• 제목/요약/키워드: Metallic interconnects

검색결과 16건 처리시간 0.131초

고체산화물 연료전지 금속연결재용 STS 444의 코발트 보호막 산화 특성 (Oxidation Properties of Cobalt Protective Coatings on STS 444 of Metallic Interconnects for Solid Oxide Fuel Cells)

  • 홍종은;임탁형;이승복;유영성;송락현;신동열;이덕열
    • 한국수소및신에너지학회논문집
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    • 제20권6호
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    • pp.455-463
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    • 2009
  • 코발트 보호막 코팅이 적용된 페라이트계 스테인리스 스틸인 STS 430과 STS 444 소재에 대해 고체산화물 연료전지용 금속연결재로서의 고온 산화 특성에 대해 살펴보았다. 코발트 코팅층은 $800^{\circ}C$ 고온 산화 후 코발트 산화물 및 $Co_2CrO_4$, $CoCr_2O_4$, $CoCrFeO_4$ 등과 같은 코발트가 함유된 스피넬 상을 형성하였다. 또한 페라이트계 스테인리스 스틸과 코발트 코팅의 계면에서 크롬과 철이 함유된 치밀한 산화층을 형성하여 금속연결재 표면의 스케일 성장속도를 감소시키고 금속연결재 내에 함유된 크롬의 외부 확산을 효과적으로 억제하였다. 한편 STS 430은 고온 산화 후 표면에 형성된 스케일 하부에 $SiO_2$와 같은 내부 산화물이 형성된 반면 STS 444는 표면 스케일 이외에 다른 내부 산화물은 확인되지 않았으며 고온에서의 면저항 측정 결과, 코발트가 코팅된 STS 444의 전기 전도성이 STS 430 보다 우수한 것으로 나타났다.

Ag 집전체를 적용한 평판형 SOFC 단전지 (Single Cell Stacked Planar Type SOFC Assembled Using a Ag-Current Collector)

  • 조남웅;황순철;이인성
    • 한국세라믹학회지
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    • 제44권12호
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    • pp.720-726
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    • 2007
  • Current collectors of SOFC play a significant role on the performance of power generation. In this study a single cell stacked SOFC was assembled using Ag-mesh as a cathode current collector, and evaluated its performance. No gas leakages of the single cell stack occurred in the tests of gas detection and OCV measurement. The OCV and initial power of the stack were 1.09V and $0.45W/cm^2$, respectively, under the flow rates of air at 2,500 cc/min and $H_2$ at 1,000 cc/min at the test temperature of $750^{\circ}C$. A degradation rate of 44.0% was measured during the prolonged time of 307 h. The relatively low durability of the tested single cell stack was found to be the evaporation of Ag-mesh at the current corrector.

Build and Performance Test of a 3-cell Solid Oxide Fuel Cell Stack

  • Cho, Nam-Ung;Hwang, Soon-Cheol;Han, Sang-Moo;Yang, Choong-Jin
    • 한국세라믹학회지
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    • 제44권8호
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    • pp.407-411
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    • 2007
  • A 3-cell stacked anode-supported solid oxide fuel cell was designed and fabricated to achieve a complete gas seal and the facile stacking of components. The stack was assembled with a unit cell with $10{\times}10cm^2$ area, and each cell was interconnected by a stainless steel 430 separator using a proprietary sealant sheet. The stack performance was examined at various gas flow rates of $H_2+3.5vol%\;H_2O$, and air at a fixed temperature of $800^{\circ}C$. No gas leakage was found from the sealing between cells and inter-connects within a measurement system in this research during a prolonged time of 500 h in operation. The test resulted in an open circuit voltage of 3.12 V, a peak power of 149 W, and a power density of $0.61W/cm^2$, while the long term durability of the power showed 19.1% degradation during the prolonged time of 500 h when tested at $800^{\circ}C$.

