• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.33 no.9
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• pp.97-103
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• 2005

In this paper, effects on the heat transport limitation of heat pipe by the wick structural factors were theoretically analyzed for the sintered-copper wick heat pipe. Uniformity of particle size and sintering process were acted as dominant factors on the pore distribution and wick porosity, and small deviations of the wick thickness and the pore size greatly affected the heat transport limitations of the heat pipe. Especially, slight variations of the wick thickness, mean particle radius and capillary radius along the vapor temperatures and inclination angles remarkably changed the capillary limitation of the heat pipe.

• Proceedings of the KSME Conference
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• 2008.11b
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• pp.2357-2362
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• 2008

LHP is different from a conventional heat pipes in design and heat and fluid flow passages. The situations of the former is much complex than the latter. In LHPs, evaporation occurs at the contact interface between the heating plate and the porous wick, so some micro channels machined at the contact interface serve to let the vapor flow out of the evaporator. This complexity of contact geometry was known to cause a high resistance to heat flow. The present work was to study the problem of heat passage across the contact surface for LHPs and determine those values contact resistance. For two cases of contact structures, the thermal contact resistances were examined experimentally, one being obtained through mechanical contact under pressure and the other through sintered bonding. Nickel powder wick and copper plate were used for specimens. The result showed that a substantial reduction of contact resistance of an order of degree could be obtainable by sintered bonding.

• Journal of Mechanical Science and Technology
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• v.18 no.4
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• pp.681-688
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• 2004

For use of the thermal cycle of the biochemical fluid sample, the isothermal temperature source with a large surface area was designed, fabricated and its thermal characterization was experimentally evaluated. The comprehensive overview of the technology trend on the temperature control devices was detailed. The large surface area isothermal temperature source was realized by using the vapor chamber heat spreader. The cost-effectiveness and simple manufacturing process were achieved by using the metal-etched wick structure. The temperature distribution was quantitatively investigated by using IR temperature imaging system at equivalent temperatures to the PCR thermal cycle. The standard deviation was measured to be within 0.7$^{\circ}C$ for each temperature cycle. This concludes that the presented isothermal temperature source enables no temperature gradient inside bio-sample fluid. Furthermore it can be applied to the cooling of the electronic devices due to its slimness and low thermal spreading resistance.

• Proceedings of the SAREK Conference
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• 2006.06a
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• pp.339-345
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• 2006

This these was conducted to investigate tile characteristics of a frozen start up for a VCHP which has water as a working fluid and Nitrogen as a non-condensible gas. The tested heat pipe was made of a copper tube with the outer diameter of 12.7 mm, the length of 340 mm, and the sintered metal wick had the thickness of 0.7 mm. This experiment was conflicted under the thermal load, inclined angle and cooling conditions.

• Proceedings of the KSME Conference
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• 2004.11a
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• pp.1241-1246
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• 2004

The heat flux on a chip is rapidly increasing with decreasing the size of one. It is necessary to properly cool the high heat flux chip. One of the promising cooling methods is to apply CPL heat pipes with porous materials, for example PVA, polyethylene, and powder sintered metal plate and with microchannels in the evaporator. A small scale CPL heat pipe with PVA as wick was designed and manufactured. Since the height difference between the evaporator and the condenser is a crucial parameter in the CPL heat pipes, the performance of the heat pipes depending on the parameter was investigated. The parameter is higher the performance is better. However, the improvement rate of the performance does not increase the increase rate of the height. In addition to, the parameter effect depending on heat input was investigated.

• Proceedings of the KSME Conference
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• 2000.04b
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• pp.956-961
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• 2000

This paper describes the design of a small size Alkali Metal Thermal to Electric Converter (AMTEC) which employs a capillary structure for recirculating sodium working fluid. The cycle is based on the simple and small capillary type ${\beta}"$ -alumina and wick tube element. The proposed cell consists of the 37 conversion elements with capillary tube of $50{\mu}m$ in diameter and the sealed cylindrical vessel of 22mm in outer diameter. Results on the cycle analysis of sodium flow and heat transfer in the cell showed that the expected power output was 4.65W and the conversion efficiency was 19% for the source temperature of 900K.

• Proceedings of the SAREK Conference
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• 2003.07a
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• pp.64-64
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• 2003

• Proceedings of the SAREK Conference
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• 2003.07a
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• pp.65-65
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• 2003

• Proceedings of the SAREK Conference
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• 2004.06a
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• pp.154-154
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• 2004

• Proceedings of the KSME Conference
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• 2004.11a
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• pp.1058-1062
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• 2004

High-temperature cylindrical stainless steel/sodium heat pipe was manufactured and tested under long-term operation. The container material was stainless steel 316L and the working fluid was sodium. The heat pipe was 25.4 mm in diameter and 1000 mm in length with a two-layer screen mesh wick. The evaporator part was 600 mm and the condenser part was 300 mm in length. Total measurement points on heat pipe were 15 points and 12 points were located in condenser part. The heat pipe was heated for 142 days(3400 hours) at $800^{\circ}C$. In the test period, the maximum temperature difference was increased from $18^{\circ}C$ o $28^{\circ}C$ and the maximum thermal resistance was as low as $0.015^{\circ}CW$.