• Title/Summary/Keyword: Metal wire

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Development of Automatic Filling Process for Rapid Manufacturing by High-speed Machining Process (고속가공에 의한 쾌속제작용 자동충진 공정개발)

  • 신보성;양동열;최두선;이응숙;제태진;김기돈;이종현;황경현
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2001.04a
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    • pp.28-31
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    • 2001
  • Recently, in order to satisfy the consumer's demand the life cycle and the lead-time of a product is to be shortened. It is thus important to reduce the time and cost in manufacturing trial products. Several techniques have been developed and successfully commercialized in the market RPM(Rapid Prototyping and Manufacturing). However, most commercial systems currently use resins or waxes as the raw materials. So, the limited mechanical strength for functional testing is regarded as an obstacle towards broader application of rapid prototyping techniques. To overcome this problems, high-speed machining technology is being investigated worldwide for rapid manufacturing and even for direct rapid tooling application. In this paper, some fundamental experiments and analyses are carried out to obtain the filling time, materials, method, and process parameters for HisRP process. HisRP is a combination process using high-speed machining technology with automatic filling. In filling process, Bi58-Sn alloy is chosen because of the properties of los-melting point, low coefficient of thermal expansion and enviromental friendship. Also the use of filling wire is of advantage in term of simple and flexible mechanism. Then the rapid manufacturing product, for example a skull, is machined for aluminum material by HisRP process with an automatic set-up device of 4-faces machining.

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A Survey on the Contents of Fluoride, Calcium, and Magnesium of Reservoir Water on a Stream in the Jeon-buk Area of Korea (전북 지역 일부 수원지의 물에서 불소, 칼슘 및 마그네슘 함량에 관한 조사 연구)

  • 이인규;김종규
    • Journal of Environmental Health Sciences
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    • v.29 no.2
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    • pp.38-44
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    • 2003
  • This study was performed to investigate the levels of fluoride (F), calcium (Ca), and magnesium (Mg) in water samples taken from five reservoirs or direct sources on a stream used for agricultural or domestic water in the Iksan and Wanjoo areas, Jeon-buk, Korea, and to find a possible link between Ca or Mg and fluoride in water sources in theses areas. The samples were collected by the recommendation methods of the World Health Organization and analyzed by the recommendations of the Japanese Standard Methods. Statistical analyses were performed by the analysis of variance and correlation analysis. The F levels in water samples wire 0.80~2.53 ppm. In four sampling sites the water fluoride levels exceeded 1 ppm. which if the recommended level for fluorosis/caries control. The Ca levels in water samples were 6.82~12.98 ppm, and the Mg levels were 0.30~1.97 ppm, which are lower compared with the natural levels of water sources previously reported by other investigators. This study showed a positive correlation between Ca and Mg (r= 0.8779. p<0.01) and a negative correlation between F and Ca (r=-0.6974, p<0.05) and also between F and Mg (r=-0.5581) in the water samples. However, the study did not find remarkable relationships in fluoride levels between sampling sites. These results support the fact that there were epidemics of dental fluorosis in this area. The lack of significant positive correlations in fluoride levels between sampling sites suggests that there may be some pathways for the transfer of the metal to the water through other environmental media besides the water course. Long-term epidemiological studies are needed on the relationship between high F together with low Ca and Mg levels in the water, and total human health in this community. There should alto be a long-term monitoring of the water quality in this area.

High-accuracy and High-speed Groove Die Set (고정도.고속 Groove Die Set)

  • Kim, Gun-Hoi
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.17 no.1
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    • pp.7-15
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    • 2008
  • Currently existing high-accuracy and high-speed die sets used in reciprocal press create scratches at the surface of guide posts, steel balls, and bushes due to vertical movement of balls with point-contacts between inner surface of bushes and guide posts. Consequently, accuracy of the die set and the life span of the metal mold are reduced. However, those scratches could reduce the pre-load of the steel ball. This research designed and developed a groove-type die set which improves life span of the die set by eliminating point-contacts of steel balls with guide posts. The guide post consisted of a steel-ball retainer, a steel-ball retainer stopper, a guide bush, a guide pin, a snap ring, and a spring. The steel-ball retainer has 72 holes with 8 columns of 9 holes in each column. The inner surface of the guide bush was grinded(surface roughness: $Ra\;\\;0.2{\mu}m$, accuracy: $0\;{\sim}\;-0.002mm$) after NC turning and heat treatment. Also, a line of small intermediate pocket was processed inside of the guide bush for lubrication and elimination of foreign materials. Guide grooves of steel balls were processed using a wire EDM(Electrical Discharge Machining) after heat treatment. With such a design of the guide post stated above, loads against steel balls could be dispersed greatly by the line contacts through the guide groove between the guide post and the guide bush, and the life span of the guide post could be expanded semi-permanently.