레이저 국소증착을 이용한 TFT-LCD회로 수정5 미세 텅스텐 패턴 제조 (Laser-induced chemical vapor deposition of tungsten micro patterns for TFT-LCD circuit repair)

  • 박종복;김창재;박상혁;신평은;강형식;정성호
    • 한국정밀공학회지
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    • 제22권8호
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    • pp.165-173
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    • 2005
  • This paper presents the results for deposition of micrometer-scale metal lines on glass for the development of TFT-LCD circuit repair-system. Although there had been a few studies in the late 1980's for the deposition of metallic interconnects by laser-induced chemical vapor deposition, those studies mostly used continuous wave lasers. In this work, a third harmonic Nd:YLF laser (351nm) of high repetition rates, up to 10 KHz, was used as the illumination source and W(CO)s was selected as the precursor. General characteristics of the metal deposit (tungsten) such as height, width, morphology as well as electrical properties were examined for various process conditions. Height of the deposited tungsten lines ranged from 35 to 500 m depending on laser power and scan speed while the width was controlled between 50um using a slit placed in the beam path. The resistivity of the deposited tungsten lines was measured to be below $1{\Omega}{\cdotu}um$, which is an acceptable value according to the manufacturing standard. The tungsten lines produced at high scan speed had good surface morphology with little particles around the patterns. Experimental results demonstrated that it is likely that the deposit forms through a hybrid process, namely through the combination of photolytic and pyrolytic mechanisms.

Development of kW Class SOFC Systems for Combined Heat and Power Units at KEPRI

  • Lee, Tae-Hee;Choi, Jin-Hyeok;Park, Tae-Sung;Yoo, Keun-Bae;Yoo, Young-Sung
    • 한국세라믹학회지
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    • 제45권12호
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    • pp.772-776
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    • 2008
  • The Korea Electric Power Research Institute (KEPRI) has been developing planar solid oxide fuel cells (SOFCs) and power systems for combined heat and power (CHP) units. The R&D work includes solid oxide fuel cell (SOFC) materials investigation, design and fabrication of single cells and stacks, and kW class SOFC CHP system development. Anode supported cells composed of Ni-YSZ/FL/YSZ/LSCF were enlarged up to $15{\times}15\;cm^2$ and stacks were manufactured using $10{\times}10\;cm^2$ cells and metallic interconnects such as ferritic stainless steel. The first-generation system had a 37-cell stack and an autothermal reformer for use with city gas. The system showed maximum stack power of about $1.3\;kW_{e,DC}$ and was able to recover heat of $0.57{\sim}1.2\;kW_{th}$ depending on loaded current by making hot water. The second-generation system was composed of an improved 48-cell stack and a prereformer (or steam reformer). The thermal management subsystem design including heat exchangers and insulators was also improved. The second-generation system was successfully operated without any external heat source. Under self-sustainable operation conditions, the stack power was about $1.3\;kW_{e,DC}$ with hydrogen and $1.2\;kW_{e,DC}$ with city. The system also recuperated heat of about $1.1\;kW_{th}$ by making hot water. Recently KEPRI manufactured a 2kW class SOFC stack and a system by scaling up the second-generation 1kW system and will develop a 5kW class CHP system by 2010.

전해액 조성이 전기도금으로 제작된 구리박막의 특성에 미치는 영향 (Effect of electrolyte composition on Cu thin film by electroplating)

  • 송유진;서정혜;이연승;염기수;류영호;홍기민
    • 한국정보통신학회:학술대회논문집
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    • 한국해양정보통신학회 2008년도 추계종합학술대회 B
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    • pp.95-99
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    • 2008
  • 반도체 소자의 소형화에 따라 낮은 비저항을 가진 구리가 ULSI의 금속배선으로 사용되고 있다. 구리선의 비저항은 RC delay와 집적회로의 신호전달에 영향을 미치게 된다. 본 논문에서는 전기도금 된 구리박막의 비저항에 대해 전해액이 미치는 영향을 조사하였다. 4탐침 표면저항측정기로 비저항을 평가하였고, XRD (X-ray Diffraction), AFM (Atomic Force Microscope), FE-SEM (Field Emission Scanning Electron Microscope), XPS (X-ray Photoelectron Spectroscopy)로 박막의 특성을 조사하였다. 실험한 결과, 전해액의 조건이 전기도금으로 증착된 낮은 비저항을 갖는 구리박막의 형성에 있어 중요한 역할을 하는 것을 확인하였다.

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