 0.6 mil, 0.8 mil and 1.0 mil diameter wires were selected from various alloy types (2N gold, Palladium (Pd) coated/doped copper, 88% and 96% silver) as well as respective pure metallic wires for comparison. Each wire model was validated by comparing it to electromagnetic simulation results and measurement data. Measurements from the implemented test boards were done using a vector network analyzer (VNA) and probe station setup. The test board layout consisted of three parts: 1. Analysis of the diameter, length and material characteristic of each wire; 2. Comparison between a microstrip line and the wire to microstrip line transition; and 3. Analysis of the wire's cross-talk. These areas will be discussed in detail along with all the extracted results from each type the wire.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2001.07a
• /
• pp.104-109
• /
• 2001

A 355 nm (3.5 eV) neodymium:yttrium aluminum gamet laser, produced by a harmonic generator, was used to create silver metallic particles as seeds for nucleation in photosensitive glass containing Ag+ and Ce3+ ions. The pulse width and frequency of the laser were 8 ns and 10 Hz, respectively. Heat treatment was conducted at 570 C for 1 h, following laser irradiation, to produce crystalline growth, after which a LiAlSi3O8 crystal phase appeared in the laser-irradiated Li2O A1203 SiO2 glass. For the Present study, we compared the effect of laser-induced crystallization on glass crystallization with that of spontaneous crystallization by heat treatment.