A 3 dB Coupler for Double Sided Printed Circuit Boards (이층 기판용 3 dB 커플러)

  • Lee, Dong-Ho
    • Journal of IKEEE
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    • v.18 no.4
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    • pp.559-565
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    • 2014
  • A 3 dB coupler has been designed and implemented using the most commonly used double-sided FR4 boards. The coupling and the bandwidth of the coupler are enhanced with the enlarged overlapped area of the coupler. Major design parameters are plotted as a design guide and the parameters are verified by simulation and measurement. The size of the manufactured coupler is $30{\times}14mm^2$. Its measured insertion loss and phase difference are 0.6 dB and $90.5^{\circ}$ at center frequency of 2.5 GHz, respectively. The operating frequency range is 1.72 GHz to 3.08 GHz for $3.6{\pm}0.5dB$ insertion loss. The coupler has the performance similar to that of conventional Lange coupler, and implementation of the coupler is easy and cheap with wide metal width and spacing and no additional wire bonding process.

Development of a 2.14-GHz High Efficiency Class-F Power Amplifier (2.14-GHz 대역 고효율 Class-F 전력 증폭기 개발)

  • Kim, Jung-Joon;Moon, Jung-Hwan;Kim, Jang-Heon;Kim, Il-Du;Jun, Myoung-Su;Kim, Bum-Man
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.18 no.8
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    • pp.873-879
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    • 2007
  • We have implemented a highly efficient 2.14-GHz class-F amplifier using Freescale 4-W peak envelope power(PEP) RF Si lateral diffusion metal-oxide-semiconductor field effect transistor(LDMOSFET). Because the control of the all harmonic contents is very difficult, we have managed only the $2^{nd}\;and\;3^{rd}$ harmonics to obtain the high efficiency with simple harmonic control circuit. In order to design the harmonic control circuit accurately, we extracted the bonding wire inductance and drain-source capacitance which are dominant parasitic and package effect components of the device. And then, we have fabricated the class-F amplifier. The measured drain and power-added efficiency are 65.1 % and 60,3 %, respectively.

Prediction of Joining Torque for Bit Depth of Subminiature Bolt (초소형 볼트의 비트 깊이에 따른 체결 토크 예측)

  • Lee, Hyun-Kyu;Park, Keun;Ra, Seung-Woo;Kim, Jong-Bong
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.38 no.8
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    • pp.917-923
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    • 2014
  • Subminiature joining bolts are required for the electronic parts of gadgets such as mobile phones and watch phones. During the miniaturization of bolt heads, it is difficult to obtain sufficient joining force owing to the risk of shear fracture of the bolt head or severe plastic deformation on the bit region. In this study, the maximum joining torque for the bit depth was predicted using finite element analysis. A shear fracture test was conducted on a wire used in bolt forming. The results of this test were subjected to finite element analysis and a fracture criterion was obtained by comparing the experimental and analysis results. The shear fracture of the bolt head during joining was predicted based on the obtained criterion. Furthermore, the maximum joining torque was predicted for various bit depths. Fracture on the boundary between the bolt head and thread was found to occur in lower joining torque as bit depth increases.

Shape Control of Anodic Aluminum Oxide and Effect as Support of Silicon Powder Electrode (양극산화알루미늄의 형상제어와 이를 이용한 실리콘 분말 전극 지지체 효과)

  • Song, Ju-Seok;Ha, Jong-Keun;Kim, Yoo-Young;Park, Dong-Kyu;Ahn, In-Shup;Ahn, Jou-Hyeon;Cho, Kwon-Koo
    • Journal of Powder Materials
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    • v.22 no.4
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    • pp.240-246
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    • 2015
  • Anodic aluminum oxide (AAO) has been widely used for the development and fabrication of nano-powder with various morphologies such as particle, wire, rod, and tube. So far, many researchers have reported about shape control and fabrication of AAO films. However, they have reported on the shape control with different diameter and length of anodic aluminum oxide mainly. We present a combined mild-hard (or hard-mild) anodization to prepare shape-controlled AAO films. Two main parameters which are combination mild-hard (or hard-mild) anodization and run-time of voltage control are applied in this work. The voltages of mild and hard anodization are respectively 40 and 80 V. Anodization was conducted on the aluminum sheet in 0.3 mole oxalic acid at $4^{\circ}C$. AAO films with morphologies of varying interpore distance, branch-shaped pore, diameter-modulated pore and long funnel-shaped pore were fabricated. Those shapes will be able to apply to fabricate novel nano-materials with potential application which is especially a support to prevent volume expansion of inserted active materials, such as metal silicon or tin powder, in lithium ion battery. The silicon powder electrode using an AAO as a support shows outstanding cycle performance as 1003 mAh/g up to 200 cycles.

