• 한국세라믹학회지
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• 제51권4호
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• pp.231-242
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• 2014

An interconnect in solid oxide fuel cells (SOFCs) electrically connects unit cells and separates fuel from oxidant in the adjoining cells. The interconnects can be divided broadly into two categories - ceramic and metallic interconnects. A thin and gastight ceramic layer is deposited onto a porous support, and metallic interconnects are coated with conductive ceramics to improve their surface stability. This paper provides a short review on ceramic materials for SOFC interconnects. After a brief discussion of the key requirements for interconnects, the article describes basic aspects of chromites and titanates with a perovskite structure for ceramic interconnects, followed by the introduction of dual-layer interconnects. Then, the paper presents protective coatings based on spinel-or perovskite-type oxides on metallic interconnects, which are capable of mitigating oxide scale growth and inhibiting Cr evaporation.

• 한국세라믹학회지
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• 제52권5호
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• pp.344-349
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• 2015

An interconnect is the key component of solid oxide fuel cells that electrically connects unit cells and separates fuel from oxidant in the adjoining cells. To improve their surface stability in high-temperature oxidizing environments, metallic interconnects are usually coated with conductive oxides. In this study, lanthanum nickelates ($LaNiO_3$) with a perovskite structure are synthesized and applied as protective coatings on a metallic interconnect (Crofer 22 APU). The partial substitution of Co, Cu, and Fe for Ni improves electrical conductivity as well as thermal expansion match with the Crofer interconnect. The protective perovskite layers are fabricated on the interconnects by a slurry coating process combined with optimized heat-treatment. The perovskite-coated interconnects show area-specific resistances as low as $16.5-37.5m{\Omega}{\cdot}cm^2$ at $800^{\circ}C$.

• 신재생에너지
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• 제3권3호
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• pp.5-13
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• 2007

Stacks of solid oxide fuel cell with 1kW max power performance were designed on planar type employing anode-supported cells and metallic interconnects. The stacks composed of 3-cells, 8-cells, and 16-cells were fabricated and tested in serials by using anode-supported cells purchased from Indec, and sealants/interconnects prepared at RIST. In the performance test of the final 16-cells stack, OCV was recorded to be 16.7V. The peak power and the power density showed 1 kW, $0.77W/cm^2$ at $820^{\circ}C$, respectively. In addition, the long-term degradation rate of the power exhibited 2.25 % during 500h at $750^{\circ}C$.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1998년도 하계학술대회 논문집 D
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• pp.1303-1305
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• 1998

In order to reduce or avoid oxidation problem at operation the interconnects in SOFCs have so far mostly been made of ceramic material. It has high chemical stability both under cathode and anode condition, relatively thermal expansion coefficient that matchs that of electrolyte material YSZ. But this material shown rather weak in the low oxygen atmosphere and thermal shock, and it has lower mechanical strength than alloys. To avoid these problems one may consider to use metals or alloys as materials for interconnects. Metallic interconnects are advantageous because of their high thermal and electronic conductivities. But it has some problems, Those are high thermal expansion and oxidation at high temperature in air. To solve these problems in the interconnection material in this study, $LaCrO_3$-dispersed Cr alloys for metallic interconnector of SOFC have been investigated as a fuction of $LaCrO_3$ content in the range of 5 to 25 vol.%. The Cr alloy were prepared by mixing Cr and $LaCrO_3$ powders in high-energy ball mill for 48h and by sintering under Ar atmosphere with 5vol.% $H_2$ for 10h at $1500^{\circ}C$. The alloys had a relative density of 95% and above. The Cr alloys in composed of two kind of small $LaCrO_3$ and large Cr particles. As the $LaCrO_3$ content increased, the Cr particle size decreased but the $LaCrO_3$ particle size remained contant. Also the oxidation tests show that the $LaCrO_3$-dispersed Cr is very resistant to oxidation in air. These results means that $LaCrO_3$-dispersed Cr is a useful material for metallic interconnect of planar SOFC.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2007년도 춘계학술대회
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• pp.121-124
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• 2007

Stacks of solid oxide fuel cell under 1kW max power were designed on planar type employing anode supported cell and metallic interconnects. The stacks composed of 3-cells, 8-cells, and 16-cells were fabricated by using single cell purchased from Indec, sealant and interconnect prepared at RIST. In performance test of the final 16-cells stacks, OCV was recorded to be 16.7 V. Peak power and power density were 1 kW, 0.77 $W/cm^{2}$ at $820^{\circ}C$, respectively. In addition, the long term degradation rate of the power exhibited 2.25 % in 500 h at $750^{\circ}C$.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.657-662
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• 2005

In this study, the deposition of micrometer-scale metallic interconnects on LCD glass for the repair of open-circuit type defects is investigated. Although there had been a few studies Since 1980 s for the deposition of metallic interconnects by laser-induced chemical vapor deposition, those studies mostly used continuous wave lasers. In this work, a third harmonic Nd:YLF laser (351nm) of high repetition rates, up to 10 KHz, was used as the illumination source and $W(CO)_6$ was selected as the precursor. General characteristics of the metal deposit (tungsten) such as height, width, morphology as well as electrical properties were examined for various process conditions. Height of the deposited tungsten lines ranged from 35 to 500 nm depending on laser power and scan speed while the width was controlled between $3\~50{\mu}$ using a slit placed in the beam path. The resistivity of the deposited tungsten lines was measured to be below 1 $O\cdot{\mu}m$, which is an acceptable value according to the manufacturing standard. The tungsten lines produced at high scan speed had good surface morphology with little particles around the patterns. Experimental results demonstrated that it is likely that the deposit forms through a hybrid process, namely through the combination of photolytic and pyrolytic mechanisms.

• Korean Chemical Engineering Research
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• 제48권2호
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• pp.172-177
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• 2010

본 논문에서는 SOFC 금속연결재로서 Crofer22APU를 적용하고자 표면에 전도성 산화막($La_{0.8}Sr_{0.2}CoO_3$)을 습식코팅 후, SOFC 작동환경에서 산화거동, 전기적 특성변화 및 미세구조 변화를 관찰하였다. 코팅 전 샌드블러스트 장치를 이용한 Crofer22APU 표면처리를 통하여 코팅막/금속의 접합특성을 개선시킬 수 있었으며, 320 mesh의 입자크기를 갖는 알루미나 분말을 이용하여 표면처리한 경우 접착특성이 극대화되었다.$La_{0.8}Sr_{0.2}CoO_3$ 코팅된 시편의 전기적 특성 평가는 4-wire 법을 이용하여 SOFC 작동환경에서 약 4,000 시간 장기성능 평가하였으며 $12mW{\cdot}cm^2$의 낮은 면저항값을 얻을 수 있었다. 실험종료 후 미세구조 분석결과에서도 전도성 산화막($La_{0.8}Sr_{0.2}CoO_3$) 코팅이 금속의 부식으로 인한 산화층의 생성속도를 늦추고 이로 인한 금속의 전기적 특성이 감소하는 것을 방지하는데 유효함을 확인하였다.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2011년도 추계학술발표대회
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• pp.9-9
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• 2011

The transfer of nano-science accomplishments into technology is severely hindered by a lack of understanding of barriers to nanoscale manufacturing. The NSF Center for High-rate Nanomanufacturing (CHN) is developing tools and processes to conduct fast massive directed assembly of nanoscale elements by controlling the forces required to assemble, detach, and transfer nanoelements at high rates and over large areas. The center has developed templates with nanofeatures to direct the assembly of carbon nanotubes and nanoparticles (down to 10 nm) into nanoscale trenches in a short time (in seconds) and over a large area (measured in inches). The center has demonstrated that nanotemplates can be used to pattern conducting polymers and that the patterned polymer can be transferred onto a second polymer substrate. Recently, a fast and highly scalable process for fabricating interconnects from CMOS and other types of interconnects has been developed using metallic nanoparticles. The particles are precisely assembled into the vias from the suspension and then fused in a room temperature process creating nanoscale interconnect. The center has many applications where the technology has been demonstrated. For example, the nonvolatile memory switches using (SWNTs) or molecules assembled on a wafer level. A new biosensor chip (0.02 $mm^2$) capable of detecting multiple biomarkers simultaneously and can be in vitro and in vivo with a detection limit that's 200 times lower than current technology. The center has developed the fundamental science and engineering platform necessary to manufacture a wide array of applications ranging from electronics, energy, and materials to biotechnology.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2010년도 춘계학술발표대회
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• pp.48.1-48.1
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• 2010

Cu has been used for metallic interconnects in ULSI applications because of its lower resistivity according to the scaling down of semiconductor devices. The resistivity of Cu lines will affect the RC delay and will limit signal propagation in integrated circuits. In this study, we investigated the characteristics of electroplated Cu films according to the variation of concentration of organic additives. The plating electrolyte composed of $CuSO_4{\cdot}5H_2O$, $H_2SO_4$ and HCl, was fixed. The sheet resistance was measured with a four-point probe and the material properties were investigated with XRD (X-ray Diffraction), AFM (Atomic Force Microscope), FE-SEM (Field Emission Scanning Electron Microscope) and XPS (X-ray Photoelectron Spectroscopy). From these experimental results, we found that the organic additives play an important role in formation of Cu film with lower resistivity by EPD.

• Current Optics and Photonics
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• 제5권2호
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• pp.134-140
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• 2021

In this paper, I introduce a novel design method of a high performance nanophotonic beam deflector providing broadband operation, large active tunability, and signal efficiency, simultaneously. By combining thermo-optically tunable vanadium dioxide nano-ridges and a metallic mirror, reconfigurable local optical phase of reflected diffraction beams can be engineered in a desired manner over broad bandwidth. The active metagrating deflectors are systematically designed for tunable deflection of reflection beams according to the thermal phase-change of vanadium dioxide nano-ridges. Moreover, by multiplexing the phase-change supercells, a robust design of actively tunable beam splitter is also verified numerically. It is expected that the proposed intuitive and simple design method would contribute to development of next-generation optical interconnects and spatial light modulators with high performances. The author also envisions that this study would be fruitful for modern holographic displays and three-dimensional depth sensing technologies.