Effect of Biodegradable Polymer Coating on the Corrosion Rates and Mechanical Properties of Biliary Magnesium Alloy Stents (생분해성 고분자 코팅이 담관용 마그네슘 합금 스텐트의 분해 속도와 기계적 물성에 미치는 영향)

  • Kim, Hyun Wook;Lee, Woo-Yiel;Song, Ki Chang
    • Korean Chemical Engineering Research
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    • v.58 no.1
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    • pp.36-43
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    • 2020
  • A biliant stent was fabricated using a magnesium alloy wire, a biodegradable metal. In order to control the fast decomposition and corrosion of magnesium alloys in vivo, magnesium alloy wires were coated with biodegradable polymers such as polycaprolactone (PCL), poly(propylene carbonate) (PPC), poly (L-lactic acid) (PLLA), and poly (D, L-lactide-co-glycolide) (PLGA). In the case of PPC, which is a surface erosion polymer, there is no crack or peeling compared to other polymers (PCL, PLLA, and PLGA) that exhibit bulk erosion behavior. Also, the effect of biodegradable polymer coating on the axial force, which is the mechanical property of magnesium alloy stents, was investigated. Stents coated with most biodegradable polymers (PCL, PLLA, PLGA) increased axial forces compared to the uncoated stent, reducing the flexibility of the stent. However, the stent coated with PPC showed the axial force similar to uncoated stent, which did not reduce the flexibility. From the above results, PPC is considered to be the most efficient biodegradable polymer.

Electrochemical Characterization of Stainless Steel in Ethanolamine Solution Containing an Alkyl Group using Cyclic Voltammetry (순환전압전류법에 의한 알킬기를 함유한 에탄올아민용액에서 스테인리스의 전기화학적 특성)

  • Park, Keun-Ho
    • Journal of the Korean Applied Science and Technology
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    • v.31 no.1
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    • pp.66-73
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    • 2014
  • In this work, the current-voltage curves for stainless steel in the ethanolamine solution containing alkyl group were measured using the conventional three electrodes of cyclic voltammetry. Stainless steel as working electrode, Ag/AgCl electrode as reference electrode and Pt wire as counter electrode were used respectively. As a result, the C-V characteristics of stainless steel were to be for an irreversible process due to the oxidation current from cyclic voltammogram, using N-ethylethanolamine and N,N-dimethylethanolamine solutions. Effective diffusivity of corrosion inhibitors was decreased with increasing concentration. It was found from SEM images of the metal that the electrolyte (specific name ?)(0.5 N) as corrosion inhibitor was added into a N, N-diethylethanolamine solution ($1.0{\times}10^{-3}M$) containing copper and nickel, the corrosion inhibiting effect was enhanced.

AN INTRODUCTION TO SEMICONDUCTOR INITIATION OF ELECTROEXPLOSIVE DEVICES

  • Willis K. E.;Whang, D. S.;Chang, S. T.
    • Proceedings of the Korean Society of Propulsion Engineers Conference
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    • 1994.11a
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    • pp.21-26
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    • 1994
  • Conventional electroexplosive devices (EED) commonly use a very small metal bridgewire to ignite explosive materials i.e. pyrotechnics, primary and secondary explosives. The use of semiconductor devices to replace “hot-wire” resistance heating elements in automotive safety systems pyrotechnic devices has been under development for several years. In a typical 1 amp/1 watt electroexplosive devices, ignition takes place a few milliseconds after a current pulse of at least 25 mJ is applied to the bridgewire. In contrast, as for a SCB devices, ignition takes place in a few tens of microseconds and only require approximately one-tenth the input energy of a conventional electroexplosive devices. Typically, when SCB device is driven by a short (20 $\mu\textrm{s}$), low energy pulse (less than 5 mJ), the SCB produces a hot plasma that ignites explosive materials. The advantages and disadvantages of this technology are strongly dependent upon the particular technology selected. To date, three distinct technologies have evolved, each of which utilizes a hot, silicon plasma as the pyrotechnic initiation element. These technologies are 1.) Heavily doped silicon as the resistive heating initiation mechanism, 2.) Tungsten enhanced silicon which utilizes a chemically vapor deposited layer of tungsten as the initiation element, and 3.) a junction diode, fabricated with standard CMOS processes, which creates the initial thermal environment by avalanche breakdown of the diode. This paper describes the three technologies, discusses the advantages and disadvantages of each as they apply to electroexplosive devises, and recommends a methodology for selection of the best device for a particular system environment. The important parameters in this analysis are: All-Fire energy, All-Fire voltage, response time, ease of integration with other semiconductor devices, cost (overall system cost), and reliability. The potential for significant cost savings by integrating several safety functions into the initiator makes this technology worthy of attention by the safety system designer.

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